ITEQ IT-180A: High-Tg PCB Laminate Technical Guide
ITEQ IT-180A ke laminate e mengata e nang le Tg e phahameng , e phekotsoeng ka phenolic e entsoeng ka mokhoa o fapaneng bakeng sa lits'ebetso tsa PCB tse hlokang mocheso. Ka mocheso oa phetoho ea khalase oa 175°C (DSC), CTE e tlase ea Z-axis, khanyetso ea CAF e pakiloeng, le ho lumellana ha kopano ntle le loto, IT-180A e sebetsa e le substrate e tšepahalang bakeng sa liboto tse nang le palo e phahameng, likopano tsa BGA, meralo e boima ea koporo, le lits'ebetso tse latellanang tsa lamination lits'ebetsong tsa likoloi, tsa puisano le tsa seva.
Litlhaloso tsa ITEQ IT-180A
Tafole e latelang e akaretsa diparamente tsa bohlokwa ho tswa ho leqephe la data la semmuso la ITEQ IT-180A . Boleng bona bo bohlokwa bakeng sa moralo wa stackup, tlhahlobo ya botšepehi ba letshwao, le ho tshwaneleha ho tshepahala.
| paramethara | latela boleng ba | Method teko |
|---|---|---|
| Mocheso oa Phetoho ea Khalase (Tg) | 175°C (DSC) | IPC-TM-650 2.4.25 |
| Decomposition Temperature (Td) | 345°C (5% wt tahlehelo) | TGA / IPC-TM-650 2.4.24.6 |
| Dielectric Constant (Dk) @1MHz | 4.4 e tloaelehileng | IPC-TM-650 2.5.5.9 |
| Dielectric Constant (Dk) @10GHz | 4.1 e tloaelehileng | Resonator Cavity / IPC-TM-650 2.5.5.13 |
| Taba ea Phallo (Df) @1MHz | 0.014 e tloaelehileng | IPC-TM-650 2.5.5.9 |
| Sehlahisoa sa Dissipation (Df) @10GHz | 0.016 e tloaelehileng | IPC2.5.5.13 |
| Z-axis CTE (α1, ka tlase ho Tg) | 45 ppm/°C | TMA / IPC-TM-650 2.4.24 |
| Z-axis CTE (α2, ka holimo ho Tg) | 210 ppm/°C | TMA / IPC-TM-650 2.4.24 |
| Katoloso ya Z-axis (50–260°C) | 2.7% | IPC-TM-650 2.4.24 |
| T260 (Nako ea ho Delamination) | > Metsotso e 60 | IPC-TM-650 2.4.24.1 |
| T288 (Nako ea ho Delamination) | > Metsotso e 30 | IPC-TM-650 2.4.24.1 |
| Khanyetso ea CAF | Pass | IPC-TM-650 2.6.25 |
| Ho tsuba | V-0 | UL 94 |
| Tlhaloso ea IPC | IPC-4101C/126 | - |
Hobaneng u Khetha ITEQ IT-180A bakeng sa Moqapi oa hau oa PCB
Likopo tse shebiloeng
IT-180A e loketse meralo e hlokang ho tiea ha mocheso le botsitso ba litekanyo: li-PCB tse nang le mekhahlelo e mengata (mekhahlelo e 8+), meaho ea BGA le HDI e nang le pitch e ntle, liboto tse boima tsa koporo (3oz+), li-ECU tsa likoloi (tse lekantsoeng ka karolo ea enjene), lifofane tsa telecom, le litsamaiso tsa seva/poloko ea data center. Thepa ea eona ea UV-blocking e boetse e netefatsa hore e lumellana le AOI le litsamaiso tsa ho beha leihlo.
Thermal Performance Boleng
175 ° C Tg le Z-CTE e tlase e fokotsa khatello ea maikutlo nakong ea ho phalla ho se nang lead (tlhōrō ea 260 ° C) le lipotoloho tsa ho tsosolosa. Ka T260 e fetang metsotso e 60, IT-180A e mamella maeto a mangata a mocheso ntle le delamination - e bohlokoa bakeng sa ho aha ka tatellano ea lamination moo likarolo tse ka hare li bang le ho pepesehela mocheso khafetsa.
Tšepahala ea Motlakase
A Dk ea ~4.1 ho 10GHz le Df ea ~0.016 boemo ba IT-180A e le thepa e khonang ho sebetsa bohareng ba maqhubu. Le ha e sa rereloa lipheletso tse ka pele tsa millimeter-wave RF, e feta maemo a FR-4 lits'ebetsong ho fihla ho GHz tse 'maloa, e etsa hore e tšoanelehe bakeng sa dijithale tsa lebelo la bohareng, potoloho ea tšehetso ea radar ea likoloi, le likhokahano tsa lebelo le phahameng ka kakaretso.
Ka-Hole le ka Botšepehi
Katoloso e tlase ea Z-axis e fokotsa ho phatloha ha moqomo le ho phahamisa liphaephe ka mekoting e petelitsoeng. Khanyetso ea CAF e boetse e sireletsa khahlanong le ho falla ha electrochemical sebakeng se phahameng haholo ka masimo, ho lelefatsa bophelo ba ts'ebeletso libakeng tse mongobo kapa tsa libaesekele tse futhumetseng.
ITEQ IT-180A PCB
Lintlha tsa Moqapi bakeng sa ITEQ IT-180A
Lamination le Pre-Bake
Ka mor'a phekolo ea oxide (e ntšo kapa e sootho), chesa likarolo tse ka hare ho 120 ° C bonyane metsotso e 40 ho leleka mongobo o monyehileng. Metsi a setseng a baka delamination e bakoang ke mouoane nakong ea ho hatella. Boloka prepregs sebakeng se laoloang (<20 ° C, <50% RH) 'me u lumelle lihora tse 12 ho lumellana pele ho layup.
Ho cheka le ho Desmear
IT-180A e cheka ka mokhoa o hloekileng ka likotoana tse tloaelehileng tsa carbide. Bakeng sa mekotla e phahameng haholo le ea koporo e boima, fokotsa bophahamo ba li-stack (phanele e le 'ngoe bakeng sa ≥8 layers) 'me u buisane le morekisi oa hau oa boro mabapi le phepelo/katoloso ea lebelo. Litekanyetso tsa Desmear li fapane le maemo a tloaelehileng a FR-4-litlhophiso tse tloaelehileng li ka fokotsa resin. Hokahana le mofani oa hau oa k'hemistri ho lokisa lipotoloho tsa permanganate kapa ho nahana ka lipallo tse habeli tsa desmear.
Tšebelisano-'moho le Phalliso e sa Lebelloang
Thepa e feta 260 ° C e se nang lead, ho latela litlhoko tsa IPC J-STD-020. T260 > 60 min le T288 > 20 min li tiisa ho tiea khahlanong le litlaleho tse matla tsa mocheso. Tokomane e phahameng ea mocheso, nako e kaholimo-limo-liquidus, le litefiso tsa marang-rang bakeng sa lirekoto tsa mangolo a ts'ebetso.
Tsamaiso ea Lipontšo tsa Maqhubu a Phahameng
Litekanyetso tsa IT-180A tsa Drk/Df li tšehetsa tsela ea radar ea lebelo le phahameng ea dijithale le ea likoloi e mahareng. Bakeng sa li-front-ends tse thata tsa RF/microwave (tse fetang 10GHz tse nang le litekanyetso tse thata tsa tahlehelo ea ho kenngoa), hlahloba li-laminate tse khethehileng tse nang le tahlehelo e tlase joalo ka laminate e khethehileng e nang le tahlehelo e tlase kapa letoto la Isola Astra. Li-stackup tse kopantsoeng—IT-180A bakeng sa likarolo tsa motlakase/tlase le thepa e nang le tahlehelo e tlase bakeng sa likarolo tsa matšoao—li ka leka-lekanya litšenyehelo le ts'ebetso.
Tataiso ea Tlhahiso le Ts'ebetso
Litlhahiso tsa Stackup
Bakeng sa meralo ea 6- ho isa ho 8-layer, sebelisa li-cores tsa 0.1–0.2mm tse nang le 106/1080/2116 mekhoa ea prepreg ho ipapisitse le ho se sebetse hantle ha sepheo le botenya ba ho qetela. Boloka kaho ea symmetrical ho thibela seqha le ho sotha. ITEQ e fana ka phallo ea prepreg le data ea nako ea gel; shebana le tsena bakeng sa ntlafatso ea nako ea boralitaba.
Vacuum Lamination
Vacuum degas stacks metsotso e 30 pele u futhumatsa ho tlosa moea o koalehileng. Khatello ea khatiso e khothalletsoang: 350-400 psi (hydraulic) kapa 300-400 psi (vacuum-hydraulic). Sekhahla sa mocheso ho tloha ho 80 ° C ho ea ho 140 ° C: 1.3-3.0 ° C / min. Tšoara mocheso oa 180 ° C bonyane metsotso e 60 ho netefatsa hore o fola ka botlalo. Pholile ka ≤3 ° C / min ho fokotsa khatello ea kelello e setseng.
Surface Finish Compatibility
IT-180A e tsamaisana le ENIG, HASL (e se nang loto), OSP, le lithako tsa tin/silevera tsa ho qoelisa. Bakeng sa ENIG, netefatsa litaba tsa phosphorus le botenya ba plating ho qoba mathata a kutu ea nickel. Lipotoloho tsa HASL tse se nang loto (pitsa ea solder ea 265 ° C) li hantle ka har'a matla a mocheso oa thepa.
Lethathamo la Teko la Botšepehi
Kopa tse latelang ho morekisi oa hau oa laminate kapa u tsamaise ka tlung: TMA bakeng sa netefatso ea Tg, libaesekele tse futhumetseng (-40 ho +125 ° C, 500+ cycles), mocheso oa mocheso (mokelikeli-ho-mokelikeli), setlolo sa letsoai (ho ea ka IPC-TM-650 2.6.14 bakeng sa likoloi), le CAF tlas'a tlhahlobo ea 58%. Liphetho tsa litokomane bakeng sa liphutheloana tse tšoanelehang tsa bareki.
ITEQ IT-180A vs. Competing High-Tg Materials
Tafole e ka tlase e bapisa IT-180A le Isola 370HR — e leng mokhoa o khethiloeng ka ho pharaletseng sehlopheng sa FR-4 se nang le Tg e phahameng.
| Property | ITEQ IT-180A | Isola 370HR |
|---|---|---|
| Tg (DSC) | ≥175 ° C | ~ 180 ° C |
| Td (5% wt tahlehelo) | > 340 ° C | ~ 340 ° C |
| Z-CTE (50–260°C) | 2.7% | ~ 2.7% |
| Dk @1MHz | 4.4 | ~ 4.6 |
| Df @1MHz | 0.014 | ~ 0.015 |
| Khanyetso ea CAF | Pass | Pass |
| Ho fumaneha (Asia) | Nako e phahameng, e khuts'oane ea ho etella pele | Nako e itekanetseng, ea ho reka thepa |
| Litšenyehelo tse Batlang | Ho ba le tlhōlisano | Premium |
Lisebelisoa ka bobeli li kopana le litlhoko tse boima tsa mocheso le CAF. IT-180A e fana ka tharollo e theko e tlaase e nang le phumaneho e matla ea libaka tlhahisong e thehiloeng Asia. 370HR e ka khethoa moo mangolo a thuto a teng kapa liketane tsa phepelo tse thehiloeng US e leng tsa bohlokoa. Bakeng sa lits'ebetso tsa RF tsa tahlehelo e tlase haholo, ha e nke sebaka sa PTFE kapa hydrocarbon-ceramic substrates.
fihlela qeto e
ITEQ IT-180A e fana ka motsoako o leka-lekaneng oa Tg e phahameng, katoloso e tlase ea Z-axis, ho hanyetsa CAF, le ho lumellana ho se nang lead-ho etsa hore e be khetho e sebetsang bakeng sa li-multilayer, li-PCB tse tšepahalang haholo. E koala lekhalo lipakeng tsa FR-4 e tloaelehileng le li-substrates tsa tahlehelo e tlase ea premium, e fang lienjiniere tsela e theko e tlaase ea ho tiea mocheso ntle le ho tela tlhahiso.
Lipotso Asked hangata
1. Tg ea ITEQ IT-180A ke eng?
Mocheso oa phetoho ea khalase (Tg) ke ≥175 ° C ha o lekanngoa ke DSC ka IPC-TM-650 2.4.25.
2. Na IT-180A e ka fetisa 260 ° C ho phalla ntle ho mahala?
Ee. Letlapa le tiisa T260>metsotso e 60 le T288>metsotso e 20, e bonts'a mamello e matla ea kopano e se nang lead.
3. Ke lisebelisoa life tse loketseng IT-180A?
Meralo ea Multilayer BGA, liboto tse boima tsa koporo, li-ECU tsa likoloi, lifofane tsa mehala tsa mehala, le lits'ebetso tsa seva / polokelo tse hlokang ts'epo e phahameng ea mocheso le khanyetso ea CAF.
4. Na IT-180A e loketse meralo ea RF ea maqhubu a holimo?
IT-180A e ts'ehetsa lits'ebetso tsa maqhubu a mahareng (ho fihla ho GHz tse 'maloa) ka tahlehelo e amohelehang. Bakeng sa litlhoko tsa mantlha tsa millimeter-wave kapa tse thata tsa RF, lisebelisoa tse khethehileng tsa tahlehelo e tlase lia khothaletsoa.
5. Na IT-180A e tšehetsa lamination e latellanang?
Ee. Botsitso ba eona ba mocheso le Z-CTE e tlase li etsa hore e tšoanelehe hantle lamination e latellanang mekhoa ea HDI e rarahaneng le mehaho ea ho haha.
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