ITEQ IT-180A: High-Tg PCB Laminate Technical Guide

IT-180A PCB

ITEQ IT-180A ke laminate e mengata e nang le Tg e phahameng , e phekotsoeng ka phenolic e entsoeng ka mokhoa o fapaneng bakeng sa lits'ebetso tsa PCB tse hlokang mocheso. Ka mocheso oa phetoho ea khalase oa 175°C (DSC), CTE e tlase ea Z-axis, khanyetso ea CAF e pakiloeng, le ho lumellana ha kopano ntle le loto, IT-180A e sebetsa e le substrate e tšepahalang bakeng sa liboto tse nang le palo e phahameng, likopano tsa BGA, meralo e boima ea koporo, le lits'ebetso tse latellanang tsa lamination lits'ebetsong tsa likoloi, tsa puisano le tsa seva.

Litlhaloso tsa ITEQ IT-180A

Tafole e latelang e akaretsa diparamente tsa bohlokwa ho tswa ho leqephe la data la semmuso la ITEQ IT-180A . Boleng bona bo bohlokwa bakeng sa moralo wa stackup, tlhahlobo ya botšepehi ba letshwao, le ho tshwaneleha ho tshepahala.

paramethara latela boleng ba Method teko
Mocheso oa Phetoho ea Khalase (Tg) 175°C (DSC) IPC-TM-650 2.4.25
Decomposition Temperature (Td) 345°C (5% wt tahlehelo) TGA / IPC-TM-650 2.4.24.6
Dielectric Constant (Dk) @1MHz 4.4 e tloaelehileng IPC-TM-650 2.5.5.9
Dielectric Constant (Dk) @10GHz 4.1 e tloaelehileng Resonator Cavity / IPC-TM-650 2.5.5.13
Taba ea Phallo (Df) @1MHz 0.014 e tloaelehileng IPC-TM-650 2.5.5.9
Sehlahisoa sa Dissipation (Df) @10GHz 0.016 e tloaelehileng IPC2.5.5.13
Z-axis CTE (α1, ka tlase ho Tg) 45 ppm/°C TMA / IPC-TM-650 2.4.24
Z-axis CTE (α2, ka holimo ho Tg) 210 ppm/°C TMA / IPC-TM-650 2.4.24
Katoloso ya Z-axis (50–260°C) 2.7% IPC-TM-650 2.4.24
T260 (Nako ea ho Delamination) > Metsotso e 60 IPC-TM-650 2.4.24.1
T288 (Nako ea ho Delamination) > Metsotso e 30 IPC-TM-650 2.4.24.1
Khanyetso ea CAF Pass IPC-TM-650 2.6.25
Ho tsuba V-0 UL 94
Tlhaloso ea IPC IPC-4101C/126 -

Hobaneng u Khetha ITEQ IT-180A bakeng sa Moqapi oa hau oa PCB

Likopo tse shebiloeng

IT-180A e loketse meralo e hlokang ho tiea ha mocheso le botsitso ba litekanyo: li-PCB tse nang le mekhahlelo e mengata (mekhahlelo e 8+), meaho ea BGA le HDI e nang le pitch e ntle, liboto tse boima tsa koporo (3oz+), li-ECU tsa likoloi (tse lekantsoeng ka karolo ea enjene), lifofane tsa telecom, le litsamaiso tsa seva/poloko ea data center. Thepa ea eona ea UV-blocking e boetse e netefatsa hore e lumellana le AOI le litsamaiso tsa ho beha leihlo.

Thermal Performance Boleng

175 ° C Tg le Z-CTE e tlase e fokotsa khatello ea maikutlo nakong ea ho phalla ho se nang lead (tlhōrō ea 260 ° C) le lipotoloho tsa ho tsosolosa. Ka T260 e fetang metsotso e 60, IT-180A e mamella maeto a mangata a mocheso ntle le delamination - e bohlokoa bakeng sa ho aha ka tatellano ea lamination moo likarolo tse ka hare li bang le ho pepesehela mocheso khafetsa.

Tšepahala ea Motlakase

A Dk ea ~4.1 ho 10GHz le Df ea ~0.016 boemo ba IT-180A e le thepa e khonang ho sebetsa bohareng ba maqhubu. Le ha e sa rereloa lipheletso tse ka pele tsa millimeter-wave RF, e feta maemo a FR-4 lits'ebetsong ho fihla ho GHz tse 'maloa, e etsa hore e tšoanelehe bakeng sa dijithale tsa lebelo la bohareng, potoloho ea tšehetso ea radar ea likoloi, le likhokahano tsa lebelo le phahameng ka kakaretso.

Ka-Hole le ka Botšepehi

Katoloso e tlase ea Z-axis e fokotsa ho phatloha ha moqomo le ho phahamisa liphaephe ka mekoting e petelitsoeng. Khanyetso ea CAF e boetse e sireletsa khahlanong le ho falla ha electrochemical sebakeng se phahameng haholo ka masimo, ho lelefatsa bophelo ba ts'ebeletso libakeng tse mongobo kapa tsa libaesekele tse futhumetseng.

ITEQ IT-180A PCB

ITEQ IT-180A PCB

Lintlha tsa Moqapi bakeng sa ITEQ IT-180A

Lamination le Pre-Bake

Ka mor'a phekolo ea oxide (e ntšo kapa e sootho), chesa likarolo tse ka hare ho 120 ° C bonyane metsotso e 40 ho leleka mongobo o monyehileng. Metsi a setseng a baka delamination e bakoang ke mouoane nakong ea ho hatella. Boloka prepregs sebakeng se laoloang (<20 ° C, <50% RH) 'me u lumelle lihora tse 12 ho lumellana pele ho layup.

Ho cheka le ho Desmear

IT-180A e cheka ka mokhoa o hloekileng ka likotoana tse tloaelehileng tsa carbide. Bakeng sa mekotla e phahameng haholo le ea koporo e boima, fokotsa bophahamo ba li-stack (phanele e le 'ngoe bakeng sa ≥8 layers) 'me u buisane le morekisi oa hau oa boro mabapi le phepelo/katoloso ea lebelo. Litekanyetso tsa Desmear li fapane le maemo a tloaelehileng a FR-4-litlhophiso tse tloaelehileng li ka fokotsa resin. Hokahana le mofani oa hau oa k'hemistri ho lokisa lipotoloho tsa permanganate kapa ho nahana ka lipallo tse habeli tsa desmear.

Tšebelisano-'moho le Phalliso e sa Lebelloang

Thepa e feta 260 ° C e se nang lead, ho latela litlhoko tsa IPC J-STD-020. T260 > 60 min le T288 > 20 min li tiisa ho tiea khahlanong le litlaleho tse matla tsa mocheso. Tokomane e phahameng ea mocheso, nako e kaholimo-limo-liquidus, le litefiso tsa marang-rang bakeng sa lirekoto tsa mangolo a ts'ebetso.

Tsamaiso ea Lipontšo tsa Maqhubu a Phahameng

Litekanyetso tsa IT-180A tsa Drk/Df li tšehetsa tsela ea radar ea lebelo le phahameng ea dijithale le ea likoloi e mahareng. Bakeng sa li-front-ends tse thata tsa RF/microwave (tse fetang 10GHz tse nang le litekanyetso tse thata tsa tahlehelo ea ho kenngoa), hlahloba li-laminate tse khethehileng tse nang le tahlehelo e tlase joalo ka laminate e khethehileng e nang le tahlehelo e tlase kapa letoto la Isola Astra. Li-stackup tse kopantsoeng—IT-180A bakeng sa likarolo tsa motlakase/tlase le thepa e nang le tahlehelo e tlase bakeng sa likarolo tsa matšoao—li ka leka-lekanya litšenyehelo le ts'ebetso.

Tataiso ea Tlhahiso le Ts'ebetso

Litlhahiso tsa Stackup

Bakeng sa meralo ea 6- ho isa ho 8-layer, sebelisa li-cores tsa 0.1–0.2mm tse nang le 106/1080/2116 mekhoa ea prepreg ho ipapisitse le ho se sebetse hantle ha sepheo le botenya ba ho qetela. Boloka kaho ea symmetrical ho thibela seqha le ho sotha. ITEQ e fana ka phallo ea prepreg le data ea nako ea gel; shebana le tsena bakeng sa ntlafatso ea nako ea boralitaba.

Vacuum Lamination

Vacuum degas stacks metsotso e 30 pele u futhumatsa ho tlosa moea o koalehileng. Khatello ea khatiso e khothalletsoang: 350-400 psi (hydraulic) kapa 300-400 psi (vacuum-hydraulic). Sekhahla sa mocheso ho tloha ho 80 ° C ho ea ho 140 ° C: 1.3-3.0 ° C / min. Tšoara mocheso oa 180 ° C bonyane metsotso e 60 ho netefatsa hore o fola ka botlalo. Pholile ka ≤3 ° C / min ho fokotsa khatello ea kelello e setseng.

Surface Finish Compatibility

IT-180A e tsamaisana le ENIG, HASL (e se nang loto), OSP, le lithako tsa tin/silevera tsa ho qoelisa. Bakeng sa ENIG, netefatsa litaba tsa phosphorus le botenya ba plating ho qoba mathata a kutu ea nickel. Lipotoloho tsa HASL tse se nang loto (pitsa ea solder ea 265 ° C) li hantle ka har'a matla a mocheso oa thepa.

Lethathamo la Teko la Botšepehi

Kopa tse latelang ho morekisi oa hau oa laminate kapa u tsamaise ka tlung: TMA bakeng sa netefatso ea Tg, libaesekele tse futhumetseng (-40 ho +125 ° C, 500+ cycles), mocheso oa mocheso (mokelikeli-ho-mokelikeli), setlolo sa letsoai (ho ea ka IPC-TM-650 2.6.14 bakeng sa likoloi), le CAF tlas'a tlhahlobo ea 58%. Liphetho tsa litokomane bakeng sa liphutheloana tse tšoanelehang tsa bareki.

ITEQ IT-180A vs. Competing High-Tg Materials

Tafole e ka tlase e bapisa IT-180A le Isola 370HR — e leng mokhoa o khethiloeng ka ho pharaletseng sehlopheng sa FR-4 se nang le Tg e phahameng.

Property ITEQ IT-180A Isola 370HR
Tg (DSC) ≥175 ° C ~ 180 ° C
Td (5% wt tahlehelo) > 340 ° C ~ 340 ° C
Z-CTE (50–260°C) 2.7% ~ 2.7%
Dk @1MHz 4.4 ~ 4.6
Df @1MHz 0.014 ~ 0.015
Khanyetso ea CAF Pass Pass
Ho fumaneha (Asia) Nako e phahameng, e khuts'oane ea ho etella pele Nako e itekanetseng, ea ho reka thepa
Litšenyehelo tse Batlang Ho ba le tlhōlisano Premium

Lisebelisoa ka bobeli li kopana le litlhoko tse boima tsa mocheso le CAF. IT-180A e fana ka tharollo e theko e tlaase e nang le phumaneho e matla ea libaka tlhahisong e thehiloeng Asia. 370HR e ka khethoa moo mangolo a thuto a teng kapa liketane tsa phepelo tse thehiloeng US e leng tsa bohlokoa. Bakeng sa lits'ebetso tsa RF tsa tahlehelo e tlase haholo, ha e nke sebaka sa PTFE kapa hydrocarbon-ceramic substrates.

fihlela qeto e

ITEQ IT-180A e fana ka motsoako o leka-lekaneng oa Tg e phahameng, katoloso e tlase ea Z-axis, ho hanyetsa CAF, le ho lumellana ho se nang lead-ho etsa hore e be khetho e sebetsang bakeng sa li-multilayer, li-PCB tse tšepahalang haholo. E koala lekhalo lipakeng tsa FR-4 e tloaelehileng le li-substrates tsa tahlehelo e tlase ea premium, e fang lienjiniere tsela e theko e tlaase ea ho tiea mocheso ntle le ho tela tlhahiso.

Lipotso Asked hangata

1. Tg ea ITEQ IT-180A ke eng?
Mocheso oa phetoho ea khalase (Tg) ke ≥175 ° C ha o lekanngoa ke DSC ka IPC-TM-650 2.4.25.

2. Na IT-180A e ka fetisa 260 ° C ho phalla ntle ho mahala?
Ee. Letlapa le tiisa T260>metsotso e 60 le T288>metsotso e 20, e bonts'a mamello e matla ea kopano e se nang lead.

3. Ke lisebelisoa life tse loketseng IT-180A?
Meralo ea Multilayer BGA, liboto tse boima tsa koporo, li-ECU tsa likoloi, lifofane tsa mehala tsa mehala, le lits'ebetso tsa seva / polokelo tse hlokang ts'epo e phahameng ea mocheso le khanyetso ea CAF.

4. Na IT-180A e loketse meralo ea RF ea maqhubu a holimo?
IT-180A e ts'ehetsa lits'ebetso tsa maqhubu a mahareng (ho fihla ho GHz tse 'maloa) ka tahlehelo e amohelehang. Bakeng sa litlhoko tsa mantlha tsa millimeter-wave kapa tse thata tsa RF, lisebelisoa tse khethehileng tsa tahlehelo e tlase lia khothaletsoa.

5. Na IT-180A e tšehetsa lamination e latellanang?
Ee. Botsitso ba eona ba mocheso le Z-CTE e tlase li etsa hore e tšoanelehe hantle lamination e latellanang mekhoa ea HDI e rarahaneng le mehaho ea ho haha.

qotsa hanghang

Posts kgothaletswa

Mokhoa oa ho fumana quote bakeng sa li-PCB

Ha re u etsetse tlhahlobo ea DFM/DFA 'me re khutlele ho uena ka tlaleho. U ka kenya lifaele tsa hau ka mokhoa o sireletsehileng ka webosaete ea rona. Re hloka lintlha tse latelang ho u fa quote:

    • Gerber, ODB++, kapa .pcb, spec.
    • Lethathamo la BOM haeba o hloka kopano
    • bongata
    • Nako ea ho fetoha

Ntle le tlhahiso ea PCB, re fana ka mefuta e fapaneng ea lits'ebeletso tsa elektroniki, ho kenyeletsoa moralo oa PCB, PCBA, le tharollo ea turnkey. Hore na o hloka thuso ka prototyping, netefatso ea moralo, ho fumana likarolo, kapa tlhahiso e ngata, re fana ka ts'ehetso ea ho qetela ho netefatsa katleho ea morero oa hau.

Bakeng sa litšebeletso tsa PCBA, ka kopo fana ka BOM ea hau (Bill of Materials) le litaelo tse itseng tsa kopano. Re boetse re fana ka tlhahlobo ea DFM/DFA ho ntlafatsa meralo ea hau bakeng sa tlhahiso le kopano, ho netefatsa ts'ebetso ea tlhahiso e boreleli.






    Keletso e potlakileng: Sehlopha sa rona se tla u romella lengolo-tsoibila hang ka mor'a tlhahiso. Ho netefatsa hore o fumana karabo ea rona, re khothaletsa ka mosa ho sheba SPAM / JUNK FOLDER ea hau haeba u sa bone molaetsa oa rona ho inbox ea hau.