Tlhahiso ea PCB ea Seva ea HPC bakeng sa Li-OEM tsa Khoebo le tsa HPC

Highleap Electronics e etsa tlhahiso ea PCB ea seva ea HPC ho latela meralo e fanoeng ke bareki kapa lifaele tsa Gerber bakeng sa li-OEM tsa k'homphieutha tse sebetsang hantle, lilaboratori tsa naha, litsi tsa supercomputer tsa univesithi, le barekisi ba sistimi ea Tier-1 HPC. Re etsa li-PCB ho latela litlhaloso tsa bareki, ho kenyeletsoa le li-mainboard tsa li-node tsa compute (li-dual-le quad-socket Xeon Max, EPYC HPC, A64FX, NVIDIA Grace/Grace Hopper carriers), likarete tsa khokahano tsa InfiniBand HDR/NDR le Slingshot/Omni-Path, li-cold-plate carriers tse pholileng ka metsi, li-node tsa polokelo le tsa ho kena, li-power-level rack-level power and management boards, le li-integration carriers tsa HBM-host.

Tafole ea likateng

1. Seo Li-OEM tsa HPC li se Hlokang ho Moetsi oa PCB (khahlanong le Koetliso ea AI)
2. Tlhahiso ea Boto e Kholo ea Khoutu ea Compute — Xeon Max, EPYC HPC, ARM HPC
3. Tlhahiso ea Boto ea Bajari ea Sehlopha sa HBM-Host le Grace Hopper
4. Tlhahiso ea Likarete tsa InfiniBand HDR/NDR HCA le Interconnect
5. Ho Pholisa Metsi ka ho Otloloha — Li-Carriers tsa Cold Plate, CDU le Manifold Boards
6. Sistimi e nyenyane ea Memori — Phano ea Matla ea DDR5, CXL, le HBM
7. Sebaka sa Polokelo, Sebaka sa ho Kena le Liboto tsa Tsamaiso ea Lihlopha
8. Boleng, Litšoaneleho tsa AVL le Tšehetso ea Lenaneo la Bophelo bo Bolelele
9. Ho Kopanya Highleap ho Hahoeng ha Sehlopha sa Hao sa HPC

1. Seo Li-OEM tsa HPC li se Hlokang ho Moetsi oa PCB (khahlanong le Koetliso ea AI)

Mananeo a seva sa HPC le mananeo a koetliso ea AI a shebahala a tšoana ho tloha hole - ka bobeli a haha ​​​​hardware e teteaneng ea komporo e nang le khokahano e phahameng ea bandwidth, ka bobeli a sebelisa ho pholisa metsi ka tekanyo, ka bobeli a shebane le palo e nyane ea bareki ba boleng bo holimo. Liphapang li hlaha kemisong ea nako ea lenaneo, ho tiea ha litšoaneleho, le litebello tsa potoloho ea bophelo. Bokhoni ba rona ba tlhahiso ea PCB ea k'homphieutha bo sebetsang hantle bo akaretsa meaho ea ho kopana ha AI/HPC le lihlopha tsa HPC tse teteaneng tsa CPU.

Liphapang tsa potoloho ea theko ea HPC

• Nako ea theko: Likonteraka tsa sistimi ea HPC li sebetsa lilemo tse 2-4 ho tloha ho RFP ho isa ho amoheloeng ha sistimi; mananeo a lisebelisoa tsa AI a sebetsa likhoeli tse 12-18.
• Ho tiea ha mangolo: Li-laboratori tsa naha le litsi tsa HPC tsa univesithi hangata li hloka liteko tsa kamohelo ea semmuso ho kenyeletsoa le lisampole tsa netefatso ea boemo ba PCB; mananeo a mangata a lisebelisoa tsa AI a amohela phallo ea AVL ea setaele sa hyperscaler ka mokhoa o fokolang.
• Ho tsepamisa maikutlo ho bareki: 'Maraka oa HPC o shebane haholo - lilaboratori tsa DOE, liunivesithi tse kholo, libaka tse thathamisitsoeng ho Top500 - 'me likamano tsa bareki li nka lilemo tse mashome. Lisebelisoa tsa AI li hasane haholo ka li-hyperscalers, mananeo a AI a ikemetseng, le bareki ba AI ba likhoebo ho barekisi ba bangata.
• Potoloho ea bophelo ba ts'ehetso: Mekhoa ea HPC e atisa ho sebetsa lilemo tse 7-10; lisebelisoa tsa koetliso ea AI li nchafatsoa lilemo tse ling le tse ling tse 2-3.

Litlhoko tsa boenjiniere ba HPC tse fapaneng le koetliso ea AI

• Meralo e laolang CPU e ntse e le teng: Leha ho kopana ha AI/HPC e le ntho ea sebele, mesebetsi e mengata ea HPC (CFD, MD, climate modelling) e ntse e le ea CPU e ngata; li-compute node li na le li-socket tsa CPU tse 4-8 tse nang le palo e phahameng ka ho fetisisa ea liteishene tsa DDR5.
• Bokhoni ba memori khahlanong le tekanyo ea bandwidth: Mesebetsi ea HPC hangata e hloka ka bobeli — 4 TB+ ka node e nang le bandwidth e phahameng ha se ntho e sa tloaelehang; katoloso ea CXL e ntse e le ea bohlokoa le ho feta.
• Khatiso ea ts'ebetso ea vector: AVX-512, SVE2, le li-ISA tse tšoanang tsa vector li khanna litlhoko tse ikhethileng tsa ho tsamaisa le ho fana ka motlakase bakeng sa mesebetsi e tsitsitseng ea vector.
• Ho kopana ha marang-rang/polokelo: InfiniBand e nang le RDMA bakeng sa khokahano le polokelo; netweke e le 'ngoe ho fapana le marangrang a arohaneng a k'homphieutha le polokelo.
• Sebaka sa polokelo se nang le buffer e phatlohileng le e nang le maemo a holimo: li-node tse inehetseng tsa burst-buffer tse nang le ts'ehetso e phahameng ea NVMe le DAOS/Lustre/GPFS; liboto tse khethehileng tsa polokelo.

Litlhoko tsa lehlakore la theko ea HPC

• Likarabo tsa semmuso tsa RFP: litlhahiso tse qaqileng tse tsamaellanang le litlhoko tsa tekheniki le tsa khoebo tsa bareki.
• Tšehetso ea kamohelo ea sistimi: liboto tsa mehlala le litokomane tse felletseng bakeng sa tlhahlobo ea kamohelo ea bareki.
• Boitlamo ba ts'ireletso: Boitlamo ba ho fumaneha ha likarolo tse ling tsa spare tsa lilemo tse 7-10 le tsamaiso ea EOL e tlalehiloeng.
• Tlhahlobo le ho sala morao: Mananeo a mang a laboratori ea naha le a haufi le tšireletso a hloka litsela tse felletseng tsa tlhahlobo ea ketane ea phepelo.
• Litokomane tsa naha eo u tsoang ho eona: Reka Amerika, Reka litlhoko tsa phepelo tsa Europe, le tsa mmuso moo ho hlokahalang.

2. Tlhahiso ea Boto e Kholo ea Khoutu ea Compute — Xeon Max, EPYC HPC, ARM HPC

Liboto tse kholo tsa li-node tsa HPC li tiisa sehlopha se seng le se seng. Tlhahiso ea sethala sa hajoale ke li-CPU tse nang le HBM le li-hybrid tsa accelerator-CPU; re haha ​​​​liboto tse kholo bakeng sa sebaka se felletseng.

Liboto tse kholo tsa Intel Xeon Max (Sapphire Rapids HBM) le Granite Rapids HPC

• Xeon Max: 64 GB HBM2e e ka har'a sephutheloana haufi le liteishene tse fihlang ho tse 8 tsa DDR5 ka sokete; matla a bohlokoa le boima ba mocheso.
• Palo ea lera: hangata ho na le mekhahlelo e 16-22 holim'a li-mainboard tsa Xeon Max tse nang le li-socket tse peli — tsa rona tlhahiso ea PCB ea multilayer mola o tshehetsa diboto tse kgolo tsa HPC ho tloha ho di-layer tse 12 ho ya ho di-configurations tsa di-dual-controller tse nang le di-layer tse 32+.
• Ho rarahana ha tsela: Likanale tse 8 tsa DDR5 ka sokete × likanale tse 2 = likanale tse 16 tsa ho tsamaisa DDR5 ho phaella ho lihokelo tsa PCIe Gen5 le li-inter-socket UPI.
• Tsela ea ho fetisetsa lihokelo tsa UPI: UPI ea lihokelo tse 4 kapa lihokelo tse 6 lipakeng tsa li-socket; litlhoko tse tiileng tsa botšepehi ba lets'oao tse tšoanang le PCIe Gen5.
• Phano ea motlakase: 350-400W TDP ka sokete; sebaka se teteaneng sa VRM se nang le kabo ea matla a tlase a impedance.
• lintho tse bonahalang: I-Tera MT40 hodima di-level tsa UPI le PCIe Gen5; FR408HR hodima di-level tsa DDR5; 370HR bakeng sa di-level tsa motlakase.

AMD EPYC HPC (Genoa-X, Bergamo, Turin) liboto tse kholo

• EPYC Genoa-X: Li-core tse 96 tse nang le cache ea 1 GB L3 (3D V-Cache); Likanale tse 12 tsa DDR5 ka sokete.
• EPYC Turin: moloko o latelang; ho fihlela ho li-core tse 192 ka sokete.
• Palo ea lera: Mealo e 18-24 e tloaelehileng bakeng sa liboto tse kholo tsa EPYC HPC tse nang le masokete a mabeli ka lebaka la palo e phahameng ea liteishene tsa DDR5.
• Lihokelo tsa li-socket tsa Infinity Fabric: tsela e teteaneng e potlakileng pakeng tsa li-socket; litlhoko tse tšoanang tsa PCB le UPI.
• Palo ea litsela tsa PCIe Gen5: Litsela tse 128 ka sokete = litsela tse 256 ka sistimi ea li-socket tse peli; bongata bo boholo ba litsela le pele ho nahanoa ka DDR5.

Liboto tse kholo tsa Fujitsu A64FX le ARM HPC

• A64FX: Li-core tse 48 tse nang le 32 GB HBM2 ka har'a sephutheloana; ARMv8.2-A SVE; sistimi ea Fugaku exascale e tsamaisoang ke motlakase.
• NVIDIA Mohau: 72-core ARM Neoverse V2 e nang le 480-960 GB LPDDR5X; e reretsoeng ho hlahloba HPC, AI, le data.
• Ampere Altra Max le AmpereOne: Li-CPU tsa seva sa ARM tse sebelisoang ka kakaretso li sebelisoa haholoanyane ho HPC.
• Palo ea mekhahlelo le ho rarahana: tse tshwanang le diboto tse kgolo tsa x86 HPC; Diboto tse kgolo tsa Grace tse hlomelletsweng ka LPDDR5X di na le tsela e ikgethang ka lebaka la memori e soldered ho ena le di-slots tsa DIMM.

Liboto tse kholo tsa mafura tse nang le masokete a mane le masokete a robeli

• Sebelisa nyeoe: polokelo ea data e ka hare ho memori, li-simulation tsa memori e arolelanoang ka bongata, mesebetsi e khethehileng ea HPC e sa lumellaneng hantle le memori e arolelanoang.
• Palo ea lera: Mealo e 22-28 ka lebaka la ho rarahana ha khokahano ea sokete.
• Lesela le kopanyang li-socket: UPI kapa Infinity Fabric e sa hahe hantle ka hodima di-socket tse 4; meralo e meng ya di-socket tse 4 e sebedisa topology ya lesale, e meng e sebedisa topology e fetotsweng.
• Bokgoni ba memori: 8-16 TB ka node e tloaelehileng; matlo a bohlokoa a DIMM botong.

3. Tlhahiso ea Boto ea Bajari ea HBM-Host le Grace Hopper-Class

CPU e nang le HBM ke e 'ngoe ea meralo e hlalosang ea processor ea HPC ea moloko ona. Hore na HBM e sepaketeng (Xeon Max, A64FX) kapa e hokahantsoe ka khokahanyo ea chip-to-chip (Grace Hopper Superchip), PCB ea moamoheli e na le litlhoko tse ikhethileng tsa phano ea motlakase, tsamaiso ea mocheso, le lipontšo tse fapaneng le liboto tse kholo tse seng tsa HBM.

Tlhahiso ea thepa ea Grace Hopper Superchip

• Mekhoa ea ho haha: NVIDIA Grace ARM CPU + Hopper GPU e hokahantsoe ka NVLink C2C (chip-to-chip); NVLink e kopaneng ea 900 GB/s pakeng tsa CPU le GPU.
• Kaho ea boto ea mojari: hangata likarolo tse 18-24.
• Tsela ea NVLink C2C: lesela le lekgutshwane, le potlakileng le kopaneng pakeng tsa di-chip tse pedi hodima carrier e le nngwe; ditlhoko tse tiileng ka ho fetisisa tsa boto ya ho tshepahala ha letshwao.
• HBM3 (ka Hopper dies): ha e tsamaisetswe ho PCB empa e tshehetswa ke phepelo e kgolo ya motlakase ho sephutheloana sa Hopper die.
• LPDDR5X (E hoketsoe ka Mohau): e rekisetsoa holim'a sesebelisoa haufi le chip ea Grace; LPDDR5X e tsamaisa ka sekhahla se phahameng sa data.
• lintho tse bonahalang: Tachyon 100G kapa Megtron 7 bakeng sa NVLink C2C; I-Tera MT40 bakeng sa moamoheli oa PCIe Gen5; FR408HR bakeng sa LPDDR5X.

Phano ea motlakase bakeng sa li-CPU tse nang le HBM

• Currents: Li-CPU tse nang le HBM li hula 400-500W TDP tlas'a mosebetsi o tsitsitseng oa vector; maqhubu a tsitsitseng a 500-800A lireleng tsa mantlha.
• Sebaka sa VRM: Li-VRM tsa motlakase o phahameng tse nang le sebaka sa ho jara ka tlas'a kapa haufi le sephutheloana sa CPU.
• Koporo ea sefofane: Koporo ea 2-3 oz holim'a lifofane tsa motlakase tsa mantlha; meralo e meng e sebelisa 4 oz holim'a literene tse khethehileng tsa motlakase o phahameng.
• Ho arola bongata ba capacitor: li-capacitor tse makholo ka sokete e le 'ngoe li ajoa ho pholletsa le sehlopha sa tsamaiso ea phepelo ea motlakase.
• Impedance ea sefofane: moralo oa sefofane se nang le impedance e tlase se netefalitsoeng ke ketsiso ea botšepehi ba matla mohatong oa moralo; tlhahiso ea PCB e tlameha ho fihlela stackup e etselitsoeng mohlala ka nepo.

Mehopolo ea tlhahiso ea liphutheloana tsa HBM

Liphutheloana tsa CPU tse nang le HBM li kholo 'meleng ebile li boima ka mechine. PCB e ka tlas'a tsona e tlameha ho tšehetsa sephutheloana ka mechine (tlas'a matla a ho khomarela a batang kapa ho boloka sokete), ka mocheso (ho fetisetsa mocheso ho tloha ka morao ho sephutheloana le ho tsoa ho li-VRM), le ka motlakase (ho fana ka li-ampere tse makholo ka li-vias tsa motlakase tlas'a sephutheloana). Ho mamella li-tooling-lesoba, likarolo tsa matlafatso ea mechini, le moralo oa via-array tlas'a sephutheloana kaofela li bohlokoa bakeng sa tlhahiso ea PCB ea HBM-host ka litsela tseo e seng tsa tsona bakeng sa li-mainboard tsa CPU tse tloaelehileng.

4. Tlhahiso ea Likarete tsa InfiniBand HDR/NDR HCA le Interconnect

Khokahano ea HPC e khanna ts'ebetso ea boemo ba sistimi ho feta karolo efe kapa efe e 'ngoe. InfiniBand e laola 'maraka oa HPC oa maemo a holimo ka lihlahisoa tsa HDR (200 Gbps) le NDR (400 Gbps); HPE Slingshot (eo qalong e neng e le Cray) le Intel Omni-Path ke mekhoa e meng litsamaisong tse ikhethileng tsa Top500.

Tlhahiso ea boto ea bajari ea InfiniBand HDR HCA

• Chip ea adaptara: NVIDIA ConnectX-6 (HDR) kapa ConnectX-7 (HDR/NDR).
• Palo ea kou: Likarete tsa HDR tsa kou e le 'ngoe kapa tsa kou e habeli li tloaelehile.
• Sebopeho sa moamoheli sa PCIe Gen4: Litsela tse 16 tsa Gen4 ho amohela CPU; li-host tse ling tsa Gen5 li sebelisa karete e tšoanang.
• Khokahano ea marang-rang: Sehokelo sa QSFP56 bakeng sa ho kenya dithapo tsa HDR.
• Palo ea lera: Mealo e 14-18 ho li-HCA tsa HDR tse nang le likou tse peli.
• lintho tse bonahalang: I-Tera MT40 bakeng sa PCIe le ho tsamaisa marang-rang; 370HR bakeng sa motlakase le fatše.

Tlhahiso ea boto ea bajari ea InfiniBand NDR HCA

• Chip ea adaptara: NVIDIA ConnectX-7 NDR e nang le bokgoni ba 400 Gbps.
• Sebopeho sa moamoheli sa PCIe Gen5: Litsela tse 16 Gen5; ho phunya mokokotlo e tlamang ho li-via tse lehlakoreng la moamoheli.
• Khokahano ea marang-rang: Sehokelo sa OSFP bakeng sa likhoele tsa NDR.
• Palo ea lera: Mealo e 16-20 ka lebaka la ho pharalla ha tsela ka lebelo le phahameng.
• lintho tse bonahalang: Tachyon 100G kapa Megtron 7 marangrang a bohlokoa a NDR le mekhahlelo ea matšoao a moamoheli oa Gen5.
• Litlhahiso tse lefelloang: ho qala ho tsamaellanang le impedance ka nepo sehokelong sa PCIe edge le cage ya OSFP.

Tlhahiso ea HPE Slingshot le Omni-Path HCA

• Letjeketjane: Ho hokela ha 200 Gbps ho disistimi tsa Cray/HPE EX-class (Frontier, El Capitan); E tsamaisana le Ethernet lera la mmele ka taolo ya ho thibana ho ikgethang ka HPC.
• Tsela ea Omni: Khokahano ea Intel ea 100 Gbps; ke ea khale empa e ntse e hlahisoa lihlopheng tse itseng tsa lihlopha.
• Kaho ea karete ea HCA: tse tshwanang le InfiniBand HCAs; moamoheli wa PCIe Gen4, sebopeho sa netweke se ikgethileng.

Tlhahiso ea likarete tsa line ea switch ea InfiniBand

• Phetoho ea NVIDIA Quantum-2 NDR: Likou tse 64 × 400G kapa likou tse 32 × 800G ka switch chip.
• Palo ea lera la karete ea Switch Line: Mealo e 28-32.
• Sekhahla sa tsela: lipara tse makholo tse fapaneng ho tloha ho switch ASIC ho ea ho lihoko tsa OSFP.
• lintho tse bonahalang: Tachyon 100G ho pholletsa le mekhahlelo ea matšoao.
• Phano ea motlakase: 800-1200W ka switch chip; moralo o teteaneng oa VRM le koporo e matla ea sefofane.

5. Ho Pholisetsa Metsi ka ho Otloloha — Li-Carriers tsa Cold Plate, CDU le Manifold Boards

Mekhoa ea sejoale-joale ea HPC e pholisitsoe haholo-holo ka metsi a qhibilihisitsoeng ka kotloloho soketeng ea CPU. Mekhoa ea naha ea laboratori ea exascale e sutumelletsa sena pele ka ho pholisetsa metsi a futhumetseng ho nolofalletsang ho pholisetsa ntle ho tefo selemo ho pota. Moralo oa PCB bakeng sa HPC e pholisitsoeng ka metsi o se o holile empa o ntse o hloka boenjiniere le tlhahiso e hlokolosi.

Tlhahiso ea boto ea bajari ba poleiti e batang

• Ho lokisa maemo ka mechine: masoba a lisebelisoa tse nepahetseng bakeng sa ho hokahanya poleiti e batang ka mamello ea boemo ba ± 0.10 mm.
• Boto e bataletseng: ± 0.15 mm coplanarity ho pholletsa le CPU footprint ho netefatsa hore ho kopana ha cold-plate ho tšoana.
• Lithibelo tsa bophahamo ba likarolo: dikarolo tse ka tlasa poleiti e batang ha di a lokela ho feta botebo ba ho fokotsa mocheso wa poleiti e batang; tshebedisano e tiileng ya DFM le morekisi wa poleiti e batang.
• Matlafatso ea ho hloa: dijari tsa boto kapa di-stiffener di tshehetsa matla a ho tlama; moralo wa PCB o dumella sebopeho sa jari.

Tlhahiso ea boto ea taolo ea CDU (setsi sa kabo ea pholileng)

• mosebetsi: laola phallo ea setsidifatsi sa boemo ba rack, litlhophiso tsa mocheso, taolo ea pompo, ho lemoha ho dutla ha metsi, lialamo.
• Mekhoa ea ho haha: hangata ARM SBC e kentsweng ka I/O ya indasteri (disensor tsa phallo ya 4-20 mA, di-input tsa mocheso wa RTD, di-driver tsa di-valve).
• Palo ea lera: Mealo e 6-8; e tsoakiloeng ka analog/digital ka karohano e loketseng.
• lintho tse bonahalang: high-Tg FR4 (Isola 370HR) bakeng sa ts'epo ea indasteri.
• Sehlopha sa IPC: Kamohelo ea Sehlopha sa 3 bakeng sa likarolo tsa bohlokoa tsa mokhoa oa ho hloleha.

Tlhahiso ea boto ea sensor e nang le melumo e mengata

• Kutlo e ajoang: sekgahla sa phallo, mocheso, kgatello dintlheng tse ngata tse ngata.
• Sebopeho se senyenyane: hangata 60 × 40 mm ka lihokelo tsa indasteri tsa M12.
• Conformal coating: Tekanyetso ea sekoahelo sa AR kapa UR bakeng sa tšireletso ea mongobo.
• Phetoho e se nang loto: Ts'ebetso e tloaelehileng ea SAC305 e lumellana le lisebelisoa tsohle tse boletsoeng.

Ho lemoha ho dutla le ho rotha ha diboto tsa pane

• Li-sensor tsa ho dutla tse nang le bokhoni: e ajoa tlas'a lipoleiti tse batang le libakeng tse ka bang teng tsa ho lutla.
• Lisebelisoa tsa elektroniki tsa pane ea ho rotha: ho beha leihlo metsi ka ho supa alamo ho rack BMC.
• tšepahala: sekgahla sa bohata se nang le positive se bohlokwa (dialamo tsa bohata di tima komporo); sekgahla sa bohata se nang le positive se bohlokwa hape (ho fosahetse ho dutla ha disebediswa ho senya).

6. Sistimi e nyenyane ea Memori — Phano ea Matla ea DDR5, CXL, le HBM

Litlhoko tsa memori ea mosebetsi oa HPC li susumetsa likhetho tse ikhethileng tsa tlhahiso ea PCB bakeng sa ho tsamaisa DDR5, katoloso ea memori ea CXL, le phano ea matla ea HBM ho mofani oa thepa.

Tsela ea DDR5 bakeng sa liboto tse kholo tsa HPC

• Palo ea kanale: Likanale tse 8 ka sokete (Intel Xeon Max), likanale tse 12 ka sokete (AMD Genoa-X).
• Sekhahla sa data: DDR5-4800 ho isa ho DDR5-6400 ho latela sethala; e ntse e eketseha ka moloko o mong le o mong.
• Ho se mamellehe: 40Ω tekanyetso e le 'ngoe ea ±10%; ±7% e ka finyelloa.
• Ho bapisa bolelele: ka hare ho baiti ±2 mil; mamello ea baiti ho baiti e fapana ho latela lebelo.
• Khetho ea thepa: FR408HR bakeng sa dikanale tse kgutshwane; I-Tera MT40 bakeng sa dikanale tse telele kapa sekgahla se hodimo sa data; 370HR e a amoheleha ha ho sebediswa sekgahla se kgutshwane sa sekgahla se tlase.
• Khalase e lohiloeng: Khalase ea 1080 kapa 2113 holim'a mekhahlelo ea matšoao bakeng sa DDR5 ea sekgahla se phahameng.

Tlhahiso ea katoloso ea memori ea CXL

• Sehokelo sa CXL 2.0: PCIe Gen5 PHY; Li-expander tsa memori tsa CXL li hokeloa ka li-slots tsa PCIe kapa lihokelo tse khethehileng tsa CXL.
• Nyeoe ea tšebeliso ea HPC: ho kopanya memori ho holisa memori e sebetsang ka node ka nqane ho bokgoni ba DIMM; e bohlokoa haholo bakeng sa tlhahlobo ea memori, li-simulation tsa gridi e kholo, le mesebetsi ea ho kopana ha AI/HPC.
• Tlhokahalo ea tlhahiso: Ho nepahala ha sehlopha sa Gen5 hodima impedance ya differential para le ho tjheka ka morao.
• Meaho ea backplane: Ho fetola CXL ho hlahisa sehlopha se secha sa liboto tsa backplane le switch litsamaisong tsa HPC.

Phano ea motlakase ea HBM ho lijari tsa CPU tse nang le HBM

Leha di-stack tsa HBM di kentswe ka hara sephutheloana ho dihlahiswa tsa Xeon Max, A64FX, le Hopper GPU, PCB ya moamoheli e tlameha ho fana ka motlakase o mongata ho tshehetsa die ya moamoheli le di-stack tsa HBM. Difofane tsa motlakase di tlameha ho sebetsana le maqhubu a tla feta dikgopolo tsa moralo wa CPU, ka ho ba le matla a lekaneng ka dipaterone tlasa sephutheloana ho fokotsa ho theoha ha motlakase. Ketsiso ya matla-botshepehi nakong ya moralo ha e kgone ho buisanwa; tlhahiso ya PCB e tlameha ho fihlella stackup e etsisitsweng ka mamello ya botenya ba dielectric ya ±5% ho boloka tshebetso e etsisitsweng, mme taolo ya impedance hodima dipara tsohle tsa bohlokwa tsa dipharologanyo tsa Gen5 e a hlokahala nakong yohle ya kaho.

7. Node ea Polokelo, Node ea ho Kena le Liboto tsa Tsamaiso ea Lihlopha

Sehlopha sa HPC se na le mefuta e mengata ea boto ka ntle ho li-node tsa k'homphieutha. Liboto tsa meralo ea motheo ea polokelo, ho kena le tsamaiso ke mananeo a manyane ka bongata empa a bohlokoa bakeng sa ts'epo ea sistimi.

Tlhahiso ea li-node tsa polokelo

• Li-server tsa polokelo tsa Lustre/GPFS: Liboto tse kholo tsa Xeon kapa EPYC tse nang le li-socket tse peli tse nang le li-backplane tsa polokelo ea NVMe le SAS tse nang le bongata bo boholo.
• Lifolete tsa polokelo tsa NVMe: Lifofane tsa morao tsa U.2/U.3 tse feto-fetohang ka ho chesang tse nang le PCIe Gen4/Gen5 tse fetisetsang ho balaoli ba polokelo.
• Libaka tsa polokelo tsa DAOS: polokelo e thehiloeng memoring e sa khaotseng bakeng sa maemo a polokelo ea HPC ea moloko o latelang; backplane e ikhethileng ea NVMe le kopanyo ea mojule oa PMEM.
• Li-node tsa buffer tse phatlohang: li-server tsa NVMe tse nang le bongata bo phahameng tse sebetsang e le boemo ba ho potlakisa ba I/O lipakeng tsa li-node tsa komporo le sistimi ea lifaele e bapileng.

Sebaka sa ho kena le tlhahiso ea seva ea tsamaiso

• Liboto tse kholo tsa node ea ho kena: diboto tse kgolo tsa seva tse nang le merero e akaretsang (sokete e le nngwe kapa e mmedi) tse tshehetsang khetla ya mosebedisi le tlhahiso ya mosebetsi; ha se bohlokwa-bohlokwa ba tshebetso, empa botshepehi-bohlokwa.
• Li-server tsa tsamaiso: bahlophisi ba sehlopha (Slurm, LSF, PBS Pro); li-server tsa database bakeng sa boikarabello le tlhokomelo.
• Mekhoa e tloaelehileng ea PCB ea seva: boholo ba thepa e nang le tahlehelo e mahareng; li-stackup tse ntlafalitsoeng ka litšenyehelo.

Liboto tsa switch tsa top-of-rack le tsa tsamaiso

• Li-switch tse 1 tsa taolo ea GbE: tsamaiso e arohaneng marangrang a Ethernet a arotsweng ho lesela la data.
• Li-switch tsa netweke ea tšebeletso ea 10/25 GbE: bakeng sa phihlello ea polokelo le sephethephethe sa taolo.
• Tsamaiso ea kantle ho sehlopha: di-concentrator tsa serial console, diheke tsa IPMI/Redfish.

Matla le meralo ea motheo ea boemo ba rake

• Liboto tsa shelefo ea motlakase tsa 48V: kabo ea matla a bohareng e tšoanang le meralo ea liraka tsa koetliso ea AI.
• Liboto tse kholo tsa BMC tse ka rackeng: taolo ea boemo ba rack ea k'homphieutha, polokelo, marang-rang, le pholiso.
• Liboto tsa sensor tsa tikoloho: mocheso, mongobo, ho thothomela, tlhokomelo ea ho kenella.

8. Boleng, Litšoaneleho tsa AVL le Tšehetso ea Lenaneo la Bophelo bo Bolelele

Mananeo a HPC a khetholloa ka nako e telele le likotsi tse kholo. Hang ha sistimi ea Top500 e se e sebetsa, ho hloleha ha boto ho fetolela ka ho toba nakong ea ho se sebetse ha lipatlisiso - 'me moreki a ka hloka likarolo tse ling lilemo tse 7-10 kamora theko ea pele.

Litlhoko tsa phallo ea boleng ba HPC

• Kamohelo ea Sehlopha sa 3 sa IPC: maemo a tloaelehileng bakeng sa liboto tsa ho bala le ho hokahanya litsamaisong tsa HPC.
• Ho etsa disampole tsa karolo e nyenyane: sengoloa sa pele 100%, ho nka disampole nakong ya tshebetso ka maqhubu a phahameng (hangata e le 1 phanele ka nngwe hodima dikaho tsa bohlokwa).
• Teko ea paramethara ea S: tahlehelo ea ho kenya boemo ba li-coupon le tahlehelo ea ho khutlisa ho 40 GHz libotong tse lebelo le phahameng.
• Netefatso ea potoloho ea mocheso: Teko ea botšepehi ba boemo ba li-coupon ka mekhoa ea IPC-TM-650.
• Litokomane ka thomello: CoC, disetifikeiti tsa polasi, teko ya motlakase, impedance, S-parameter, AOI, microsection, direkoto tsa tlhahlobo ya pono.

Tšoaneleho ea AVL bakeng sa HPC OEMs

• Tlhahlobo ea pele ho mangolo a thuto: ketelo ea sebaka ke sehlopha sa boleng ba bareki; tlhahlobo ea lisebelisoa, ts'ebetso le litokomane.
• Tšoaneleho ea sehlooho sa pele: Kaho ea sampole ea likotoana tse 25-200 e nang le litokomane tse felletseng.
• Netefatso ea ts'ebetso: Lintlha tsa SPC tse bontšang bokhoni ba ts'ebetso; merero ea taolo le litokomane tsa FMEA.
• Kamohelo lehlakoreng la moreki: teko ea tikoloho, netefatso ea boemo ba sistimi, ho saena semmuso.
• Tlhokomelo ea AVL: Litekanyo tse tswelang pele tsa tshebetso, ditlhahlobo tsa nako le nako, ditlhahlobo tsa boleng bo kopanetsweng.

Tšehetso ea lenaneo la bophelo bo bolelele

• Lethathamo la likarolo tse ling: bokgoni ba tlhahiso ya dikarolo tse setseng bo ikemiseditseng dilemo tse 7-10 kamora ho kenngwa tshebetsong ha pele.
• Tlhokomelo ea potoloho ea bophelo ba thepa: Re latela li-PCN tsa laminate le likaroloana ho fumana kotsi ea nako e telele esale pele.
• Ho nkeloa sebaka ke litokomane tse ngotsoeng: bakeng sa thepa ka 'ngoe e tšoanelehang, ho tlalehiloe mekhoa e meng e batlang e lekana.
• Tsamaiso ea bofelo ba bophelo: Likhoeli tse 18-24 pele ho EOL, ho rala hammoho moreki le mofani bakeng sa ho reka thepa ka lekhetlo la ho qetela.
• Poloko ea polokelo ea nalane: Lifaele tsohle tsa moralo, lirekoto tsa ts'ebetso, le data ea boleng e bolokiloeng bakeng sa nako ea lenaneo + lilemo tse 7.

9. Ho Kopanya Highleap ho Haho ea Sehlopha sa Hao sa HPC

Bakeng sa HPC OEMs, bakopanyi ba sistimi, le balekane ba naha ba hardware ba hlahlobang balekane ba tlhahiso ea PCB, mohlala oa rona oa boitlamo o amohela linako tse telele le phallo e matla ea mangolo e khethollang theko ea HPC:

• Keletso ea botekgeniki pele ho RFP: Ka kopo ea lihlopha tsa boenjiniere ba bareki, re fana ka likhothaletso tsa ho bokellana, tataiso ea thepa, le lipolelo tsa bokhoni tse tšehetsang likarabo tsa RFP.
• Tšehetso ea tlhahiso: litlhahiso tsa semmuso tse nang le litheko tse qaqileng, nako ea ho etella pele, boitlamo ba bokhoni, le litokomane tsa boleng bo lumellanang le litlhoko tsa RFP tsa bareki.
• Meaho ea mohlala le ea mangolo a thuto: Disampole tse 25-200 tse nang le ditokomane tse felletseng tse tshehetsang teko ya kamohelo ya bareki.
• Litokollo tsa tlhahiso: peeletso ea bokhoni e tsamaellanang le kemiso ea phano ea sistimi; phallo e hlophisitsoeng ea taolo ea liphetoho.
• Tšehetso ea ts'ehetso: Tlhahiso ea likarolo tse ling le tsamaiso ea bofelo ba bophelo ka nako eohle ea ts'ebetso ea sistimi.

Highleap e na le setifikeiti sa ISO 9001 le IATF 16949, ka phallo ea ts'ebetso e tsamaellanang le AS9100D e fumanehang bakeng sa mananeo a HPC a hlokang litokomane tsa boleng ba tšireletso le sebaka sa lifofane. Re etsa li-PCB tsa seva sa HPC ho tloha mealong e 8 ho isa mealong e 32+, ka lamination e latellanang ea HDI, impedance e laoloang ho ± 5%, koporo e boima ho isa ho 4 oz, le sekoahelo se felletseng sa bokaholimo. Mohala oa rona oa dijithale o lebelo le phahameng o sebelisa setšoantšo se tobileng sa laser ka qeto ea 25 µm le tlhahiso ea HDI PCB bakeng sa fanout e teteaneng ea BGA e hlokahalang ho potoloha li-CPU tse nang le lisebelisoa tsa HBM le bajari ba Grace Hopper. Bareki ba rona ba kenyelletsa ba kopanyang sistimi ea HPC, balekane ba naha ba li-hardware tsa laboratori, le litsi tsa supercomputer tsa univesithi ho pholletsa le meloko e mengata ea mananeo a Top500.

Romela difaele tsa Gerber, data ya ho phunya, tlhaloso ya stackup, bongata ba sepheo, le kemiso ya lenaneo ka portal ya rona ya khotheishene ya inthanete bakeng sa karabelo ya dihora tse 24. Bakeng sa tshehetso ya RFP, ntshetsopele ya ditshisinyo tsa semmuso, kapa moralo wa tshireletso mananeong a HPC a seng a ntse a le teng, sehlopha sa rona sa HPC se ka buisana ka kotloloho le kemiso ya nako. Bakeng sa dikahare tse amanang le bokgoni, bona maqephe a rona mabapi le tlhahiso ya PCB ya seva le bokgoni bo tiileng ba PCB bo akaretsang dipalo tsa lera, boima ba koporo, le sekwahelo sa ho qetela sa bokahodimo bakeng sa mananeo a HPC mainboard.