Mathata a Metal Core PCB Fabrication le Mokhoa oa ho a Rarolla

Selelekela

Liboto tsa Potoloho tse Hatisitsoeng tsa Metal Core (MCPCBs) li fetohile tsa bohlokoa haholo mabone a LED a matla a phahameng, lisebelisoa tsa elektroniki tsa likoloi, le litsamaiso tsa phetoho ea motlakase ka lebaka la bokhoni ba tsona bo phahameng ba taolo ea mocheso. Leha ho le joalo, liphephetso tsa tlhahiso ea MCPCB li hlahisa mathata a bohlokoa a khethollang ts'ebetso ena ho tlhahiso e tloaelehileng ea FR4.

Phapang ea mantlha e mabapi le ho kopanya li-circuits tsa koporo ho li-substrates tsa tšepe-hangata aluminium kapa koporo-ka likarolo tse khethehileng tsa dielectric, ho baka mathata a ikhethang a mocheso, mochini le ho sebetsa. Liqholotso tsena li bakoa ke ho se tsamaisane ha thepa, litlhoko tse thata tsa ho bata, le tikoloho e hlokang mocheso eo liboto tsena li tlamehang ho e mamella.

Sengoliloeng sena se hlahloba litšitiso tsa mantlha tse kopaneng nakong ea ha ho etsoa tšepe ea mantlha ea PCB mme se fana ka litharollo tse sebetsang tsa boenjiniere tse netefatsang boleng le ts'ebetso e tsitsitseng.

Phapang ea Katoloso ea Mocheso: Phephetso e Bohlokoa ea Tlhahiso ea MCPCB

Ho Utloisisa Phephetso

Phephetso e kholo ea tlhahiso ea MCPCB ke ho laola ho se lumellane ha katoloso ea mocheso har'a setsi sa aluminium, foil ea koporo le lesela la dielectric. Li-coefficients tsa bona tse fapaneng tsa ho atolosa mocheso (CTE) - hoo e ka bang 23 ppm / ° C bakeng sa aluminium, 17 ppm / ° C bakeng sa koporo, le 30-80 ppm / ° C bakeng sa dielectrics - li hlahisa khatello ea kelello ka hare nakong ea ho futhumatsa le ho pholile.

Nakong ea lamination ka holimo ho 150 ° C, liphapang tsena tsa CTE li baka delamination, dielectric cracking, kapa deformation ea boto. Ho futhumatsa ka potlako kapa likarolo tsa tšepe tse teteaneng ho matlafatsa khatello ea maikutlo, ha libaesekele tse phehoang ka mocheso li fokolisa butle-butle ho khomarela li-interlayer, tse lebisang litabeng tsa nako e telele tsa ho tšepahala.

Litharollo Tse Sebetsang

• Dielektri tse Tswang ho CTE – Khetha thepa ya dielektri tse nang le boleng ba CTE pakeng tsa koporo le aluminium. Dielektri tse tletseng ceramic di fana ka katoloso e leka-lekaneng le ho tsamaisa mocheso ka bongata (≥2 W/m·K).

• Profaele ea Lamination e Laoloang – Sebelisa rampo ea mocheso ea 2–3 °C/min e nang le nako e lekaneng ea ho phomola bakeng sa ho phomola khatello ea maikutlo pele e pholile.

• Karolelano e Lekaneng ea Botenya – Boloka karolelano ea botenya ba motheo oa koporo le tšepe pakeng tsa 1:10 le 1:15 ho aba khatello ka ho lekana.

• Moralo oa Potoloho e Tšoanang - Boloka kabo e leka-lekaneng ea koporo ho fokotsa ho fetoha ha lintho nakong ea potoloho ea mocheso.

Mekhoa ena e kopantsoeng e fokotsa ka katleho liphoso tse amanang le CTE le ho ntlafatsa ho tšepahala ha MCPCB.

Taolo ea Warpage ho Mathata a Tlhahiso ea MCPCB

Bothata ba Warpage

Taolo ea leqephe la ntoa ke phephetso e 'ngoe ea bohlokoa ea tlhahiso ea MCPCB, haholo libotong tse kholo ho feta 200 mm. Esita le ho kheloha ha 0.5 mm ho ka ama ho nepahala ha sebaka sa SMT le ho etsa likheo tsa moea tse fokotsang phetisetso ea mocheso ho heatsinks.

Meetso ea asymmetric e nang le kabo e sa lekanang ea koporo lipakeng tsa mekhahlelo ke eona sesosa se ka sehloohong. Ha lehlakore le leng le na le lipotoloho tse teteaneng 'me le leng le sala le se na letho, ho fokotseha ha phapang nakong ea ho pholile ho lebisa ho inameng. Khatello e sa tsitsang ea lamination kapa cushioning e sa lekaneng ka har'a li-vacuum presses e eketsa khatello ea kelello e setseng, e bakang warpage ka mor'a ho pholile.

Litharollo Tse Atlehang

• Moralo oa Symmetric Stackup - Sebelisa kabo e leka-lekaneng ea koporo ka mahlakoreng ka bobeli a lera la dielectric ho leka-lekanya matla a ho nyenyefatsa nakong ea ts'ebetso ea mocheso.
• Ho lefella Mekhoa ea Koporo - Bakeng sa meralo ea asymmetric, eketsa libaka tsa koporo tse sa sebetseng kapa mesh ka lehlakoreng le leng ho boloka botsitso ba sebopeho.
• Lamination Lamination Pressure - Boloka khatello ho pota 15-25 kg / cm² le litekanyetso tsa ho pholisa ka tlase ho 3 °C / min ho thibela ho koaloa ha khatello ea kelello.
• Ho fetisoa ka mor'a Lamination Annealing - Sebelisa annealing e imollang khatellong ea maikutlo mochesong oa 20-30 °C ka tlase ho sebaka sa phetoho ea khalase ea dielectric ho ntlafatsa botsitso ba ho bata.
• Ho batalatsa ka Thuso ea Fixture - Sebelisa lisebelisoa tsa mochini nakong ea pheko ea ho qetela ho fihlela sephara ka hare ho 0.3 mm ka bolelele ba 100 mm.

Mehato ena e fokotsa ntoa ka katleho le ho netefatsa botsitso ba mochini ho pholletsa le ts'ebetso ea tlhahiso ea MCPCB.

Lamination le Dielectric Botšepehi ho MCPCB Manufacturing

Dielectric Cracking Mathata

Bofokoli ba lamination le ho phatloha ha dielectric ke liphephetso tse kholo tsa tlhahiso ea MCPCB tse amang ts'epahalo ea insulation le ts'ebetso ea phetisetso ea mocheso. Hangata mapetsong a hlaha haufi le mapheo a boto kapa masoba, a etsa litsela tse ka bang teng bakeng sa ho robeha ha motlakase.

Le libaka tse nyane tsa delamination li theha likheo tsa moea tse hanyetsanang le mocheso ho fihlela makhetlo a 100 ho feta libaka tse tlanngoeng, e leng se bakang libaka tse hotspots tsa lehae tse potlakisang ho hloleha ha karolo. Lisosa tse tloaelehileng li kenyelletsa phallo e mpe ea resin, lisebelisoa tse tlase tsa mocheso oa khalase (Tg), kapa mongobo o kentsoeng ka har'a lera la dielectric.

Mekhoa e Thibelang

• Dielectrics tse phahameng tsa Tg - Sebelisa thepa e nang le Tg e kaholimo ho 150 ° C ho boloka botsitso ba sebopeho le ho mamella ho palama baesekele khafetsa.
• Khatello ea Optimized Lamination - Qala ka khatello e tlase ho khothaletsa phallo ea resin, ebe butle-butle eketsa khatello ea tlamahano e felletseng bakeng sa ho khomarela junifomo.
• Ho baka esale pele bakeng sa ho tlosa mongobo - Bake lishiti tsa dielectric ka 120 ° C bakeng sa lihora tse 2-4 pele ho lamination ho tlosa mongobo o monyehileng.
• Lamination e Thusang ka Vacuum - Sebelisa lits'ebetso tsa vacuum ho tlosa moea o ts'oeroeng le ho foka, ho netefatsa maqhama a se nang letho le ts'ebetso e tsitsitseng ea mocheso.

Mehato ena ea thibelo e ntlafatsa ts'epahalo ea dielectric le ho netefatsa ts'ebetso e tsitsitseng ea mocheso tlhahisong ea tšepe ea mantlha ea PCB.

Mathata a ho Epa le ho Tsamaisa Metsamao ho MCPCB Manufacturing

Mathata a ho sebetsa ka Mechanical

Ho thatafala le ho tsamaisa mocheso o phahameng oa li-substrate tsa tšepe ho baka liphephetso tse ikhethang tsa tlhahiso ea MCPCB nakong ea ho cheka le ho tsamaisa. Metheo ea aluminium e nang le boleng ba Brinell ba ho thatafala ha 40–80 HB e roala li-drill bits tse tloaelehileng tsa carbide ka potlako, e leng se fellang ka masoba a maholo, mabota a maholo, le ho khomarela ho fokolang ha plating.

Li-burrs tsa tšepe kapa li-chip tse hlahisoang nakong ea ts'ebetso li ka baka lipotoloho tse khutšoane kapa tsa sitisa ho beoa ha likarolo. Hobane aluminium le koporo li felisa mocheso ka katleho , sebaka sa ho seha se lula se le thata ha drill e futhumatsa ka lebaka la khohlano, e leng se potlakisang ho senyeha ha lisebelisoa le ho se nepahale ha boholo.

Optimized Drilling Solutions

• Lisebelisoa tse Khethehileng tsa ho Drila - Sebelisa daemane ea polycrystalline (PCD) kapa likotoana tsa carbide tse koahetsoeng ho lelefatsa bophelo ba lisebelisoa 10-20 × ha ho bapisoa le liboro tse tloaelehileng.
• Optimized Drilling Parameters - Sebetsa ho 40,000-60,000 RPM ka litefiso tsa lijo tsa 50-100 mm / min ho leka-lekanya ho nepahala le ho laola ho apara.
• Thepa e Nepahetseng ea Tšehetso - Sebelisa phenolic kapa aluminium ho kena le liboto tsa bekapo bakeng sa ho kena le ho tsoa ha lesoba le hloekileng.
• Peck Drilling Cycles - Sebelisa ho cheka nako le nako ho hlakola li-chips le ho fokotsa mocheso oa mocheso.
• Precision Routing - Khetha limilone tsa ho qetela tsa mofuta oa compression tse nang le geometry e loketseng ea lekolilo ho fokotsa ho taboha le ho phatloha.

Maano ana a machining a ntlafatsa boleng ba lesoba, a lelefatsa bophelo ba lisebelisoa, 'me a netefatsa ho nepahala ha sebopeho sa tšepe ea mantlha ea PCB.

Mathata a Phekolo ea Bokaholimo ho Tlhahiso ea MCPCB

Mathata a Oxidation le Tšilafalo

Metal core surfaces e hlahisa oxidize kapele ha e pepesehile moeeng, haholo-holo tlas'a mocheso o phahameng oa ho sebetsa. Aluminium e etsa likarolo tsa oxide tse thibelang ho kolobisa ka solder, ha koporo e hlahisa li-cuprous le cupric oxides tse senyang ho kopana ha motlakase le matla a ho kopanya. Liphephetso tsena tsa tlhahiso ea MCPCB li hloka tšireletso ea hang-hang ho boloka ts'epo ea kopano.

Maano a Tšireletso

• Ho Qetella Sebaka ka Nako - Sebelisa litlolo tse sireletsang hang ka mor'a ho etsoa ho thibela oxidation nakong ea ho tšoara le ho boloka.
• ENIG Qetella - Sebelisa Electroless Nickel Immersion Gold bakeng sa thekiso e ntle haholo le bophelo bo bolelele bo fetang likhoeli tse 12.
• Ho roala ha OSP - Khetha Organic Solderability Preservatives e le khetho e theko e tlaase bakeng sa tšireletso ea nakoana.
• Taolo ea Bohloeki - Hlatsoa ka metsi a hloekisitsoeng ho tlosa masala a ionic a ka potlakisang kutu.
• Packaging-Bopaki ba Mongobo - Boloka liboto ka har'a sephutheloana se tiisitsoeng ka vacuum ka li-desiccants ho itšireletsa khahlanong le oxidation.

Ho kenya ts'ebetsong ea ho qeta ka mor'a ho etsoa ka potlako le mekhoa e nepahetseng ea ho paka ho tiisa hore ho na le solderability e tsitsitseng le ho tšepahala ha nako e telele tlhahisong ea tšepe ea PCB.

Taolo ea Boleng le Teko ho Mathata a Tlhahiso ea MCPCB

Mathata a Tlhahlobo

Tlhahlobo ea boleng ba MCPCB e hloka mekhoa e khethehileng ea tlhahlobo ho feta tlhahlobo e tloaelehileng ea PCB. Teko ea ho hanyetsa mocheso e tlameha ho hlahloba ka nepo ho fetisoa ha mocheso ho tloha lera la potoloho ho ea setsing sa tšepe tlas'a maemo a laoloang a mocheso.

Teko ea ho senyeha ha dielectric e tiisa matla a ho kenya li-voltages ka holim'a maemo a ts'ebetso, ha tlhahlobo ea boreleli e hloka ho nepahala ha boemo ba micron ho netefatsa ho kopana ho nepahetseng ha mocheso. Lintlha tsena li etsa hore netefatso ea boleng e be e 'ngoe ea liphephetso tse kholo tsa tlhahiso ea MCPCB.

Comprehensive Testing Solutions

Taolo e sebetsang ea boleng ba MCPCB e kenyelletsa mekhoa e mengata e tlatselletsang ea netefatso:

• Thermal Resistance Testing - Netefatsa mocheso oa mocheso o sebelisa li-sensor tse lekantsoeng, ho boloka boleng bo ka tlase ho 1 °C / W bakeng sa meralo e tloaelehileng.
• Teko e Phahameng ea Monyetla - Sebelisa 2500-3000 VAC ho netefatsa botšepehi ba dielectric le botšepehi ba ho kenya letsoho.
• Ho Nahana ka Thermal Thermal - Fumana li-hotspots tse bonts'ang phetisetso e mpe ea mocheso kapa liphapang tse patiloeng tsa potoloho.
• Tlhahlobo ea AOI e thehiloeng ho Laser - Lekanya ho bata ha bokaholimo ka nepo e phahameng ho tseba sebaka sa ntoa pele ho kopano.

Ho kenya ts'ebetsong taolo ea ts'ebetso ea lipalo-palo ka lisampole tse tloaelehileng ho boloka botsitso ba tlhahiso le ho netefatsa ts'ebetso e tsitsitseng ho pholletsa le mekhahlelo eohle ea tlhahiso ea MCPCB.

fihlela qeto e

Ho hlola liphephetso tsa tlhahiso ea MCPCB-ho tloha ho ho se lumellane ha katoloso ea mocheso le taolo ea maqephe a ntoa ho isa ho ho nepahala ha ho cheka le ho sireletsa bokaholimo-ho hloka mokhoa o akaretsang oa boenjiniere. Katleho e itšetlehile ka ho lumellana le khetho ea thepa, ts'ebetso ea ts'ebetso, le taolo ea boleng ho netefatsa ts'ebetso e tsitsitseng ea mocheso le ho tšepahala ha nako e telele lits'ebetsong tse phahameng tsa matla.

Hobaneng U Khetha Highleap Electronics

• Advanced Material Engineering - Likhetho tse entsoeng ka aluminium, koporo le dielectric tse hlophisitsoeng bakeng sa ts'ebetso e leka-lekaneng ea mocheso le mochini.
• Precision Process Control - Optimized lamination, ho cheka, le routing parameters bakeng sa boemo bo phahameng bo bataletseng le ho nepahala ha dimensional.
• Tiisetso e Felletseng ea Boleng - Ho hanyetsa mocheso ka tlung, dielectric, le liteko tsa ho bata ho netefatsa sehlopha se seng le se seng sa tlhahiso.
• Tsebo ea Kopo - Ts'ebetso e netefalitsoeng ho pholletsa le mabone a LED, litsamaiso tsa likoloi, le liindasteri tsa phetolo ea matla.

Sebelisana le Highleap Electronics ho fumana ditharollo tse ntlafetseng tsa tlhahiso ya MCPCB tse entsweng bakeng sa tshebetso, botshepehi le ho hola. Ikopanye le sehlopha sa rona sa botekgeniki kajeno ho buisana ka ditlhoko tsa projeke ya hao ya matla a hodimo.