Metal Core PCB Design Guidelines | Tataiso ea Boenjiniere bakeng sa Ts'ebetso e Ntle ea Thermal

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Moralo oa Metal core PCB o emela taeo ea bohlokoa ea boenjiniere bakeng sa lits'ebetso tse hlokang bokhoni bo phahameng ba taolo ea mocheso. Ha matla a matla a ntse a eketseha ho lisebelisoa tsa mabone a LED, lisebelisoa tsa elektronike tsa likoloi, le li-module tsa ho fetola matla, mohato oa moralo o hlahile e le oona o ka sehloohong oa ho sebetsa ha mocheso ho e-na le khetho ea thepa feela.

Tataiso ena e tsepamisitse maikutlo ho li-parameter tsa boenjiniere tse hlalosang moralo o atlehileng oa Metal core PCB, ho kenyelletsa le maano a moralo, ho ntlafatsa tsela ea mocheso, litlhaloso tsa botenya ba koporo, le mocheso ka ts'ebetsong. Moralo o sebetsang oa taolo ea mocheso oa PCB o hloka ho nahanoa ka mokhoa o hlophisitsoeng oa lintlha tsena tse hokahaneng ho tloha mohatong oa mohopolo oa pele ka netefatso ea tlhahiso.

Ho utloisisa Sepheo sa Moqapi ho Metal Core PCB Design

Morero oa mantlha oa moralo oa Metal Core PCB o fetela ka nģ'ane ho mocheso o bonolo oa mocheso ho finyella kabo e tšoanang ea mocheso ha o ntse o boloka botšepehi ba nako e telele. Sebopeho sa mekhahlelo e meraro se nang le lera la potoloho ea koporo, dielectric e tsamaisang mocheso oa mocheso, le substrate ea tšepe e beha lithibelo tse ikhethileng tse lokelang ho rarolloa qalong ea potoloho ea nts'etsopele.

Baenjineri ba meralo ba tlameha ho lekola boemo ba mohloli oa mocheso, litlhoko tsa boima ba koporo, le li-interfaces tsa mochini nakong ea moralo oa pele. Setsi sa tšepe se sebetsa e le sepharalatsi sa mocheso le sebopeho sa sebopeho, se hlokang ho nahanoa ka hloko ka li-coefficients tsa katoloso ea mocheso le mekhoa ea ho hokela litsing tsa mocheso tse kantle.

Litaelo tsa Moralo oa Sebopeho bakeng sa Ntlafatso ea Thermal

Leano la ho beha dikarolo le theha motheo wa moralo o sebetsang wa Metal Core PCB. Dikarolo tse nang le mocheso o phahameng di lokela ho bewa tseleng ya mantlha ya ho qhala mocheso , hangata di lebile hodima dintlha tse hokelang tse hokelang ditsamaisong tsa ho phodisa tsa kantle. Esita le kabo ya disebediswa tse hlahisang mocheso e thibela dibaka tse chesang tse fumanehang sebakeng seo tse ka sitisang tshepo ya dikarolo le ho potlakisa ho senyeha ha sistimi.

Strategic Componement Placement

Lisebelisoa tsa papiso ea mocheso li fana ka temohisiso ea bohlokoa haholo nakong ea moralo, e lumellang baenjiniere ho bona ka mahlo a kelello mekhoa ea phallo ea mocheso le ho tseba litšitiso tse ka bang teng tsa mocheso pele ba etsa tlhahiso. Circuit trace bophara le botenya ba foil ea koporo bo susumetsa ka ho toba mocheso oa lateral o hasang ka har'a lera la koporo. Mesaletsa e pharalletseng e bapileng le likarolo tsa motlakase e nolofatsa kabo ea mocheso ha ka nako e ts'oanang e ts'ehetsa matla a holimo a hajoale.

Tlhahlobo ea Kabo ea Mohloli oa Mocheso

Lihlopha tsa meralo li lokela ho etsa 'mapa oa boemo ba mocheso oa kopano eohle, tse ikarabellang bakeng sa ts'ebetso ea boemo bo tsitsitseng le liketsahalo tsa nakoana tsa mocheso. Likarolo tse haufi li tlameha ho aroloa ka ho nahanela liphello tsa ho kopanya mocheso le moroalo o kopantsoeng oa mocheso holim'a substrate ea motheo ea tšepe.

Ka Moralo oa Tsela ea Mocheso le Mocheso

Thermal vias sebetsa mosebetsi o khethehileng ka Metal Core PCB moralo ka ho theha paatsepaa mocheso conduction litselana ka lera dielectric ho setsi sa tšepe. Leha boholo ba liboto tsa mantlha tsa tšepe li sebelisa li-circuits tsa koporo tse lehlakoreng le le leng, ho beoa ka mokhoa o hlophisitsoeng ha li-vias tse tlatsitsoeng ka tlas'a likarolo tse matla a phahameng ho fokotsa ho hanyetsa mocheso haholo. Mokhoa o mongata oa li-vias tsa mocheso o fana ka litsela tse ngata tse bapisang mocheso, ka mokhoa o atlehileng o theola sekhahla sa mocheso o akaretsang.

E khothalelitsoe ka Lintlha

Boiphihlelo ba boenjineri bo fana ka maikutlo a ho futhumatsa ka li-diameter tse pakeng tsa 0.3 le 0.5 millimeters ka sebaka sa bohareng ho isa bohareng sa limilimithara tse 1.0 ho isa ho tse 1.5 bakeng sa ts'ebetso e nepahetseng. Botenya ba koporo ea li-micrometer tse 35 ho isa ho tse 70 bo tiisa mocheso o lekaneng ha o ntse o boloka bokhoni ba tlhahiso. Boima ba mokhoa oa "via" bo lokela ho holisoa ka har'a sebaka sa "thermal pad" ka tlas'a lisebelisoa tsa motlakase, ho nahanoa ka botšepehi ba mochini oa lesela la dielectric.

Khetho ea Botenya ba Koporo le Moralo oa Trace

Tlhaloso ea boima ba koporo e emela qeto ea bohlokoa ea moralo oa Metal Core PCB e amang ts'ebetso ea mocheso le motlakase. Lisebelisoa tse tloaelehileng tsa LED le lisebelisoa tsa elektronike tsa bareki hangata li sebelisa koporo e le 'ngoe (35 micrometer), e fana ka bokhoni bo lekaneng ba hona joale le ho hasana ha mocheso bakeng sa maemo a itekanetseng a matla. Li-module tsa elektronike tsa motlakase tse sebetsang maemong a phahameng a hona joale li hloka koporo ea li-ounce tse peli ho isa ho tse tharo (70 ho isa ho 105 micrometer) ho thibela ho futhumala ho feteletseng le ho etsa hore mocheso o sebetse ka lehlakoreng le leng.

Ho leka-lekanya Tshebetso le Tlhahiso

Koporo e boima e ntlafatsa bokgoni ba ho jara hona jwale le tsamaiso ya mocheso empa e hlahisa diphephetso ditshebetsong tsa photolithography le ho tjhesa, e leng se ka fokotsang bophara le sebaka se fokolang sa ho latela mohlala. Ho tjhesa koporo ka ho kgetha dibakeng tse nang le motlakase o moholo ho fana ka mokgwa wa ho sekisetsa, ho boloka bokgoni ba ho tjhesa hantle dibakeng tsa matshwao ha ka nako e ts'oanang ho matlafatsa marangrang a kabo ya motlakase. Baenjiniere ba meralo ba tlameha ho sebelisana le balekane ba tlhahiso ho netefatsa hore dikgetho tsa botenya ba koporo di tsamaellana le bokgoni ba tlhahiso le ditlhoko tsa mamello.

Lintlha tsa Lera la Dielectric

Thermally conductive dielectric layer e sebetsa joalo ka botlolo ea mantlha ea mocheso moralong oa Metal Core PCB, 'me thepa ea eona e supa ho hanyetsa mocheso ka kakaretso. Mekhahlelo e mesesaane ea dielectric e nang le boleng bo phahameng ba ho futhumatsa mocheso e fokotsa ho sitisa mocheso, leha litlhoko tsa ho kenya motlakase le litekanyo tsa motlakase li beha meeli e sebetsang. Tlhōrō e tloaelehileng ea mocheso oa dielectric e tloha ho 1 ho isa ho 3 watts ka mitha-kelvin, ka boleng ba botenya pakeng tsa 50 le 150 micrometers.

Baenjiniere ba tlameha ho leka-lekanya litlhoko tse qothisanang lehlokoa tsa khanyetso e tlase ea mocheso, matla a phahameng a dielectric, le ts'epo ea nako e telele tlas'a maemo a potoloho ea mocheso. Khetho ea thepa ea MCPCB e kenyelletsa phapanyetsano lipakeng tsa ts'ebetso ea mocheso le karohano ea motlakase, haholo-holo lits'ebetsong tsa motlakase o phahameng moo botenya bo eketsehileng ba dielectric bo hlokahalang bakeng sa ho latela melao ea polokeho.

Ketsiso ea Thermal le netefatso

Tlhahlobo ea mocheso oa computational e lokela ho kenngoa ho Metal Core PCB moralo oa mosebetsi oa ho sebetsa ho netefatsa maano a ho senya mocheso pele ho etsoa tlhahiso ea mohlala. Lisebelisoa tsa software tse kang ANSYS kapa liforomo tse tšoanang tsa tlhahlobo ea lintho tse lekantsoeng li thusa baqapi ho etsa mohlala oa litšebelisano tse rarahaneng tsa mocheso le ho bolela esale pele mocheso oa matekoane tlas'a maemo a fapaneng a ts'ebetso. Lintlha tsa bohlokoa tsa ts'ebetso li kenyelletsa ho hanyetsa mocheso ho tloha mateanong a matekoane ho isa ho 'ngoe le ho phahama ha mocheso ho feta maemo a tikoloho.

Liprothokhole tsa Teko ea netefatso

Netefatso ea 'mele e sebelisang infrared thermal imaging e tiisa likhakanyo tsa papiso le ho supa libaka tse chesang tse sa lebelloang likopanong tsa mohlala. Liteko tsa ho palama libaesekele tsa matla li lekola ts'ebetso ea mocheso tlasa profaele ea 'nete ea ts'ebetso le ho lekola ts'epo ea nako e telele ka liprothokholo tsa botsofali tse potlakileng. Kamano lipakeng tsa liphetho tse etsisitsoeng le tse lekantsoeng e haha ​​tšepo ho moetso oa moralo oa mocheso le ho tataisa ntlafatso bakeng sa likhakanyo tse latelang tsa moralo.

Mehopolo ea Moralo oa Tlhahiso

Moralo bakeng sa melao-motheo ea tlhahiso o sebetsa ka ho lekana ho moralo oa Metal Core PCB mabapi le lipotoloho tse tloaelehileng tse hatisitsoeng, leha liboto tsa mantlha tsa tšepe li na le lithibelo tse ikhethang tsa ts'ebetso. Litlhaloso tse teteaneng haholo tsa koporo, mocheso o teteaneng ka lipaterone, le mamello e tiileng ea litekanyo li ka ama haholo chai ea tlhahiso le litšenyehelo tsa tlhahiso. Ho sebelisana le balekane ba tlhahiso esale pele ho netefatsa hore likarolo tsa moralo li tsamaellana le bokhoni ba ts'ebetso.

Lintlha tsa Tšebeliso ea Ts'ebetso

Ho nepahala ha koporo ea koporo, mamello ea lamination ea dielectric layer, le ho tsamaellana ha bokaholimo kaofela li hloka netefatso nakong ea litlhahlobo tsa moralo. Liphekolo tse tloaelehileng tsa holim'a metsi ho kenyelletsa le "organic solderability preservative" le "electroless nickel mersion" khauta li lula li lumellana le li-metal core substrates, leha maemo a ts'ebetso a ka hloka phetoho. Litokomane tsa tlhahiso li lokela ho hlakisa litekanyo tsa bohlokoa, litlhoko tsa thepa, le litekanyetso tsa tlhahlobo ho netefatsa boleng bo tsitsitseng ba tlhahiso.

fihlela qeto e

Moralo o sebetsang oa Metal Core PCB o hloka mokhoa o hlophisitsoeng le o tsamaisoang ke boenjiniere ho tsamaiso ea mocheso. Paramethara e 'ngoe le e' ngoe ea moralo - tlhophiso ea sebopeho, botenya ba koporo, mocheso ka moralo, le khetho ea dielectric - e kenya letsoho ho sebetsa hantle ha mocheso oa boto le ho ts'epahala ha nako e telele. Ho fihlella ts'ebetso e nepahetseng ho ipapisitse le ho leka-lekanya lintlha tsena ka har'a lithibelo tsa 'nete tsa tlhahiso.

Ho Highleap Electronics, re kopanya boiphihlelo ba moralo le tlhahiso e nepahetseng ho fana ka litharollo tse tšepahalang tsa Metal Core PCB bakeng sa lits'ebetso tse hlokang boiteko bo bongata. Bokhoni ba rona bo kenyelletsa:

• Tšehetso ea Moqapi oa Boenjiniere - Ntlafatso ea tsela ea mocheso, tlhahlobo ea botenya ba koporo, le tlhahlobo ea sebopeho e etselitsoeng lits'ebetso tsa matla a holimo.
• Taolo e tsoetseng pele ea Tlhahiso - Etching e nepahetseng ea koporo, e futhumatsang ka ho cheka, le lamination e sa fetoheng ea dielectric bakeng sa ho qhala mocheso o nepahetseng.
• Tiisetso ea Boleng le Botšepehi - ISO9001, ISO13485, ISO14001, le tlhahiso e netefalitsoeng ea IATF16949 e netefatsang ts'ebetso e ts'oanang le ho latela mohlala.

Ka ho kopanya boqhetseke ba moralo oa PCB le tlhahiso ea PCB , Highleap Electronics e thusa bareki ho fihlela litharollo tsa Metal Core PCB tse sebetsang hantle, tse theko e tlase, le tse ka atolosoang tse fihlelang maemo a holimo a taolo ea mocheso. Ikopanye le sehlopha sa rona sa boenjiniere kajeno ho buisana ka litlhoko tsa hau tsa moralo oa Metal Core PCB le ho ntlafatsa projeke ea hau e latelang ea elektroniki e nang le matla a phahameng.