MCPCB Dielectric Layer: Mokhoa oa ho Leka-lekanya Thermal Conductivity le Insulation ea Motlakase

Kenyelletso ea Moralo oa Lera la Dielectric la MCPCB

Liboto tsa Potoloho tse Hatisitsoeng tsa Metal Core li fetohile tsa bohlokoa haholo lits'ebetsong tse matla haholo tse akaretsang litsamaiso tsa mabone a LED, li-module tsa phetoho ea motlakase, le lisebelisoa tsa elektroniki tsa likoloi moo tsamaiso ea mocheso e amang ts'epo ea sesebelisoa ka kotloloho. Lera la dielectric la MCPCB le sebetsa e le sebopeho sa bohlokoa lipakeng tsa mesaletsa ea potoloho le substrate ea tšepe, ka nako e le 'ngoe le fana ka insulation ea motlakase ha ka nako e ts'oanang le thusa phetiso e sebetsang ea mocheso ho tloha likarolong ho ea poleiting ea motheo.

Ts'ebetso ena e habeli e etsa hore moralo oa lera la dielectric e be e 'ngoe ea lintlha tsa bohlokoahali tse khethollang ts'ebetso ea boto ka kakaretso lits'ebetsong tse sebelisang mocheso o matla. Phephetso e mabapi le ho leka-lekanya litlhoko tsa tlholisano: likarolo tse tšesaane li ntlafatsa conductivity ea mocheso empa li sekisetsa matla a dielectric, ha khetho ea thepa e ama bobeli ho khoneha ha tlhahiso le ho tšepahala ha nako e telele.

Ho utloisisa mokhoa oa ho ntlafatsa botenya le thepa ea thepa ea MCPCB ea dielectric ho thusa baenjiniere ho etsa liboto tse fihlelang litlhoko tse khethehileng tsa mocheso le motlakase ntle le boenjiniere bo feteletseng kapa ho hlahisa litšenyehelo tse sa hlokahaleng.

Mesebetsi ea mantlha ea MCPCB Dielectric Layer

Tsamaiso ea Ts'ebetso ea Mocheso

Dielectric layer e sebetsa e le sehokelo sa mantlha sa mocheso se tsamaisang mocheso ho tloha ho copper circuitry ho ea aluminium kapa copper base plate. Ho hanyetsa mocheso ka lera lena ho latela equation R = t/(k·A), moo t e emelang botenya, k e bolelang conductivity ea mocheso, 'me A e bontša sebaka se fapaneng.

Kamano ena e senola hore na ke hobane'ng ha esita le diphetoho tse nyane tsa botenya ba lera la dielectric la MCPCB kapa kgetho ya thepa di ama haholo dithempereichara tsa dikopano dikarolong tse nang le matla a maholo. Ditshebedisong tsa LED tse sebetsang ka bongata ba 3-5 W/cm², ho fokotsa khanyetso ya mocheso wa dielectric ka 0.5 °C·cm²/W ho ka fokotsa dithempereichara tsa dikopano ka 15-25°C, e leng se eketsang nako ya tshebetso ka ho toba.

Litlhoko tsa ho itšehla thajana tsa Motlakase

Ka ntle ho taolo ea mocheso, lera la dielectric le tlameha ho boloka botšepehi ba motlakase tlas'a li-voltages tse sebetsang ha li ntse li thibela ho senyeha kapa ho latella pakeng tsa mesaletsa ea potoloho le substrate ea tšepe e thehiloeng. Matla a dielectric hangata a tloha ho 2-4 kV bakeng sa lisebelisoa tse tloaelehileng tsa polyimide ho ea ho 10 kV bakeng sa metsoako e khethehileng e tlatsitsoeng ka ceramic.

Lisebelisoa tse kenyelletsang motlakase o phahameng kapa maemo a thata a tikoloho a hloka khetho e hlokolosi ea lisebelisoa ho netefatsa hore ho na le meeli e lekaneng ea polokeho. Thepa ea ho kenya letsoho e tlameha ho boloka thepa ea dielectric e tsitsitseng ho pholletsa le mocheso o sebetsang, oo lits'ebetsong tsa likoloi kapa tsa indasteri li ka tlohang ho -40 ° C ho ea +150 ° C.

Khetho ea Lisebelisoa tsa Dielectric bakeng sa MCPCB

Mekhoa e Tloaelehileng ea Material

Khetho ea thepa e loketseng ea ho kenya mocheso e khetholla litšobotsi tsa ts'ebetso ea lera la dielectric la MCPCB. Lihlopha tse tharo tsa mantlha tsa thepa li laola tlhahiso ea boto ea mantlha ea tšepe ea sejoale-joale :

• Dielectrics tse Tlwaelehileng tsa Polyimide - Fana ka conductivity ea mocheso ea 0.2-0.5 W / mK e nang le ts'ebetso e ntle ea ts'ebetso bakeng sa lisebelisoa tse tloaelehileng tsa PCB lamination, ho fana ka ts'ebetso e lekaneng bakeng sa lits'ebetso tsa motlakase tse itekanetseng ha u ntse u boloka litšenyehelo le tlhahiso ea scalability.
• Lisebelisoa tse ntlafalitsoeng tsa polymer - Kenyelletsa li-filler tsa ceramic ho fihlela 1-3 W / mK mocheso oa mocheso, ho koala lekhalo lipakeng tsa lipolymer tsa mantlha le lisebelisoa tse felletseng tsa ceramic ha u ntse u boloka tšebelisano e loketseng ea ts'ebetso le sebopeho sa litšenyehelo.
• Lisebelisoa tsa Ceramic tse tsoetseng pele - Lisebelisoa tse kenyeletsang aluminium nitride (AlN) le silicon nitride (Si₃N₄) e thehiloeng dielectrics e fana ka conductivity ea mocheso ho tloha 3-8 W / mK, e atamela ts'ebetsong ea koporo e tobileng e kopantsoeng ka li-substrates tsa ceramic bakeng sa lisebelisoa tse feteletseng tsa mocheso oa mocheso.

Litekanyetso tsa Khetho ea Lintho

Khetho ea thepa bakeng sa lera la dielectric la MCPCB e hloka ho leka-lekanya ho tsamaisa mocheso khahlanong le matla a dielectric, ho lumellana ha ts'ebetso, le lithibelo tsa litšenyehelo. Lisebelisoa tsa ho tsamaisa mocheso ka bongata ka tlhaho li fokotsa khanyetso ea mocheso empa li ka bontša matla a dielectric a tlase ka botenya ba yuniti, e leng se hlokang likarolo tse teteaneng tse fokotsang phaello ea mocheso ka karolo e itseng.

Thepa e nepahetseng e ipapisitse le litlhoko tse khethehileng tsa phallo ea mocheso, matla a ho sebetsa, maemo a tikoloho, le moruo oa tlhahiso. Tšebelisano ea tlhahiso e fetela ka nģ'ane ho lamination ea pele ho kenyelletsa lintlha tsa ho cheka, ho tsamaisa litsela, ho qeta holim'a metsi, le mekhoa ea kopano e ka 'nang ea hatisa lera la dielectric.

MCPCB Dielectric Layer Thickness Control

Tšusumetso ho Ts'ebetso ea Thermal le Motlakase

Botenya ba dielectric bo laola ka kotloloho ho hanyetsa mocheso pakeng tsa lera la potoloho le motheo oa tšepe, ka mefuta e tloaelehileng ea 50-200 μm ho latela litlhoko tsa kopo. Ho fokotsa botenya ho tloha ho 100 μm ho isa ho 75 μm ka thepa ea 2 W/mK ho fokotsa ho hanyetsa mocheso ka 25%, ho tsamaellanang le phokotso e kholo ea mocheso oa matekoane ho meralo ea matla a phahameng.

Leha ho le joalo, phaello e fokotsehang e etsahala ha botenya bo ntse bo atamela meeli ea bokhoni ba tlhahiso. Lintlha tsa motlakase li qobella bonyane botenya ho ipapisitsoe le maemo a hlokahalang a ho robeha le polokeho.

Lera la dielectric la 100 μm MCPCB le matla a dielectric a 3 kV/mm le fana ka matla a ho senya a 300V, a lekaneng bakeng sa lisebelisoa tse ngata tsa LED le tse itekanetseng. Meralo e phahameng ea motlakase e ka laela botenya ba 150-200 μm esita le moo ts'ebetso ea mocheso e ka ruang molemo kahong e nyane.

Mekhoa ea ho ntlafatsa

Botenya bo nepahetseng ba MCPCB dielectric layer bo hlaha ho tsoa ho mohlala oa mocheso o kenyelletsang ho felloa ke matla ha 'nete, sebopeho sa likarolo, le maemo a tikoloho khahlano le litlhoko tsa motlakase tse hlalosoang ke matla a ho sebetsa le litekanyetso tsa polokeho. Bokhoni ba tlhahiso bo theha moeli o tlase o sebetsang, hangata 50-75 μm bakeng sa lits'ebetso tsa tlhahiso ea molumo.

Meeli e kaholimo ho 200-250 μm e boloka ts'ebetso e amohelehang ea mocheso ha e ntse e fana ka matla a lekaneng a dielectric. Ho lumellana ha botenya ho pholletsa le phanele ho ama botsitso ba mocheso le motlakase, ka taolo ea tlhahiso e shebileng ± 10% ho fapana ha botenya ho netefatsa ts'ebetso e lebelletsoeng esale pele.

Advanced lamination dithulaganyo sebelisa calibrated prepreg litsamaiso finyella tolerances tighter ha litlhoko kopo lokafatsa tshebetso taolo ya tlatsetso. Lintlha tsa bohlokoa bakeng sa ntlafatso ea botenya li kenyelletsa:

• Litlhoko tsa Mocheso - Bala palo e phahameng ka ho fetesisa e lumelletsoeng ea ho hanyetsa mocheso ho ipapisitse le ho felloa ke matla ha karolo le mocheso o lebetsoeng oa mateano, ebe u fumana meeli ea botenya bakeng sa thepa e khethiloeng ea dielectric.
• Mekhahlelo ea Tšireletso ea Motlakase - Theha bonyane botenya bo ipapisitseng le maemo a phahameng a matla a ho sebetsa a atisitsoeng ke lintlha tse nepahetseng tsa polokeho (hangata 2-3x) le lintlha tsa matla a dielectric.
• Maikutlo a ho Etsa - Ak'haonte bakeng sa liphetoho tse sebetsang tsa masela lits'ebetsong tsa lamination, ho netefatsa hore lifensetere tsa litlhaloso li amohela phapang e tloaelehileng ea tlhahiso ntle le ho sekisetsa ts'ebetso.

Mehopolo ea Tlhahiso bakeng sa MCPCB Dielectric Layers

Lamination le Processing

Mealo ea dielectric e thehiloeng esale pele e sebelisa lits'ebetso tse tloaelehileng tsa lamination tsa PCB tse etselitsoeng li-substrate tsa tšepe , tse hlokang liprofaele tse fetotsoeng tsa khatello le mocheso ho amohela litšobotsi tse fapaneng tsa katoloso ea mocheso. Karolo ea tšepe e sebetsa e le setsi sa bohlokoa sa mocheso nakong ea lamination, e hlokang linako tse telele tsa ho futhumatsa le taolo e nepahetseng ea mocheso ho fihlela phallo le ho khomarela resin hantle.

Pheko e sa phethahalang kapa tlamahano e sa lekaneng e senya phetisetso ea mocheso le botšepehi ba motlakase oa lera la dielectric la MCPCB. Coefficient of thermal expansion (CTE) e sa lumellaneng pakeng tsa lera la dielectric, copper circuitry, le metal substrate e baka khatello ea mochine nakong ea ho palama baesekele e futhumetseng.

Khetho e nepahetseng ea thepa e tiisa ho lumellana ha CTE ka har'a meeli e amohelehang, ka tloaelo e lebisa tlhokomelo ea dielectric CTE ka hare ho 5-10 ppm / ° C ea tšepe ea motheo ho fokotsa ho hlōleha ho bakoang ke khatello ea kelello nakong ea bophelo bohle ba ts'ebetso.

Taolo ea boleng le liteko

Ho netefatsa ts'ebetso e tsitsitseng ea MCPCB dielectric layer ho hloka liprothokholo tse felletseng tsa tlhahlobo ho pholletsa le tlhahiso:

• Teko ea Matla a Dielectric - Teko ea pitsa e phahameng ka li-voltage tse kaholimo ho ts'ebetso e lekantsoeng, hangata motlakase o sebetsang oa 2-3x bakeng sa tlhahlobo ea tlhahiso, e netefatsa bots'epehi ba motlakase le ho supa bofokoli bo ka bang teng pele ho kopano.
• Tekanyo ea ho hanyetsa Mocheso - Thermal impedance test equipment e tiisa ts'ebetso ea ho fetisa mocheso, ho khetholla mefuta e fapaneng ea ts'ebetso kapa ho se lumellane ha lintho tse ka senyang tsamaiso ea mocheso ts'ebetsong ea ho qetela.
• Tlhahlobo ea Microsection - Teko e senyang ho disampole tse emelang e netefatsa botenya ba dielectric, dikahare tse se nang letho, le boleng ba bonding ba sefahleho bakeng sa ho tšoaneleha ha ts'ebetso le ho lekola boleng bo tsoelang pele nakong eohle ea tlhahiso.

Qetello: Ho ntlafatsa Ts'ebetso ea Layer ea Dielectric ea MCPCB

Moralo o sebetsang hantle oa lera la dielectric la MCPCB o hloka mokhoa o hlophisehileng o leka-lekaneng ts'ebetso ea mocheso, ho kenya motlakase, thepa ea thepa le litšitiso tsa tlhahiso. Lera la dielectric ke senotlolo sa mantlha sa mocheso ho li-PCB tsa mantlha tsa tšepe, 'me ts'ebetso ea eona e bohlokoa ho fihlela mocheso oa karolo e lebisitsoeng, ts'epo ea sistimi le bophelo bo bolelele ba sesebelisoa. Menahano e joalo ka khetho ea thepa, taolo ea botenya, ho bapisa CTE, le ts'ebetso ea ts'ebetso ea lamination e bohlokoa bakeng sa ho netefatsa ts'ebetso e tsitsitseng.

Bokhoni ba Highleap Electronics:

• Khetho e Nepahetseng ea Thepa - Re thusa bareki ho khetha thepa ea dielectric e nang le conductivity e ntle ea mocheso le matla a dielectric.

• Ntlafatso ea Botenya - Mekhoa ea rona e netefatsa hore likarolo tsa dielectric li fihlela litlhoko tsa mocheso le tsa motlakase ka har'a mamello ea tlhahiso.

• Taolo ea Ts'ebetso le Tiisetso ea Boleng - Tlhokomelo ea lamination, ho bapisa CTE, le liteko tsa netefatso li tiisa ts'ebetso e tšepahalang ea boto.

• Mokhoa o Kopantsweng wa Sistimi – Re nahana ka tshebetso ya lera la dielectric moelelong wa sebopeho sa PCB ka kakaretso, kgetho ya dikarolo, le meralo ya mocheso.

Selekane le Highleap Electronics bakeng sa tlhahiso ea MCPCB e nang le likarolo tsa dielectric tse laoloang ka nepo, ho fana ka liboto tse kopanang le lits'ebetso tse hlokang mocheso ha ho ntse ho netefatsa ts'epo ea nako e telele ea ts'ebetso.