Melao ea Moralo oa Kopano ea PCB bakeng sa DFM le Kopano e Iketsang

Tafole ea likateng

1. Melao ea ho Beha Likarolo
2. Litlhoko tsa Moralo oa Pad
3. Mehopolo ea Moqapi oa Mocheso
4. Litšobotsi tsa Fiducial le Alignment
5. Tataiso ea Theknoloji e Tsoakiloeng
6. Moralo oa Kopano e Iketsang

Ho Highleap Electronics, re netefatsa meralo khahlanong le melao ena nakong ea tlhahlobo ea rona ea mahala ea DFM . Ho latela litataiso tsena ho thusa ho netefatsa katleho ea kopano ea pele.

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1) Melao ea ho Beha Likarolo

Ho beha likarolo hantle ho nolofalletsa kopano e iketsang ka bo eona hantle le ho thibela liphoso.

1.1 Litlhoko tsa Sebaka sa Likarolo

Mofuta oa Sebaka	Bonyane ba	Recommended
Ho tloha ho SMD ho ea ho SMD (lehlakore le le leng)	0.5mm	0.75mm
Ho tloha ho SMD ho ea ho PTH	1.0mm	1.5mm
PTH ho isa ho PTH	1.5mm	2.0mm
Karolo e ka hare ho boto	2.0mm	3.0mm
Karolo e ka hare ho moeli oa terene (phanele)	3.0mm	5.0mm

1.2 Tsela eo Likarolo li Lekanngoang ka Eona

Ho shebana le maemo ka tsela e tsitsitseng ho ntlafatsa tlhahlobo le ho fokotsa liphoso tsa ho beha:

• Likarolo tse nang le polarized: Tsela e tšoanang ea polarity ho pholletsa le boto
• Li-IC: Pin 1 sekhutlong se tsitsitseng (hangata se ka hodimo ho le letshehadi)
• Likarolo tsa chip: Lekanya mathoko a boto ka tsela e bapileng ha ho khoneha
• dikgokelo: Nahana ka tsela eo ho kopana ho tsamaellanang ka eona le tsela eo cable e tsamaellanang ka eona

Tsela ea ho tsamaisa hape:

• Ho shebana le tsela e otlolohileng ho thibela ho fetoha ha likarolo (phello ea maqhubu)
• Likarolo tse nyane tse haufi le moedi oa boto: moedi o molelele o otlolohileng ho moedi

1.3 Mehopolo ea Bophahamo ba Likarolo

Bakeng sa ho kopanya hape:

• Boloka likarolo tse telele hole le tse nyane (sebaka se fetang 2mm)
• Likarolo tse telele li ka koahela likarolo tse nyane tse haufi
• Nahana ka tsela eo metsi a phallang ka eona ha o beha likarolo tse telele

Bakeng sa sebaka se iketsang:

• Beha likarolo tse telele ka mor'a ho se be le boemo bo tlaase
• Bolelele bo phahameng ka ho fetisisa hangata ke 25mm bakeng sa lisebelisoa tse tloaelehileng
• Likarolo tse telele haholo li ka hloka ho beoa ka letsoho

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2) Litlhoko tsa Moralo oa Pad

Moralo oa Pad o ama boleng ba manonyeletso a solder le botšepehi ba nako e telele.

2.1 Saese ea Pad ea SMD

Litekanyo tsa pad li lokela ho tsamaellana le litlhaloso tsa likarolo. Tataiso e akaretsang:

Likarolo tsa chip (0402 le ho feta):

• Bolelele ba Pad: 1.0× ho isa ho 1.2× bolelele ba terminal
• Bophara ba Pad: E lekana kapa e pharaletse hanyane ho feta bophara ba likarolo
• Katoloso ea menoana ea leoto: 0.25-0.5mm ka nqane ho 'mele oa karolo
• Katoloso ea serethe: bonyane 0.25mm

Li-IC tse nang le molumo o motle:

• Sebelisa mehato e khothaletsoang ke moetsi
• Nahana ka dipaterone tsa di-pad tsa IPC-7351
• Netefatsa sebaka sa ho latela karolo ea 'nete

2.2 Moralo oa Pad oa QFN/DFN

Lisebelisoa tsa QFN li hloka tlhokomelo e khethehileng:

Li-pad tsa peripheral:

• Bolelele ba pad: Paterone ea mobu e atoloha ho feta 0.25-0.5mm ka nģ'ane ho moeli oa sephutheloana
• Ha ho maske ea solder pakeng tsa li-pad le pad ea thermal

Sebaka sa ho futhumatsa:

• Boholo: 80-90% ea sebaka sa karolo ea mocheso oa karolo
• Ka sehlopha: li-vias tsa 0.3mm ho gridi ea 1.0-1.2mm
• Ka ho tlatsa: Ho hlokahala ho thibela ho kobeha ha solder
• Maske ea solder: Pulo e nyane hanyane ho feta pad

2.3 Moralo oa Mapheo a BGA

Mofuta oa bethe:

• NSMD (Non-Solder-Mask-Defined): E kgethwa bakeng sa pitch e nyane
• SMD (Solder-Mask-Defined): E sebelisetsoa ho hohela ka lebelo le leholo, ho khomarela hantle

Bophara ba Pad:

• NSMD: 75-80% ea bophara ba bolo
• Ho buloa ha maske: Bophara ba Pad + bonyane 0.1mm

Ka lintlha tse lokelang ho nahanoa:

• E amoheleha ka ho tlatsa le sekoahelo
• Ho tsamaisana ha lintja le masapo bakeng sa BGA tse kholoanyane
• Sheba Litataiso tsa ho bula ha stensele bakeng sa sekoahelo sa peista

3) Mehopolo ea Moralo oa Thermal

Tekanyo ea mocheso e thibela liphoso tsa kopano nakong ea phallo ea metsi hape.

3.1 Ho Thibela ho Betla Mabitla

Ho betla mabitla ho etsahala ha pheletso e 'ngoe ea karolo ea chip e phahama nakong ea phallo e ncha ka lebaka la tsitsipano e sa lekanang ea bokaholimo ba solder.

Maano a ho thibela:

• Leka-lekanya boima ba mocheso liphaepheng ka bobeli
• Tsela e lekanang ea ho tsamaisa mesaletsa ho ea ho li-pad
• Kenya phomolo ea mocheso haeba pad e le 'ngoe e hokahane le sefofane
• Qoba ho matha mesaletsa tlas'a likarolo tsa chip

3.2 Moralo oa Phomolo ea Thempereichara

Bakeng sa dikgokelo tsa sefofane:

• Sebelisa li-spoke tse thusang mocheso (tse tloaelehileng ke li-spoke tse 4)
• Bophara ba spoke: bonyane 0.25-0.3mm
• Sekheo sa moea: bonyane 0.25mm

Ha ho hlokahala thuso ea mocheso:

• Li-pad tsa SMD tse hokelang lifofaneng tsa kahare
• Li-pad tsa PTH tse nang le likhokahano tsa sefofane
• Pad efe kapa efe e hlokang ho tjheseletsa hape/leqhubu la solder

3.3 Ho Laola Libaka tse Kholo tsa Koporo

Libaka tse kholo tsa koporo (li-thermal pad, li-heatsink) li ama phallo e ncha ea metsi:

• Ho lekana ha mocheso: Netefatsa hore profaele ea phallo e ncha e fihla libakeng tsohle
• Sekoahelo sa peista: Fokotsa peista holim'a li-pad tse kholo tsa mocheso ho thibela ho phaphamala
• Ka sehlopha: E thusa ho tsamaisa mocheso, e hloka li-via tse tlatsitsoeng

Romela Tlhahlobo ea Kopano

4) Litšobotsi tsa Fiducials le Alignment

Li-fiducial li nolofalletsa ho hokahanya ha optical ka boiketsetso bakeng sa ho beha likarolo.

4.1 Bahlahlobi ba Lefatše ka Bophara

litlhokahalo:

• Bonyane tse 3 ka boto/phanele (tse 2 tse otlolohileng + 1 bakeng sa tataiso)
• E fumaneha ka har'a li-panels tsa liboto tse nang le liphanele
• Sebaka se sa lekanang se thibela liphoso tsa ho shebana le 180°

songolo:

• Bophara ba Pad: 1.0mm e tloaelehileng (0.5mm-2.0mm e amoheleha)
• Monyako oa maske oa solder: bophara ba 2 × pedi
• Ho tlosoa ho tsoa likarolong tse ling: bonyane 3mm
• Qetello ea koporo: E tšoanang le ea boto (e sa koaheloang ke maske ea ho solder)

4.2 Bangoli ba Lifilimi ba Lehae

Litsebi tsa lehae li ntlafatsa ho nepahala ha sebaka bakeng sa likarolo tse nang le molumo o mosesaane.

Ha ho hlokahala:

• Likarolo tse nang le bophahamo ba ≤0.5mm
• Li-BGA tse nang le bolo ea ≤0.8mm
• Likarolo tse hlokang mamello e tiileng ea ho beoa

Moetliso:

• Li-fiducial tse peli ka karolo (likhutlo tse otlolohileng)
• Ka hare ho 50mm ea karolo
• Ha e arolelanoe lipakeng tsa likarolo

4.3 Masoba a Lisebelisoa

Bakeng sa ho sebetsana le phanele:

• Bophara: 3.0-4.0mm e tloaelehileng (e sa phutheloang)
• Sebaka: Ka har'a lireile tsa phanele, tse behiloeng ka mokhoa o lekanang
• Sebaka: 5mm ho tloha moeling oa boto

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5) Tataiso ea Theknoloji e Tsoakiloeng

Maboto a nang le SMT le lesoba le ka ntle a hloka tlhokomelo e khethehileng.

5.1 Tatellano ea Ts'ebetso

Phallo e tloaelehileng ea theknoloji e tsoakiloeng:

1. Lehlakore la SMT 1: Khomaretsa khatiso → Sebaka → Phallela Bocha
2. Lehlakore la SMT la 2 (haeba ho hlokahala): Khomaretsa khatiso → Sebaka → Phallela hape
3. Lesoba le phunyeletsang: Kenya → Leqhubu kapa solder e kgethilweng
4. Kopano ea letsoho (haeba e le teng)

5.2 Mehopolo ea ho Seller ea Maqhubu

Tsela eo likarolo li tsamaisoang ka eona:

• Mothapo o molelele o otlolohileng ho ea lehlakoreng la leqhubu
• Moeli o latelang oa lihokelo (leqhubu la ho qetela ho tsoa)

SMT ka lehlakoreng la leqhubu:

• E lekanyelitsoe ho likarolo tse lekantsoeng mocheso oa maqhubu
• Sekhomaretsi se hlokahalang ho tšoara likarolo nakong ea leqhubu
• Qoba molumo o monyane le BGA lehlakoreng la maqhubu

5.3 Ho qhibilihisa ka ho Khetha

Ho kopanya ka mokhoa o ikhethileng ho nolofalletsa lesoba le nang le SMT ka lehlakoreng le le leng:

Moralo bakeng sa khetho:

• Sebaka se potileng li-pad tsa THT bakeng sa phihlello ea nozzle
• Hlopha likarolo tsa THT ha ho khoneha
• Nahana ka masholu a solder bakeng sa ho leka-lekanya boima ba mocheso

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6) Moralo oa Kopano e Iketsang

Ho ntlafatsa bakeng sa othomathike ho fokotsa litšenyehelo le ho ntlafatsa boleng.

6.1 Khetho ea Likarolo

Khetha likarolo tse loketseng ho iketsa:

• Sephutheloana se tloaelehileng sa theipi le toloki
• Mekhahlelo ea likarolo e tsitsitseng
• Matshwao a hlakileng a polarity
• Mehato e khothaletsoang ke moetsi

Qoba kapa u fokotse:

• Likarolo tse sa tloaelehang tse hlokang ho beoa ka letsoho
• Sephutheloana se sa tloaelehang
• Likarolo tse nyane haholo (0201) kapa tse kholo haholo bakeng sa lisebelisoa

6.2 Litlhoko tsa Faele ea Moralo

Sephutheloana se felletseng sa faele se nolofalletsa kopano e sebetsang hantle:

• Li-gerber: Lintlha tse felletseng tsa tlhahiso
• Khetha le ho beha faele: Likhokahano tsa likarolo bakeng sa ho beha
• Faele ea Centroid: Likhokahano tsa XY, potoloho, lehlakore
• BOM: E feletse ka linomoro tsa likarolo tsa moetsi
• Setšoantšo sa kopano: Referense ea sebaka sa likarolo

Sheba litlhoko tsa faele ea kopano ea PCB bakeng sa litlhaloso tse felletseng.

6.3 Moralo oa Phanele

Ho kenya diphanele hantle ho ntlafatsa bokgoni ba ho kopanya:

• Tsela e tsitsitseng ea boto
• Lisebelisoa tse bapisang litekanyo tsa terene
• Li-fiducial le lisebelisoa tsa li-rails
• Sebaka se lekaneng sa ho tlosa tsela/sephetho sa V

Sheba litlhoko tsa ho kenya liphanele bakeng sa SMT bakeng sa litataiso tse qaqileng.

6.4 Ho Fumana Tlhahlobo ea Moralo

Romela moralo oa hau ho Highleap Electronics bakeng sa tlhahlobo ea DFM ea mahala . Baenjiniere ba rona ba netefatsa moralo oa hau khahlanong le melao ena 'me ba fana ka tlaleho e qaqileng ea DFM . Sebelisa lethathamo la rona la PCB DFM ho itlhomamisa pele o fana ka eona, le ho hlahloba litataiso tsa DFT bakeng sa litlhoko tsa tlhahlobo. Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka lipotso life kapa life tsa moralo kapa litlhoko tse khethehileng.