Metal Core PCB Manufacturing | Tataiso e Feletseng ea Ts'ebetso

Kenyelletso ea Metal Core PCB Manufacturing

Ho Hlahisa Methapo ea Methapo ea PCB ho emela karolo e khethehileng ea tlhahiso ea boto ea potoloho e hatisitsoeng e etselitsoeng ka ho khetheha lits'ebetso tse hlokang taolo e phahameng ea mocheso. Ho fapana le liboto tsa setso tsa FR-4 , li-PCB tsa mantlha tsa tšepe li kopanya li-substrate tsa aluminium, koporo, kapa tšepe tse fanang ka bokhoni bo ikhethang ba ho qhala mocheso bo hlokahalang bakeng sa lisebelisoa tsa elektroniki tse matla haholo.

Phapang ena ea motheo kahong e etsa hore li-MCPCB li be bohlokoa haholo litsamaisong tsa mabone a LED, li-module tsa phetoho ea matla, le lisebelisoa tsa elektroniki tsa likoloi moo katleho ea mocheso e amang ts'ebetso le bophelo bo bolelele ka ho toba. Ts'ebetso ea tlhahiso e hloka taolo e nepahetseng mohatong o mong le o mong ho boloka tekano e bonolo lipakeng tsa ho itšehla thajana ha motlakase le ho tsamaisoa ha mocheso.

Ho utloisisa lits'ebetso tsena tse khethehileng tsa tšepe tsa mantlha tsa PCB ho thusa baenjiniere le baqapi ho ntlafatsa maemo a bona a potoloho bakeng sa ts'ebetso e phahameng ea mocheso le motlakase. Tataiso ena e hlahloba mohato o mong le o mong oa bohlokoa ts'ebetsong ea tlhahiso, e fana ka leseli mabapi le lintlha tsa tekheniki tse khethollang tlhahiso ea boleng ba MCPCB.

Tokisetso ea lintho tse bonahalang ka Metal Core PCB Fabrication

Khetho ea Substrate le Boitokisetso

Motheo oa Metal Core PCB Manufacturing e atlehang o qala ka khetho e hlokolosi ea thepa le litokisetso. Metal substrates e khaotsoe ka litekanyo tse nepahetseng tse ipapisitseng le litlhoko tsa phanele, ka khetho ea thepa e amang ts'ebetso ea mocheso ka kotloloho le katleho ea litšenyehelo.

Lisebelisoa tse tharo tsa mantlha tsa substrate li fana ka litšobotsi tse ikhethang:

• Lisebelisoa tsa aluminium fana ka tekanyo e nepahetseng ea conductivity ea mocheso (ho tloha ho 1.0 ho isa ho 2.5 W/m·K), boima bo bobebe, le katleho ea litšenyehelo, e leng se etsang hore e be khetho e tloaelehileng ka ho fetisisa bakeng sa LED le lisebelisoa tse akaretsang tsa mocheso.
• Li-substrates tsa koporo fana ka matla a phahameng a mocheso (ho fihla ho 400 W/m·K) bakeng sa litlhoko tse feteletseng tsa mocheso empa ka litšenyehelo tse phahameng haholo le boima ba 'mele.
• Lisebelisoa tse thehiloeng ka tšepe fana ka thepa e ikhethang ea motlakase le coefficient ea matching a ho atolosa mocheso bakeng sa lits'ebetso tse ikhethileng tse hlokang botsitso ba sebopeho.

Tokisetso ea Lera la Dielectric

The dielectric insulation layer e hloka tlhokomelo e lekanang nakong ea ho lokisoa ha thepa ts'ebetsong ea tlhahiso ea mcpcb. Thepa ena e kenyang mocheso empa e le motlakase hangata e na le li-resin tse khethehileng tsa epoxy tse tlatsitsoeng ka likaroloana tsa ceramic tse etsang hore mocheso o fetisetsoe ha o ntse o boloka motlakase o le mong.

Khetho ea botenya ba koporo e ipapisitse le litlhoko tsa hona joale tsa ho jara le bokhoni ba etching. Likhetho tse tloaelehileng li tloha ho 1 oz ho isa ho 3 oz boima ba koporo bakeng sa lisebelisoa tse ngata tsa tšepe tsa mantlha tsa PCB, tse nang le koporo e boima e sebelisoang bakeng sa lisebelisoa tsa motlakase tsa morao-rao.

Ts'ebetso ea ho cheka ka Metal Core PCB Manufacturing

Precision Hole Formation

Ts'ebetso e nepahetseng ea ho cheka ts'ebetsong ea tlhahiso ea mcpcb e hloka lisebelisoa tse khethehileng tse khonang ho sebetsana le litšepe tse thata ntle le ho senya boleng ba lesoba. Ho cheka ka mechine ka likotoana tsa carbide kapa tse koahetsoeng ke daemane e ntse e le mokhoa o tloaelehileng oa likoti, ho boloka ho nepahala ho sa tsotellehe boima ba substrate.

Ho cheka ka laser ho fana ka melemo bakeng sa tse nyane ka libopeho tsa meralo e matla haholo moo mefokolo ea mochini e thibelang boholo ba likotoana tsa ho cheka. Mekhahlelo ea ho cheka e tlameha ho ikarabella bakeng sa ho thatafala ha mokokotlo oa tšepe ho thibela sebopeho sa li-burr le ho etsa bonnete ba hore mabota a masoba a hloekileng a nolofalletsang ho pola kapa ho kenya likarolo.

Kalafo ka mor'a ho cheka

Mekhoa ea ho hloekisa kamora ho cheka e ba ea bohlokoa haholo ho Metal Core PCB Manufacturing ho tlosa lithōle tsa tšepe tse ka behang kotsing ho itšehla thajana ha motlakase. Likhokahano tse phunyeletsang ka har'a li-MCPCB hangata li sebeletsa mesebetsi ea motlakase ho fapana le litsela tsa mocheso, kaha substrate ea tšepe e sebetsana le ho qhala ha mocheso oa mantlha.

Phapang ena e susumetsa ka maano a ho beha 'me e netefatsa hore litsela tsa mocheso le motlakase li ntlafatsoa ka boikemelo. Ho tlosoa ha litšila ka mokhoa o nepahetseng ho thibela lifupi tse ka bang teng pakeng tsa lera la potoloho le mokokotlo oa tšepe nakong ea mehato e latelang ea ho sebetsa.

Ts'ebetso ea Lamination ka Metal Core PCB Manufacturing

Tlamahano e Phahameng ea Khatello

Lamination e emela mohato oa bohlokoa ka ho fetisisa ts'ebetsong ea tlhahiso ea mcpcb, moo substrate ea tšepe, lera la dielectric, le koporo ea potoloho li kopanang ka ho sa feleng tlas'a mocheso o laoloang le khatello. Liparamente tsa lamination li khetholla ka ho toba boleng ba sebopeho sa mocheso lipakeng tsa mekhahlelo, e amang phallo ea mocheso ka kakaretso ho tloha likarolong ho ea bohareng ba tšepe.

Lithempereichara tsa khatiso hangata li tloha ho 170 ° C ho ea ho 210 ° C ho itšetlehile ka tsamaiso ea lisebelisoa tsa dielectric, ka likhatello tse lekantsoeng ho felisa li-voids ntle le ho senya karoloana ea tšepe. Nako ea ts'ebetso le boemo ba khatello e tlameha ho ntlafatsoa bakeng sa motsoako o mong le o mong oa thepa ho fihlela matla a maholo a bond le ts'ebetso ea mocheso.

Tsamaiso ea Mocheso Nakong ea Pholiso

Potoloho tsidifatso latelang lamination hloka tsamaiso e hlokolosi ho thibela delamination kapa ntshetsopele ya ka hare khatello ea kelello. Meetso ea sejoale-joale ea tšepe ea PCB e sebelisa li-profiles tse pholileng tse ikarabellang bakeng sa katoloso e fapaneng ea mocheso lipakeng tsa likarolo tsa koporo, dielectric le tšepe.

Tlhokomelo ena ea taolo ea mocheso nakong ea tlhahiso e fetolela ka kotloloho ho ts'epo e ntlafalitsoeng tikolohong ea ts'ebetso ea sehlahisoa se felileng. Litefiso tse laoloang tsa ho pholisa li thibela warpage le ho etsa bonnete ba botsitso ba sebopeho ho pholletsa le bophelo ba boto.

Kopo ea Mask ea Solder ho Metal Core PCB Manufacturing

Mokhoa oa ho roala le ho folisa

Ho roala maske a solder ho Metal Core PCB Manufacturing ho sebeletsa merero e 'meli ea ho fana ka mokelikeli oa motlakase le ho hlalosa libaka tse rekisoang bakeng sa ho kopanya likarolo. Mokhoa oa ts'ebeliso, ekaba oa ho hatisa skrineng kapa oa ho roala likharetene, o tlameha ho fihlela botenya bo ts'oanang holim'a karolo e thata ea tšepe.

Litaelo tsa pheko bakeng sa mask a solder li hloka phetoho ha li bapisoa le liboto tsa FR-4, kaha boima ba mocheso oa tšepe bo susumetsa kabo ea mocheso nakong ea pheko. Mekhoa e tloaelehileng ea phekolo e sebelisa mocheso o pakeng tsa 140 ° C le 160 ° C ka nako e telele ea ho lula ho netefatsa hore polymerization e feletseng.

Botenya bo Matla

Botenya ba mask a solder bo ama ka kotloloho ts'ebetso ea ho qetela ea mocheso oa boto le ho ts'epahala ha kopano. Li-mask tse tšesaane li fana ka phallo e ntle ea mocheso ho tsoa ho likarolo empa li fana ka ts'ireletso e fokolang ea mochini, e hlokang ho ntlafatsoa ka hloko ho latela litlhoko tsa ts'ebeliso.

Ho khomarela mask ka mokhoa o nepahetseng ho lera la dielectric le ho nepahala ha lipeo ho netefatsa hore ho na le soldering e ka tšeptjoang le khanyetso ea nako e telele ea tikoloho. Khatiso ea tšōmo bakeng sa boitsebahatso ba likarolo e latela ts'ebeliso ea mask ea solder, e sebelisa li-inks tse phekolehang ka UV tse mamellang mocheso oa kopano.

Surface Finish Selection bakeng sa Metal Core PCB Fabrication

Likhetho tsa ho qeta ka holim'a ts'ebetso ea tlhahiso ea mcpcb li susumetsa haholo ho ts'epahala ha kopano le ts'ebetso ea mocheso. Khetho e tlameha ho leka-lekanya ho solderability, shelf life, thermal conductivity, le litšenyehelo tse tobileng litlhoko tsa kopo.

Likhetho tse tloaelehileng tsa ho qetela tsa sefahleho li kenyelletsa:

• ENIG (Electroless Nickel Immersion Gold) e fana ka setaele se setle haholo bakeng sa likarolo tsa molumo o hlakileng, bophelo bo phahameng ba shelofo bo fetang likhoeli tse 12, le bokhoni bo tšepahalang ba ho tlama mohala, e etsa hore e be e loketseng bakeng sa likopano tsa MCPCB tse ts'epahalang haholo tse hlokang polokelo e atolositsoeng.
• HASL (Hot Air Solder Leveling) e fana ka solderability e matla le melemo ea litšenyehelo empa e ka baka mefuta e fapaneng ea botenya e amang lisebelisoa tsa sehokelo sa mocheso, ka mefuta e se nang loto e ratoang bakeng sa ho latela RoHS.
• OSP (Organic Solderability Preservative) e fana ka libaka tse bataletseng le ho lumellana le tikoloho ka nako e khuts'oane ea shelofo, e loketseng merero e potlakileng moo liboto li tsoelang pele ho kopana.

Khetho ea ho qetela ha e ame feela ho solderability empa hape le sebopeho sa mocheso lipakeng tsa likarolo tse kopaneng le PCB. Lisebelisoa tse ling li fana ka litšoaneleho tse betere tsa ho kolobisa tse ntlafatsang phetisetso ea mocheso ho tloha ho karolo e etellang pele ka manonyeletso a solder ho ea mesaletsa ea koporo ho Metal Core PCB Manufacturing.

Teko le Taolo ea Boleng ho Metal Core PCB Manufacturing

Netefatso ea Motlakase

Liprothokholi tse felletseng tsa tlhahlobo li khetholla profeshenale ea Metal Core PCB Manufacturing ho tsoa ho tlhahiso e tlase. Teko ea motlakase ka mokhoa o fofang kapa mekhoa e thehiloeng ho fixture e netefatsa tsoelo-pele ea potoloho le ho itšehla thajana, ka ho khetheha ho shebisisa motlakase oa dielectric pakeng tsa mekhahlelo ea potoloho le motheo oa tšepe.

Liteko tsena li tiisa hore lera la ho thibela mocheso le boloka botsitso ba lona ho sa tsotelehe khatello ea mocheso le ea mechine ea ts'ebetso ea tlhahiso. Litlhoko tse tloaelehileng tsa motlakase oa ho senyeha li feta 2500V bakeng sa lits'ebetso tse ngata tsa MCPCB , ka meeli e phahameng bakeng sa lisebelisoa tsa elektroniki tsa bohlokoa tsa likoloi kapa tsa indasteri.

Teko ea Mocheso le Mechini

Teko ea ts'ebetso ea mocheso e netefatsa litšobotsi tsa ho qhala mocheso tse bohlokoa ho ts'ebetso ea MCPCB. Tekanyetso ena e ka kenyelletsa litekanyo tsa ho thibela mocheso oa mocheso kapa setšoantšo sa mocheso tlas'a maemo a matla ho netefatsa hore mocheso o phalla joalo ka ha o raliloe ho tloha libakeng tse chesang ho ea ho karoloana ea tšepe.

Litlhahlobo tsa mochini li hlahloba delamination, matla a ho khomarela a koporo, le ho nepahala ha boholo ho phanele. Teko ea matla a peel e netefatsa bond ea dielectric-to-metal e kopana le litlhaloso tse fokolang, hangata tse fetang 8 N/mm bakeng sa ts'ebetso e tšepahalang.

Ho ikamahanya le maemo a IPC-6012 Sehlopha sa 2 kapa sa 3 ho netefatsa boleng bo tsitsitseng bo loketseng litlhoko tsa kopo. Litokomane tsa taolo ea ts'ebetso le liphetho tsa liteko li fana ka traceability ea bohlokoa bakeng sa tlhahiso ea tšepe ea mantlha ea PCB e tšepahalang haholo.

Qetello: Bokhabane ho Metal Core PCB Manufacturing

Ho etsa Metal Core PCB ho kenyelletsa lits'ebetso tse ngata tse ikhethileng, e 'ngoe le e' ngoe e le ea bohlokoa ho fihlela ts'ebetso e nepahetseng ea mocheso, motlakase le mochini. Ho tloha khethong ea thepa ho isa tekong ea ho qetela, taolo e nepahetseng ea ts'ebetso e netefatsa hore li-MCPCB li fihlela litlhoko tse batloang ke lisebelisoa tsa elektroniki tse matla haholo.

Bokhoni ba Highleap Electronics

• Phatlalatso ea MCPCB Manufacturing - Mekhoa e tsoetseng pele e kenyelletsang ho cheka, etching, lamination, top finishing, le liteko.
• Ntlafatso ea Mocheso le Motlakase - Ho leka-lekanya ho felloa ke mocheso, ho itšehla thajana ha motlakase, le ho ts'epahala ha mochini ka taolo e nepahetseng ea ts'ebetso.
• Tšehetso ea ho Qetela - Ho tloha ho prototype ho ea ho tlhahiso ea bongata, ho netefatsa moralo-bakeng sa tlhahiso tšebelisano 'moho le boleng bo tsitsitseng.
• Sehlopha sa Boenjiniere ba Setsebi - Tataiso ea tekheniki ho rarolla mathata a thata a mocheso lits'ebetsong tsa matla a phahameng.

Ho sebelisana le Highleap Electronics ho fa baenjiniere le bahlahisi ba lihlahisoa monyetla oa ho fumana bokhoni bo khethehileng ba MCPCB le boiphihlelo bo pakiloeng. Ikopanye le sehlopha sa rona kajeno ho buisana ka hore na re ka tšehetsa projeke ea hau e latelang ea lisebelisoa tsa elektroniki tse matla ka litharollo tse tšepahalang tsa PCB tsa mantlha tsa tšepe.