Taolo ea Thermal ea Koporo e Matla ea Koporo: Mekhoa ea ho Rala bakeng sa Likopo tse Matla a Phahameng

Selelekela

Li-PCB tsa koporo e boima li fetohile tsa bohlokoa haholo lisebelisoa tsa elektroniki tse nang le matla a maholo, moo bongata ba hona joale bo fetang seo liboto tsa potoloho tse tloaelehileng li ka se sebetsanang ka mokhoa o sireletsehileng. Liboto tsena tse ikhethileng li sebelisa mekhahlelo ea koporo ho tloha ho 3oz ho isa ho 20oz ka leoto le le leng, e leng se nolofalletsang bokhoni bo phahameng ba ho jara hona joale bakeng sa lits'ebetso tse kang li-drive tsa liindasteri, li-converter tsa matla a nchafatsoang, le litsamaiso tsa matla a likoloi.

Leha ho le joalo, ho felloa ke matla ho matla ho baka mathata a maholo a mocheso a amang ka kotloloho ho ts'epahala, nako ea bophelo ba ts'ebetso, le botsitso ba ts'ebetso. Sengoliloeng sena se hlahloba maqheka a bohlokoa a koporo a PCB a taolo ea mocheso a nolofalletsang meralo ho boloka ts'ebetso le ho tšoarella tlas'a maemo a boima.

Karolo ea Tsamaiso ea Mocheso ho Li-PCB tsa Koporo tse Boima

Mathata a Thermal Meralong e Matla a Phahameng

Ho qhalana ha mocheso ka har'a li-PCB tse boima tsa koporo ho hlahisa liphephetso tse ikhethang ha ho bapisoa le liboto tse tloaelehileng. Bongata ba motlakase bo baka tahlehelo e kholo ea I²R, ha li-semiconductor tsa motlakase li tsepamisa mocheso libakeng tse sebakeng seo, hangata li feta 100W/cm². Ntle le litsela tse lekaneng tsa mocheso, mocheso oa li-junction o nyoloha ka potlako, o potlakisa ho falla ha motlakase le ho senyeha ha thepa.

Melemo ea Ts'ebetso ea Thermal

Phapang ea mantlha lipakeng tsa mapolanka a koporo a tloaelehileng le a boima ke boima ba mocheso le bokhoni ba ho ata. Lifofane tse teteaneng tsa koporo li tsamaisa mocheso ka mokhoa o atlehileng haholoanyane libakeng tse ka morao, li theha libaka tse pharalletseng tsa kabo tse fokotsang sebopeho sa hotspot. Ts'ebetso ena e ntlafalitsoeng ea mocheso e ba ea bohlokoa ha lisebelisoa tse ngata tsa motlakase li sebetsa ka nako e le 'ngoe.

Moqapi oa Tsela ea Phallo ea Mocheso

Ho utloisisa tsela ea mocheso ho hlalosa moralo o atlehileng oa elektroniki oa PCB:

• Boemo ba karolo - Ho fetisoa ha mocheso ho tloha liphapanong tsa semiconductor ka lisebelisoa tse hoketsoeng ka har'a lifofane tsa koporo
• Boemo ba boto - Matla a mocheso a ata ka mahlakoreng ka likarolo tse boima tsa koporo le ho theosa ka tsela ea mocheso
• Boemo ba tsamaiso - Mocheso o tsamaea ka har'a substrate ho ea mecheng ea pholileng ea kantle kapa li-heatsink
• Ntlafatso ea sefahleho - Ntho e 'ngoe le e' ngoe ea ho hanyetsa ketane ena e tlameha ho fokotsoa ho thibela libotlolo tsa mocheso

Ho Utloisisa Botenya ba Koporo le Ts'ebetso ea Mocheso

Botenya ba Koporo vs. Thermal Conductivity

Botenya ba koporo bo ama ka ho toba bokhoni ba hona joale le ts'ebetso ea mocheso. Koporo e tloaelehileng ea 1oz (35μm) e fana ka conductivity ea motheo ea 400 W / m · K, ha koporo ea 4oz (140μm) e fana ka makhetlo a mane sebaka sa cross-sectional bakeng sa ho hasana ha mocheso. Tlhahlobo ea ho bapisa e bonts'a 2oz koporo e sebetsana le hoo e ka bang 3A ka mm bophara ho 10 ° C ho phahama ha mocheso, ha koporo ea 6oz e fetisetsa sena ho 6-7A tlas'a maemo a tšoanang.

Mehopolo ea Mocheso le Mechini

Boima ba koporo bo otlolohileng bo matlafatsa z-axis thermal conduction, haholo-holo ho bohlokoa bakeng sa ho fetisa mocheso ho tloha lisebelisoa tsa matla a holimo ho ea lifofaneng tse ka hare. Ka holim'a botenya ba 10oz, lipoelo tse fokotsehang li hlaha ha khanyetso ea mocheso oa substrate e ntse e ata. Ho feta moo, khatello ea maikutlo e tsoang ho katoloso ea mocheso e sa tsamaisaneng e eketseha ka boima ba koporo, e hlokang khetho e hlokolosi ea lisebelisoa ho thibela delamination kapa barrel ho phatloha ka har'a li-vias tse futhumetseng.

Moqapi oa Tsela ea Mocheso le Ka Ho Fetisisa bakeng sa Tsamaiso ea Thermal ea Koporo ea Koporo ea Boima

Thermal Via Array Configuration

Thermal ka li-arrays ka tlas'a likarolo tsa matla li theha litsela tsa bohlokoa tsa z-axis conduction. Litlhophiso tse nepahetseng li beha bophara ba 0.3-0.5mm ka li-vias tsa 0.8-1.2mm ka tlas'a lisebelisoa tse hlahisang mocheso. Via density e tlameha ho leka-lekanya ts'ebetso ea mocheso khahlano le lithibelo tsa tlhahiso le litlhoko tsa ponts'o ea matšoao.

Boenjiniere ba Tsela ea ho Hasa Mocheso

Mekhahlelo e mengata ea koporo e hokahantsoeng ka ho thekesela ka masimo e theha marang-rang a mocheso oa mahlakore a mararo. Mokhoa ona o arola mocheso o sebakeng sa heno libakeng tse pharalletseng tsa boto, e leng ho fokotsang mocheso o phahameng haholo. Likarolo tsa lifofane tsa motlakase li tlameha ho nahana ka litsela tse peli tsa ho khutla le litlhoko tsa ho hasana ha mocheso ho qoba ho theha lihlekehleke tse futhumetseng.

Copper Inlay le Mehaho e Kenyelitsoeng

Theknoloji ea tšepe ea koporo e kenya li-slugs tse teteaneng tsa koporo (tseo hangata li leng 1-3mm ka botenya) ka har'a likoti tsa PCB tse tsamaisoang, li theha litsela tse kholo tsa mocheso ho tloha libakeng tse holimo ho ea ho heatsinks kapa li-cores tsa tšepe. Mehaho ena e fokotsa ho hanyetsa mocheso ka 40-60% ha e bapisoa le maemo a tloaelehileng ka li-arrays, haholo-holo tse sebetsang hantle bakeng sa li-module tsa matla a matla a phahameng moo mefokolo ea sebaka se ka holimo e thibelang ho ata ho tloaelehileng.

Via Filling for Enhanced Conductivity

Ho tlatsa ka mocheso ka epoxy e tsamaisang motlakase kapa koporo ho felisa likheo tsa moea tse sitisang phetiso ea mocheso. Li-vias tse tlatsitsoeng li boetse li ntlafatsa ts'epo ka ho thibela ho kobeha ha solder nakong ea kopano le ho fokotsa coefficient ea ho se lumellane ha katoloso ea mocheso lipakeng tsa mealo ea boto.

Thermal Interface Materials le Conductive Substrates

Lisebelisoa tsa Motheo oa Ts'ebetso e Phahameng

Khetho ea lintho tse bonahalang e etsa qeto ea ho sebetsa hantle ha mocheso oa koporo ea PCB. Mefuta e fapaneng ea FR-4 e ntlafalitsoeng ka mocheso e kenyelletsa li-filler tsa ceramic tse fihlelang 1-3 W/m·K, ts'ebetso e imenang habeli ea FR-4 (0.3-0.4 W/m·K) ha e ntse e boloka melemo ea litšenyehelo le ts'ebetso ea meaho e mengata.

Metal Core PCB Integration

Li-PCB tsa tšepe tsa tšepe li sebelisa li-aluminium kapa li-bases tsa koporo tse nang le likarolo tsa ho itšehla thajana tsa dielectric, li finyella li-conductivities tsa mocheso oa 1.5-8 W / m·K ho itšetlehile ka botenya ba dielectric. Meaho ena e sebetsa hantle haholo lits'ebetsong tse hlokang litsela tse tobileng tsa mocheso ho chassis kapa litsamaiso tse pholileng tsa moea o qobelloang, leha litlhoko tsa ho itšehla thajana tsa motlakase li fokotsa palo ea lera le boima ba litsela.

Li-Ceramic Substrates bakeng sa Maemo a Feteletseng

Lisebelisoa tsa aluminium nitride li fana ka conductivity ea mocheso e fetang 170 W/m·K, ha alumina e fana ka hoo e ka bang 25 W/m·K. Lisebelisoa tsena li nolofalletsa meralo e boima ea koporo e sebetsang mochesong o feteletseng kapa e hlokang katoloso e fokolang ea mocheso (ho bapisa CTE le li-semiconductors), leha ho nahanoa ka litšenyehelo ho fokotsa lits'ebetso ho litsamaiso tsa bohlokoa tsa thomo.

Mehopolo ea Sebopeho le Sebopeho

Thermal Design Layout Principles

Leano la ho beha likarolo ka kotloloho le ama tekano ea mocheso ho li-PCB tse boima tsa koporo. Ho aba lisebelisoa tsa matla ho latela tlhahlobo ea mojaro oa mocheso ho thibela ho futhumala ha libaka. Ho boloka sebaka sa bonyane ba 5-8mm pakeng tsa likarolo tse phahameng tsa ho qhalana ho lumella libaka tse lekaneng tsa ho hasana tsa koporo ho sebetsa ka katleho.

Phethahatso ea Sebaka sa Phatlalatso ea Mocheso

Libaka tse inehetseng tsa ho tšela koporo ntle le lithibelo tsa ho tsamaisa li eketsa mocheso oa lateral:

• Libaka tse ka hare tsa lera - Lifofane tsa koporo tse tiileng tse boholo ho latela limmapa tsa ho felloa ke matla
• Ka khokahanyo - E teteaneng ka li-arrays e netefatsa pokello e ntle ea mocheso ho tloha likarolong tse ka holimo
• Thermal symmetry - Kabo e leka-lekaneng ea koporo e thibela ho loana ha boto nakong ea ts'ebetso
• Palo ea sebaka - Libaka tse hasaneng hangata li boholo ho 3-5 × sebaka sa karolo ea maoto

Multilayer Architecture for Heavy Copper PCB Thermal Management

Kabo ea koporo ea Symmetrical ka har'a mekotla e etsa hore ho be le litsela tse tšoanang tsa mocheso ha ho ntse ho boloka botsitso ba mochini. Litlhophiso tse feto-fetohang le lifofane tsa matla ka har'a liboto tse boima tsa koporo tse 6-10 li ntlafatsa marang-rang a futhumetseng ntle le ho senya botšepehi ba matšoao. Karolo e 'ngoe le e' ngoe e eketsehileng ea koporo e kenya letsoho ho eketsa matla a mocheso, ka phaello e nepahetseng e fumanoang ka meralo ea 6-8.

Mekhoa ea Tlhahiso bakeng sa Ts'ebetso e Ntlafetseng ea Thermal

Mekhoa ea ho Plating ea Koporo e Matla

Precision electroplating e haha ​​​​botenya ba koporo bo lekanang holim'a marang-rang le libarele tsa lesoba. Taolo ea hona joale ea sets'oants'o nakong ea plating e etsa qeto ea sebopeho sa lijo-thollo tsa koporo le sephetho sa conductivity ea mocheso. Mehato e mengata ea plating e finyella mamello e boima ea koporo ea PCB ka har'a ± 10% phapang ea botenya ho pholletsa le liphanele.

Mekhoa e tsoetseng pele ea ho etsa

Mekhoa ea ho roala mehato e theha boima bo fapaneng ba koporo libakeng tse fapaneng tsa boto, e ntlafatsa ts'ebetso ea mocheso moo ho hlokahalang ha e ntse e fokotsa litšenyehelo tsa thepa libakeng tse ling. Etching e fapaneng e lefella botenya bo eketsehileng ba koporo nakong ea sebopeho sa mohlala, ho boloka ho nepahala ha geometry ka har'a ± 0.05mm bakeng sa litsela tsa bohlokoa tsa mocheso.

Embedded Copper Integration

Ho kenya chelete ea tšepe ea koporo ho hloka hore ho be le ho siloa ka mokhoa o nepahetseng (ka tloaelo ho ± 0.1mm mamello) le ho tlamahanngoa ha khatello ho felisa likheo tsa moea libakeng tsa mocheso. Plating e latelang e tlatsa likheo lipakeng tsa meaho e kentsoeng le likarolo tse pota-potileng tsa koporo, ho theha litsela tse tsoelang pele tsa mocheso. Boleng ba tlhahiso ka ho toba bo etsa qeto ea ho hanyetsa sebopeho le ho tšepahala ha nako e telele ea mocheso oa libaesekele.

Maikutlo a Tšebeliso

Lisebelisoa tsa PCB tsa Module oa Matla

Balaoli ba makoloi a indasteri le li-inverters tse nchafalitsoeng li sebelisa taolo e matla ea koporo ho boloka ts'ebetso e tsoelang pele ho maqhubu a 150-200A. Meralo ea li-kilowatt tse ngata e kopanya li-inlay tsa koporo le ho pholisoa ka likhoka tse qobelloang, ho fihlela mocheso oa mateano o ka tlase ho 125°C tlas'a maemo a tletseng moroalo ho pholletsa le mocheso o potolohileng ho fihla ho 85°C.

Motlakase oa Motlakase oa Likoloi

Li-inverters tsa likoloi tsa motlakase li hloka li-PCB tse boima tsa koporo tse laolang maqhubu a libese a 400-800V le maqhubu a 300-600A. Meralo ea mocheso e kopanya likarolo tsa koporo tse 8-12oz tse nang le likhokahano tse pholileng tsa mokelikeli, tse tšehetsang matla a matla a fetang 50kW boto ka 'ngoe ha li ntse li kopana le maemo a ts'epahalo a koloi ho feta lilemo tse 15 tsa ts'ebetso le ho palama baesekele ho tloha -40 ° C ho ea +125 ° C.

Lisebelisoa tsa puisano

Li-amplifiers tsa motlakase tsa setsi sa telecom li sebelisa liboto tse boima tsa koporo tse senyang 200-500W ho pholletsa le lintlha tsa compact form. Metal core substrates e nang le li-vias tse kentsoeng tsa mocheso li fetisetsa mocheso ho lipoleiti tse pholileng tse kentsoeng ka chassis, li boloka botsitso ba ts'ebetso ea RF le bokhabane ho pholletsa le -40 ° C ho isa +85 ° C.

fihlela qeto e

Tsamaiso ea mocheso e matla ea koporo ea PCB e hloka mekhoa e kopanetsoeng e sebetsanang le khetho ea thepa, kabo ea boima ba koporo, ka meaho, le ho ntlafatsa tsela ea ho hasana mocheso. Meetso e fokotsang khanyetso ea mocheso ho tloha mateanong ho ea ho ambient e etsa hore ho be le ts'ebetso e tšepahalang ea litsamaiso tsa elektroniki tse ntseng li le matla le ho feta. Ha matla a motlakase a ntse a eketseha ho pholletsa le lits'ebetso tsa indasteri, tsa likoloi le tsa meaho, boenjiniere ba mocheso bo fetoha bo sa arohaneng le moralo oa motlakase ho fihlela lipehelo tsa ts'ebetso le litlhoko tsa ts'epahalo.

Matla a Tsamaiso ea Mocheso oa Highleap Electronics

Highleap Electronics e ikhethile ka ho khetheha tlhahisong ea PCB ea koporo e boima ka ho nepahala ka tšehetso e felletseng ea ntlafatso ea mocheso:

• Moetso o boima oa koporo - Bokhoni ba tlhahiso ho tloha ho 3oz ho isa ho 20oz boima ba koporo ka ± 10% taolo ea botenya
• Mehaho e tsoetseng pele ea mocheso - Thermal ka li-arrays, lichelete tsa tšepe tse kentsoeng tsa koporo le meaho ea mantlha ea tšepe e nyalisitsoeng
• Tsebo ea lintho tse bonahalang - FR-4 e ntlafalitsoeng ka mocheso, li-substrates tsa aluminium / koporo, le likhetho tsa motheo tsa ceramic
• Tšehetso ea boenjiniere - Thuso ea papiso ea mocheso le likhothaletso tsa ntlafatso ea moralo bakeng sa lisebelisoa tsa elektroniki
• Netefaletso ea boleng - Teko ea libaesekele tse futhumatsang le netefatso ea ho hanyetsa mocheso bakeng sa lits'ebetso tsa bohlokoa

Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka hore na bokgoni ba rona ba taolo ya mocheso wa PCB ya koporo e boima bo ka ntlafatsa botshepehi le tshebetso jwang morerong wa hao o latelang wa matla a maholo.