Khetho ea Lintho tsa PCB bakeng sa Moralo oa Drone o bobebe

Khetho e bobebe ea PCB e bohlokoa ha o rala lisebelisoa tsa elektroniki tsa drone. Ho khetha pakeng tsa FR4, polyimide (PI), metal-core le hybrid substrates ho hloka ho leka-lekanya boima ba 'mele, ho tiea, ts'ebetso ea mocheso le tlhahiso. Tataiso ena e hlalosa li-tradeoffs tse sebetsang le likhetho tsa feme e le hore lihlopha tsa theko le meralo li ka khetha lisebelisoa tse kopanang le ho sisinyeha ha moea, mocheso le mathata a kopano ha li ntse li fokotsa boima ba sistimi ka kakaretso.

Hobaneng ha PCB e Bonolo e le Bohlokoa ho Likopo tsa Drone

Grama e 'ngoe le e 'ngoe ea bohlokoa moralong oa drone . Likopano tsa PCB hangata li etsa 15-25% ea boima bohle ba foreimi ea moea ho li-UAV tsa khoebo, e leng se amang ka kotloloho mamello ea sefofane le bokhoni ba ho jara mojaro.

Ka nqane ho phokotso ya boima ba mmele, di-PCB tsa drone di tlameha ho mamella ho thothomela ho sa kgaotseng, ho potoloha ha mocheso ho tswa ho diphetoho tse potlakileng tsa bophahamo le kgatello ya mechine nakong ya tshebetso. Ho kgetha thepa e bobebe ya PCB e nepahetseng ho netefatsa tshebetso e tshepahalang ha ka nako e ts'oanang ho eketsa nako ya ho fofa le bokgoni ba tshebetso dikopong tsa sefofane tse amang boima.

Lipheo le Litšitiso tsa Moralo bakeng sa PCB e bobebe

Ho leka-lekanya Boima Khahlanong le Litlhoko tsa Ts'ebetso

Morero oa mantlha oa moralo oa PCB o bobebe ke ho fokotsa boima ha o ntse o boloka botsitso bo lekaneng, taolo ea mocheso le ts'ebetso ea motlakase. Baqapi ba tlameha ho leka-lekanya litlhoko tsa tlholisano: li-substrates tse tšesaane li fokotsa boima ba 'mele empa li ka senya matla a mochini ha li sisinyeha. Boima ba koporo bo fokotsehileng bo boloka boima empa bo fokotsa matla a hona joale le ho senyeha ha mocheso. Khetho ea thepa e ama ka kotloloho likhohlano tsena.

Mathata a Bohlokoa a Moralo

Meralo e bobebe ea PCB e tobana le mathata a 'maloa a tekheniki a susumetsang khetho ea thepa:

• Matla a mechine - Matla a lekaneng a ho hanela khatello ea maikutlo le mokhathala o sisinyehang bophelong bohle ba ts'ebetso.
• Tsamaiso ea ho futhumatsa - Phallo e lekaneng ea mocheso ho tloha likarolong tsa matla ntle le koporo e feteletseng kapa tšepe ea motheo ea tšepe.
• Botšepehi ba pontšo - Li-impedance tse laoloang le li-dielectric tsa tahlehelo e tlase bakeng sa lipotoloho tsa RF/antenna ntle le li-substrates tse boima.
• Bokhoni ba ho hlahisa - Tsebo ea fektheri e nang le lisebelisoa tse tšesaane, ts'ebetso ea flex le mekhoa e khethehileng ea kopano.
• Litšenyehelo le nako ea ho etella pele - Ho fumaneha ha thepa, litlhoko tsa lisebelisoa le ho rarahana ha tlhahiso e amang moruo oa morero.

Ho bapisa Lisebelisoa tse Tloaelehileng tse bobebe tsa PCB

FR4: The Standard Baseline

FR4 e ntse e le khetho e fumanehang habonolo le e theko e tlaase bakeng sa li-PCB tsa drone tse bobebe. E kopanya lits'ebetso tsa tlhahiso tse theko e tlase, tse butsoitseng, le ho fumaneha ha bafani ba bangata. Liboto tse tšesaane tsa FR4 (0.6–0.8 mm) li fana ka poloko e itekanetseng ea boima ntle le ho hloka litlhophiso tse ncha tsa tlhahiso.

• le menyetla - E moruo, ho bonolo ho e sebetsa, e ka tšeptjoang bakeng sa lisebelisoa tsa elektroniki tsa sefofane.
• sheba mefokolo ea - boima bo fokotsehileng ka tlase ho 0.6 mm; ts'ebetso e fokolang ea mocheso le maqhubu a phahameng.
• Molemohali bakeng sa - Balaoli ba lifofane, li-interface tsa sensor, le li-circuits tse nang le matla a tlaase moo tlhahiso ea thepa e fetang phaello e fokolang ea boima ba 'mele.

Polyimide (PI) le Flexible PCB Solutions

Lisebelisoa tsa Polyimide (PI) li nolofalletsa meaho e mesesaane haholo (0.05–0.2 mm) le e tenyetsehang ea PCB e loketseng litsamaiso tse nyane tsa drone tse bohlokoa haholo. Li kopanya mamello e phahameng ea mocheso (ho fihlela ho 200 °C), tenyetseho e ntle bakeng sa lits'ebetso tse kobehileng kapa tse menoang, le khanyetso e phahameng ea ho thothomela.

• le menyetla - Bokhoni bo bobebe bo feteletseng, mamello e phahameng ea mocheso, khanyetso ea vibrate.
• sheba mefokolo ea - Litšenyehelo tse phahameng, mekhoa e rarahaneng ea soldering le lamination, nako e telele ea tlhahiso ea tlhahiso.
• Molemohali bakeng sa - Likhokahano tsa Gimbal, li-sensor tse phuthang, le lisebelisoa tsa elektroniki tsa sebaka se thata moo tsela e bonolo e bolokang lihokelo le boima ba wiring.

Metal-Core PCB bakeng sa Tsamaiso ea Thermal

Li-PCB tsa tšepe-core (MCPCB) , tseo hangata li thehiloeng ho aluminium kapa koporo, li ipabola ho qhaleng mocheso. Karolo ea tšepe e etsa tsela e tobileng ea mocheso ho ea ho liforeimi tsa drone kapa li-heatsink, e leng se netefatsang botsitso ba likarolo tlas'a moroalo o phahameng oa motlakase kapa oa LED.

• le menyetla - Ts'ebetso e phahameng ea mocheso, botsitso bo phahameng ba sebopeho, bo tsitsitseng bakeng sa lipotoloho tsa matla.
• sheba mefokolo ea - E boima ho feta FR4 kapa PI, likarolo tse lekanyelitsoeng tsa matšoao, ho cheka ho thata le ho pola.
• Molemohali bakeng sa - Liboto tsa matla, li-ESC, le lihlopha tsa LED moo ho tlosoa ha mocheso ho leng bohlokoa ho feta boima bo fokolang.

Lisebelisoa tsa PCB tse kopantsoeng le tsa Hybrid Lightweight

Mehaho e kopantsoeng kapa e nyalisitsoeng e kopanya lisebelisoa-tse kang li-cores tse tšesaane tsa FR4 tse nang le likarolo tsa ka ntle tsa PI kapa likaroloana tsa khekhe ea linotši / foam-core-ho leka-lekanya matla, ho tiea le boima. Li-stackups tsena tse tloaelehileng li fihlella litekanyo tse ntlafalitsoeng tsa boima ba 'mele ho ea ts'ebetsong bakeng sa li-platform tsa UAV tse phahameng.

• le menyetla - Thepa ea mochini le e futhumatsang, libaka tse thata tse ka khonehang, ho matlafatsa boima ba 'mele.
• sheba mefokolo ea - Kamano e rarahaneng, likotsi tse sa lumellaneng tsa CTE, litšenyehelo tse phahameng tsa ho etsa thepa.
• Molemohali bakeng sa - Li-drones tse tsoetseng pele tse hlokang moralo o bobebe le bots'epehi ba sebopeho tlasa maemo a boima.

Liphetoho tsa Lintlha tsa Bohlokoa ka Moqapi oa PCB o bobebe

Khetho ea Boima ba Koporo

Botenya ba koporo bo ama ka kotloloho ts'ebetso ea motlakase le boima ba PCB ka kakaretso. Koporo e tloaelehileng ea 1 oz (35 µm) e ts'ehetsa matla a hajoale empa e eketsa boima ba boto kaofela. Ho li-PCB tsa drone tse bobebe, likhetho tse nyane tsa koporo tse joalo ka 0.5 oz kapa 0.25 oz li fokotsa boima ba 'mele ho fihla ho 50% ha li ntse li boloka botšepehi ba matšoao a amohelehang.

• Melemo ea koporo e mosesaane - Boima bo tlase ka kakaretso, ho theola habonolo, litšenyehelo tse fokotsehileng tsa thepa.
• sheba mefokolo ea - Bokhoni bo fokolang ba hona joale, khanyetso e phahameng ea trace, ho theola mocheso o tlase.
• Tloaelo e ntlehali - Sebelisa litekanyo tsa koporo tse khethiloeng kapa boima bo boima feela libakeng tsa hajoale ho leka-lekanya boima ba 'mele le ho ts'epahala.

Botenya ba Boto le ho Tiea

Botenya bohle ba PCB bo lekanya boima ba 'mele, ho satalla, le botsitso ba mochini. Mapolanka a tloaelehileng a tšesaane a thata a tloha ho 0.4 mm ho isa ho 0.8 mm, ha li-substrates tse tenyetsehang li ka theohela ho 0.05 mm. Meralo e mesesane e boloka boima ba 'mele empa e ba le khatello ea maikutlo le ho sisinyeha haholo-haholo-holo ea bohlokoa ho liforeimi tsa drone tse pepesehileng ho thothomela ha sefofane.

• Melemo ea mapolanka a masesaane - Phokotso e kholo ea boima ba 'mele, kopanyo e kopanetsoeng, tšebeliso e tlase ea thepa.
• sheba mefokolo ea - Ho fokotseha ho tsitsitseng, ho sebetsana le bothata nakong ea kopano, khatello ea kelello e ka 'nang ea e-ba solder.
• Keletso ea moralo - Matlafatsa masoba kapa libaka tsa likhokahanyo ka li-stiffeners ho boloka botsitso ba mochini ha o ntse o fokotsa botenya bo felletseng.

Thepa ea Dielectric le Thermal

Dielectric constant (Dk) le liparamente tsa mocheso li hlalosa boleng ba matšoao le ho tšoarella ha nako e telele. Standard FR4 e fana ka Dk ≈ 4.5, e loketseng lipotoloho tse tloaelehileng tsa taolo ea drone, ha li-laminates tse lahleheloang tlaase li ntlafatsa antenna le tshebetso ea module ea RF. Mocheso o phahameng oa phetoho ea khalase (Tg) le coefficient e ts'oanang ea katoloso ea mocheso (CTE) ke tsa bohlokoa ho netefatsa botsitso ba sebopeho nakong ea phallo le mocheso oa sefofane.

• Lintlha tse khothalelitsoeng – Tg ≥ 150 °C, CTE haufi le koporo (~ 17 ppm/°C).
• Melemo ea lisebelisoa tse ntlafalitsoeng - E ntlafalitse ts'epahalo ea libaesekele tse futhumatsang, botsitso bo betere ba impedance, likotsi tse fokolang tsa delamination.
• Molemohali bakeng sa - Liboto tsa puisano le li-sensor li pepesehetse mefuta e mengata ea mocheso oa sefofane kapa lipotoloho tse pheta-phetoang tsa solder.

Mekhoa ea Mehaho: PCB e thata, e feto-fetohang le e tsitsitseng-Flex

Nako ea ho Sebelisa Rigid-Flex PCB

Meetso ea PCB e thata-flex e kopanya likarolo tse thata tsa substrate le likhokahano tse feto-fetohang kopanong e le 'ngoe e bobebe ea PCB. Kaho ena e felisa likhoele tse arohaneng, likhokahano le lithapo tsa terata lipakeng tsa mapolanka, ho fokotsa boima ba sistimi ka 20-40% ha e ntse e ntlafatsa ts'epo ka lintlha tse fokolang tsa khokahano ea likhokahano. Rigid-flex e sebetsa ka mokhoa o ikhethang ho li-drones moo mathata a sebaka le litekanyetso tsa boima ba 'mele li hlokang litharollo tse kopaneng, joalo ka ho hokahanya balaoli ba lifofane ho liboto tsa kabo ea matla kapa ho hokahanya li-gimbal tsa khamera le lits'ebetso tse kholo tsa taolo.

Lintlha tsa Moqapi bakeng sa Likarolo tsa Flex

Likarolo tse feto-fetohang tsa likopano tsa PCB tse bobebe li hloka tlhokomelo e hlokolosi khatellong ea mochini. Qoba ho beha li-vias kapa masoba libakeng tse tenyetsehang tse tlas'a ho kobeha khafetsa-tsena li baka khatello ea maikutlo e atisang ho ba le mokhathala oa koporo le lera la delamination. Melaetsa ea litsela ka ho pota-pota ho kobeha lilepe le ho sebelisa li-stiffener reinforcements tse bapileng le libaka tse feto-fetohang. Litlhaloso tse fokolang tsa radius ea bend (ka tloaelo 10 × botenya bohle) bo tlameha ho hlokomeloa nakong ea kopano le ts'ebetso ho thibela ho hlōleha ha thepa likarolong tse tenyetsehang tsa PCB.

Maikutlo a Tlhahiso le Kopano

Litlhoko tsa Bokhoni ba Tlhahiso

Ho etsa PCB e bobebe ho hloka lisebelisoa tse khethehileng le boiphihlelo ba ts'ebetso. Liboto tse tšesaane tse thata li hloka ho ts'oaroa ka mokhoa o laoloang ho thibela ho soahlamana nakong ea ts'ebetso. PCB e feto-fetohang le meaho e thata-thata e hloka bokhoni ba ho roala-to-roll, lisebelisoa tse khethehileng le ts'ebetso e laoloang ea impedance. Ha se bahlahisi bohle ba likonteraka ba nang le bokhoni bona-ho netefatsa litšoaneleho tsa feme ka litokomane tsa bokhoni ba tšebetso (setifikeiti sa IPC, litsamaiso tsa boleng tsa ISO 9001) pele u itlama ho etsa meralo e bobebe kapa e bobebe ea PCB.

Qetello ea Bokaholimo le Tšusumetso ea Kopano

Khetho ea ho qeta bokaholimo e ama ts'ebetso ea PCB e bobebe le tlhahiso ea kopano. ENIG (Electroless Nickel Immersion Gold) e fana ka libaka tse bataletseng, tse ka tšeptjoang tsa solder tse loketseng likarolo tse hlakileng empa e eketsa boima bo fokolang. HASL (Hot Air Solder Leveling) e bitsa chelete e fokolang empa e etsa libaka tse sa tšoaneng 'me e eketsa boima ba solder. Bakeng sa lits'ebetso tse bobebe haholo, nahana ka liphetho tsa OSP (Organic Solderability Preservative) tse eketsang boima ba 'mele ha li ntse li boloka ho rekisoa hantle bakeng sa bophelo bo fokolang.

Mathata a Kopano ea SMT

Li-substrate tse tšesaane li hlahisa liphephetso tse itseng tsa kopano :

• Lisebelisoa tsa tšehetso - Li-vacuum tse tloaelehileng kapa li-pin li thibela ho fetoha ha boto nakong ea ho beoa le ho phalla hape.
• Tsamaiso ea ho futhumatsa - Liboto tse tšesaane li qhala mocheso ka tsela e fapaneng; li-profiles tsa reflow li hloka phetoho ho thibela warping.
• E lekola phihlello - Sesebelisoa sa sefofane kapa ICT e thehiloeng ho fixture e kanna ea hloka litharollo tsa tloaelo bakeng sa tlhahlobo ea PCB e tšesaane kapa e tenyetsehang.

Kopa liteko tsa kopano ea fektheri bakeng sa meralo e bobebe ea PCB tlasa botenya ba 0.6mm. Lekola livideo tse bonts'ang mekhoa ea ho sebetsana le lisebelisoa tsa ho tsamaisa hape ho netefatsa hore balekane ba tlhahiso ba ka hlahisa meaho e mesesaane kapa e tenyetsehang maemong a boleng bo hlokahalang.

Teko le Botšepehi netefatso

Litlhoko tsa Teko ea Tikoloho

Dikopano tsa PCB tse bobebe tsa drone di hloka netefatso e fetang diteko tse tloaelehileng tsa motlakase. Diteko tsa ho potoloha ha mocheso (hangata -40°C ho isa ho +85°C, dipotoloho tse 100+) di netefatsa botsitso ba thepa le tshepahalo ya manonyeletso a solder ho pholletsa le maemo a mocheso wa tshebetso. Teko ya ho thothomela e bapisang maqhubu a tshebetso a drone (hangata 20-2000 Hz) e tiisa ho tiya ha mechini mme e hlwaya mekgwa e ka bang teng ya ho hloleha ha mokhathala dibakeng tse tshesane kapa dibakeng tse tenyetsehang pele ho kenngwa tshimong.

Tlhahlobo le Netefatso ea Boleng

Tlhahlobo ea optical inspection (AOI) le tlhahlobo ea X-ray e bohlokoa bakeng sa likopano tsa PCB tse bobebe. AOI e lemoha bofokoli ba bokaholimo, boleng ba solder le ho nepahala ha karolo e behiloeng. Tlhahlobo ea X-ray e netefatsa manonyeletso a solder a patiloeng, ho ngolisoa ha lera ka hare ho meaho ea li-multilayer le ho tsebahatsa li-voids kapa delamination ka liphetoho tse thata tsa flex. Bakeng sa likarolo tsa PCB tse feto-fetohang, etsa tlhahlobo ea ho kobeha ha mochini (ka tloaelo 100,000+ cycles) ho netefatsa bophelo bo feto-fetohang le botšepehi ba ho khomarela libakeng tse matla.

Lintlha tsa Litšenyehelo le Phepelo

Tšusumetso ea Litšenyehelo tsa Lintho

Khetho ea thepa e bobebe ea PCB e ama haholo moruo oa morero. FR4 e tšesaane e tloaelehileng e bitsa 10-20% feela ho feta botenya bo tloaelehileng, ha lisebelisoa tsa polyimide li matha 2-4 × ho feta FR4. Mehaho ea PCB e sa fetoheng hangata e bitsa liboto tse thata tsa 3-5× ka lebaka la ts'ebetso e ikhethang. Li-prototypes tse nyane li tobane le litšenyehelo tse phahameng tsa yuniti ka 'ngoe; tlhahiso ea molumo (li-unit tse 500+) e fokotsa litefiso ka ho ntlafatsa phanele le ts'ebetso e sebetsang hantle.

Nako ea Ketapele le Boteng

Ho ba teng ha lintho ho ama linako tsa merero. Li-substrates tsa FR4 li tloha setokong ka matsatsi a 7-10 a maiketsetso. Lisebelisoa tse khethehileng tsa polyimide kapa lebasetere li ka hloka nako ea ho etella pele ea libeke tse 2-4 bakeng sa theko ea thepa pele tlhahiso e qala. Ts'ebetso ea PCB e thata-thata e eketsa libeke tse 1-2 khahlano le liboto tse thata tse tloaelehileng. Rera linako tsa prototype ka mokhoa o nepahetseng 'me u nahane ka litlhoko tsa thepa e behiloeng- netefatsa litšoaneleho tsa bohlokoa tse nang le li-prototype tsa FR4 pele u itlama ho lisebelisoa tsa PCB tse bobebe tse etellang pele nako e telele.

Litlhahiso tse Sebetsang tsa Moralo

Mokhoa oa Moruo: Thin FR4 Solutions

Bakeng sa merero ea li-drone tse theko e boima tse nang le litlhoko tse itekanetseng tsa ts'ebetso, FR4 e tšesaane (0.8mm botenya, 0.5 oz koporo) e fana ka phokotso e sebetsang ea boima ba 'mele ha e ntse e boloka mokhoa o bonolo oa tlhahiso. Tokiso ena e lumellana le liboto tsa sensor tse nang le matla a tlase, li-module tsa telemetry le li-circuits tse thusang tsa taolo moo boima bo leng bohlokoa empa maemo a feteletseng a sa sebetse. Kakaretso ea ho fokotsa boima ba 'mele e fihla ho 30-40% ho bapisoa le maemo a 1.6mm FR4 ha ho ntse ho bolokoa mekhoa e tloaelehileng ea kopano le ho fumaneha ha mofani oa thepa.

Mokhoa o leka-lekaneng: Khethang Rigid-Flex

Ho kopanya likarolo tse thata tsa FR4 le polyimide flex ho hokahanya ts'ebetso le litšenyehelo bakeng sa lits'ebetso tse tloaelehileng tsa drone. Libaka tse thata li amohela kopano ea likarolo le ho fana ka lintlha tsa ho hloella, ha likarolo tse tenyetsehang li tlosa likhoele le ho etsa hore liphutheloana tse kopaneng. Mokhoa ona o bobebe oa PCB o sebetsa hantle bakeng sa balaoli ba lifofane ba hokahantsoeng le mapolanka a matla, lisebelisoa tsa lik'hamera tse nang le mokhoa oa ho hlalosa le ho mena meralo ea drone e hlokang lisebelisoa tsa elektronike tse kopantsoeng. Ho boloka boima ba 25-35% ho ipaka ho ka fihlelleha ka litefello tse laolehang tsa litšenyehelo.

Mokhoa o Phahameng oa Ts'ebetso: e Felletseng Polyimide Rigid-Flex

Li-platform tsa drone tse tsoetseng pele tse nang le litekanyetso tse matla tsa boima ba 'mele li rua molemo ho tsoa ho meralo e felletseng ea polyimide e thata-thata e sebelisang koporo e tšesaane (0.5 oz kapa ka tlase). Mehaho ena e fihlella ho fokotsa boima ba 'mele (50%+ khahlanong le li-PCB tse tloaelehileng) ha e ntse e fana ka ts'ebetso e ntle ea mocheso le ho hanyetsa ho sisinyeha. Likopo li kenyelletsa li-drones tsa mabelo, li-platform tsa ho lebela nako e telele le li-UAV tse ntlafalitsoeng tsa khoebo moo grama e 'ngoe le e 'ngoe ea ho fokotsa boima e eketsa bokhoni ba ts'ebetso. Litšenyehelo tse phahameng tsa boenjiniere le tsa tlhahiso li hloka tokafatso ka ntlafatso ea ts'ebetso.

Qetello: Ho ntlafatsa Khetho ea PCB e bobebe

Ha ho na thepa e le 'ngoe e rarollang litlhoko tsohle tse bobebe tsa PCB-e atlehileng ea elektroniki ea drone e hloka tradeoffs ka hloko lipakeng tsa boima, taolo ea mocheso, matla a mochini le tlhahiso. FR4 e fana ka ts'ebetso ea motheo ea moruo, polyimide e thusa ho fokotsa boima ba 'mele ka mokhoa o mabifi' me e thata-thata e felisa boima ba ho kopanya ha e ntse e ntlafatsa ho tšepahala. Khetho e ipapisitse le litlhoko tse ikhethileng tsa drone, lintho tse tlang pele ho ts'ebetso le lithibelo tsa tekanyetso ea morero.

Highleap Electronics Bokhoni ba PCB bo bobebe

Joaloka moetsi oa konteraka ea khethehileng, Highleap Electronics e ts'ehetsa baetsi ba drone ka litharollo tse felletseng tsa PCB tse bobebe:

• Liboto tse thata tse tšesaane - Meaho ea FR4 ho tloha ho 0.4mm e nang le impedance e laoloang le mamello e thata.
• PCB e tenyetsehang le e thata-thata - Meralo e thehiloeng ho polyimide e nang le ts'epo e netefalitsoeng lits'ebetsong tsa sefofane.
• Rapot prototyping - Mehlala ea boenjiniere e nang le nako ea matsatsi a 5-7 bakeng sa netefatso ea moralo.
• Tsebo ea kopano - Litšebeletso tse felletseng tsa turnkey ho kenyelletsa ho fumana likarolo, kopano ea SMT le tlhahlobo ea ts'ebetso.
• Tshebetso ponaletso - Livideo tsa fektheri le litokomane tse bonts'ang mekhoa ea ho sebetsana le meaho e bobebe.

Fumana Tšehetso ea Boenjiniere bakeng sa Morero oa Hau oa Drone

Na o hloka thuso ho kgetha thepa e nepahetseng ya PCB e bobebe bakeng sa moralo wa drone ya hao? Ikopanye le sehlopha sa rona sa boenjiniere bakeng sa tlhahlobo ya DFM, dikgothaletso tsa thepa le diqotso tsa mohlala. Re fana ka ditekolo tse qaqileng tsa ho kgoneha tse tshehetswang ke ditokomane tsa bokgoni ba tshebetso le divideo tsa tlhahiso ya mehlala, ho netefatsa hore moralo wa hao wa PCB e bobebe o fetoha hantle ho tloha mohopolong ho ya tlhahisong e tshepahalang.

Lipotso Asked hangata

Na FR4 e ka fihlela litlhoko tse bobebe bakeng sa li-quadcopter tse nyane?

E, FR4 e tšesaane (0.6-0.8mm) e sebetsa hantle bakeng sa li-quadcopter tse nyenyane tsa khoebo tse ka tlas'a 2kg boima ba ho tloha. Standard FR4 e fana ka matla a lekaneng le ts'ebetso ea mocheso ha e ntse e fokotsa boima ba 30-40% khahlanong le mapolanka a tloaelehileng a 1.6mm. Bakeng sa li-drones tsa mabelo kapa li-platform tse bobebe tse tlase ho 250g, nahana ka mekhoa e meng ea polyimide bakeng sa ho boloka boima bo eketsehileng.

Linako le litšenyehelo tse tloaelehileng tsa polyimide PCB ke life?

Polyimide rigid-flex PCB hangata e hloka libeke tse 3-4 bakeng sa bongata ba mohlala, ka litšenyehelo tsa thepa tse tsamaisang 2-4× standard FR4. Tlhahiso ea molumo (500+ units) e fokotsa litšenyehelo tsa yuniti ka 'ngoe ka ts'ebetso e ntlafalitsoeng. Letsete lena le iponahatsa le le molemo ha phokotso ea boima ba 'mele e ntlafatsa ka kotloloho ts'ebetso ea sefofane kapa ha ho tlosa likhokahano ho matlafatsa ts'epahalo lits'ebetsong tsa drone tse nang le vibrate.

Ke hlakisa litlhoko tsa PCB tse bobebe joang ho bahlahisi?

Fana ka lintlha tse hlakileng tse kenyelletsang boima ba 'mele, mocheso oa mocheso o sebetsang, litlhoko tsa vibrate le ho rarahana ha kopano. Arolelana litšitiso tsa mochini (libaka tse ntseng li eketseha, libaka tsa sehokelo) le litlhoko tsa motlakase (bokhoni ba hajoale, taolo ea impedance). Kopa maikutlo a DFM mabapi le khetho ea thepa-baetsi ba nang le boiphihlelo joalo ka Highleap Electronics ba fana ka likhothaletso tse lekanyang litlhoko tsa hau tsa ts'ebetso khahlano le bokhoni ba tlhahiso le ho ntlafatsa litšenyehelo.