Teko ea Tšepahalang ea Semiconductor PCB: Maemo, Mekhoa, le Tiiso

Hobaneng ha Semiconductor PCB e le Litaba tsa ho Tšepahala

Li-PCB tsa semiconductor li sebetsa tlas'a matla a mangata le ho feto-fetoha ho feteletseng ha mocheso ho bakang khatello e kholo manonyellong a solder, mesaletsa ea koporo le meaho ea laminate. Maemo ana a boima a etsa hore tlhahlobo ea ts'epo ea PCB ea semiconductor e be ea bohlokoa bakeng sa ho thibela ho hloleha ha tšimo le ho netefatsa ts'ebetso ea sistimi ea nako e telele. Ntle le netefatso e hlophisitsoeng, bahlahisi ba ipeha kotsing ea ho etsa likopo tsa waranti le ho hloka nako e ngata ea ho sebetsa ha sistimi.

Liphutheloana tsa sejoale-joale tsa semiconductor—ho tloha ho di-module tsa motlakase ho isa ho ditshebediso tsa RF tse sebetsang ka maqhubu a hodimo—di hloka netefatso kgahlanong le maemo a thehilweng a indasteri. Diprothokhole tsa teko tse kang IPC-6012 le IPC-9701 di fana ka meralo e tloaelehileng ya ho lekola botshepehi ba thepa, ho tshwarella ha kgokelo, le tsamaiso ya mocheso . Sengolwa sena se hlahloba maemo, mekgwa, le ditaolo tsa tlhahiso tse netefatsang tshebetso e tshepahalang ya PCB ya semiconductor nakong yohle ya tshebetso.

Mekhoa e Tloaelehileng ea ho hloleha ho li-PCB tsa Semiconductor

Mokhathala o Kopanetsoeng oa Solder

Lipotoloho tse pheta-phetoang tsa ho atolosoa ha mocheso le ho fokotseha ho baka mokhathala o kopaneng oa solder, mokhoa o atileng haholo oa ho hloleha likopanong tsa semiconductor. Coefficient of thermal expansion (CTE) e sa lumellane pakeng tsa silicon e shoa, li-substrates tsa koporo, le li-laminate tsa organic li hlahisa khatello ea mochine libakeng tse hokahaneng. Ha nako e ntse e ea, khatello ena ea khatello ea kelello e bokellana 'me e lebisa ho qalisoa ha crack hoo qetellong ho fellang ka ho khaotsa motlakase.

Ka Cracking le Delamination

Li-plated through-holes le microvias li ba le khatello ea maikutlo nakong ea maeto a mocheso. Botenya bo sa lekaneng ba koporo kapa sebopeho se se nang letho ka har'a libarele ho baka lintlha tse fokolang tse ka bakang ho phatloha. Delamination pakeng tsa likarolo tsa koporo le dielectric li etsahala ha matla a ho khomarela a sitoa ho mamella matla a ho kuta ho tloha katoloso e fapaneng ea mocheso, ho senya botšepehi ba pontšo.

Ho falla ha Metal

Boima bo phahameng ba hona joale bo kopantsoeng le ho pepeseha ha mongobo ho etsa hore koporo e tsamaee ka electrochemical ho pholletsa le libaka tse sireletsang metsi. Kholo ea conductive anodic filament (CAF) lipakeng tsa mesaletsa e arohaneng e bonts'a ho ameha ka ho khetheha lits'ebetsong tsa semiconductor tse phahameng haholo. Mekhoa ena ea ho senyeha e hlalosa hore na ke hobane'ng ha liprothokholo tsa liteko tsa ho tšepahala li tlameha ho sebetsana le khatello ea mocheso le motlakase ka nako e le 'ngoe.

Maemo a Bohlokoa bakeng sa Teko ea Tšepahalang ea Semiconductor PCB

IPC-6012: Litlhoko tsa Ts'ebetso ea PCB e thata

IPC-6012 e theha litlhoko tsa ho tšoaneleha bakeng sa liboto tse hatisitsoeng tse thata ho pholletsa le lihlopha tse tharo tsa ts'ebetso. Sehlopha sa 3, se tlamang bakeng sa lits'ebetso tsa semiconductor lits'ebetsong tsa bohlokoa, se hlalosa botenya bo tlase ba koporo masobeng a koahetsoeng (bonyane ba 25 microns), litekanyetso tsa botšepehi ba laminate, le meeli ea kamohelo bakeng sa liphoso tsa pono. Tekanyetso e totobatsa mekhoa ea liteko bakeng sa matla a ho peel, motlakase o mamellang dielectric, le ho hanyetsa khatello ea mocheso.

IPC-9701: Tekolo ea Tšepahalang ea Kopanelo ea Solder

IPC-9701 e fana ka moralo oa ho lekola ts'ebetso e kopaneng ea solder tlasa maemo a baesekele e futhumetseng. Tekanyetso e hlalosa meralo ea koloi ea liteko, liparamente tsa boemo ba mocheso, le mekhoa ea ho hloleha ho ipapisitse le litekanyo tsa ho hanyetsa motlakase. Lipalo tsa bophelo tse nang le litšobotsi tse sebelisang tlhahlobo ea Weibull li thusa ho bolela esale pele maemo a ho hloleha ha masimo le ho theha lintlha tse nepahetseng tsa tlhahlobo bakeng sa tlhahlobo ea ts'epo ea semiconductor PCB.

Maemo a Tlatsetso a Teko

Litekanyetso tsa JESD22 tse tsoang ho JEDEC li sebetsana le mathata a ts'epahalang a khethehileng a semiconductor:

• JESD22-A104 - Maemo a tlhahlobo ea libaesekele tse futhumatsang le mekhoa ea ho hloleha bakeng sa liphutheloana tsa semiconductor
• JESD22-A101 - Teko ea mocheso-mongobo-e leeme bakeng sa tlhahlobo ea ho senyeha ho amanang le mongobo
• JESD22-A103 - Litekanyetso tsa tlhahlobo ea bophelo ba polokelo ea mocheso o phahameng le litekanyetso tsa ho amoheloa
• MIL-STD-202 - Mekhoa ea thuto ea boemo ba sesole bakeng sa lisebelisoa tsa sefofane le ts'ireletso

Mekhoa e ka Sehloohong ea Teko ea ho Tšepahala bakeng sa li-PCB tsa Semiconductor

Teko ea Thermal Cycling (TCT)

Lithuto tsa libaesekele tse futhumetseng li kopana ho fetoha ha mocheso o iphetang lipakeng tsa -40°C le +125°C. Nako ea liteko e tloha ho li-cycle tse 500 ho isa ho tse 3000 ho latela litlhoko tsa kopo. In-situ resistance monitoring e lemoha ho qaleha ha manonyeletso a solder kapa ka ho hasana ha crack, e leng se nolofalletsang ho tsebahatsa kabo ea ho hloleha. IPC-9701 le JESD22-A104 li totobatsa lintlha tse tloaelehileng tse potlakisang mekhoa ea ho hlōleha e itšetlehileng ka nako.

Thermal Shock Testing

Tšisinyeho ea mocheso e tlisa phetoho e potlakileng ea mocheso (ka tlase ho metsotsoana e 10) lipakeng tsa libaka tse chesang le tse batang. Teko ena e matla e senola ho ba bonolo ho delamination le ho thehoa ka tšohanyetso ho ka 'nang ha se ke ha hlaha nakong ea ho tsamaea butle ha mocheso o chesang. Sistimi ea ho hlapa e nang le metsi a mabeli e fana ka maemo a mabifi ka ho fetesisa a ho lekola mamarelo a lintho tse bonahalang le botšepehi ba sebopeho litekong tsa ho tšepahala tsa semiconductor PCB.

Polokelo ea Mocheso o Phahameng (HTS)

Nako e atolositsoeng ea lithempereichara tse phahameng (125°C ho isa ho 150°C) bakeng sa lihora tse 500 ho isa ho tse 1000, e lekola tšenyeho ea lintho tse bonahalang ntle le litlamorao tsa ho palama libaesekele. HTS e supa ho bola ha polymer, oxidation ea koporo holim'a metsi, le ho senyeha ha dielectric ho itšetlehileng ka nako. Teko ena e bohlokoa haholo bakeng sa li-PCB tsa semiconductor tse nang le mocheso o phahameng o tsitsitseng oa ts'ebetso lits'ebetsong tsa ho fetola matla.

Liteko tsa ho sisinyeha le tsa Mechanical Shock

Teko e sa reroang ea vibrate ka IPC-TM-650 e etsisa maemo a lipalangoang le a ts'ebetso. Sine sweep le profaele ea vibrate e sa reroang e hlasimolla melumo ea metjhini e hatellang manonyeletso a solder le likarolo tsa likarolo. Teko ea ts'isinyeho ea mochini e lekola ho pholoha nakong ea ho ts'oaroa le ho kenya, ho bohlokoa bakeng sa li-PCB tsa likoloi le tsa sefofane sa semiconductor moo matla a mochini a lekanang le ts'epo ea mocheso.

Mekhoa ea HALT le HASS

Highly Accelerated Life Testing (HALT) e sebetsa likhatello tse kopantsoeng tsa mocheso le vibrate ho feta meeli e hlalositsoeng ho lemoha mefokolo ea moralo ka potlako. HALT e sibolla liphoso tse patehileng mme e etsa qeto ea likarolo tsa ts'ebetso pele ho tlhahiso. Highly Accelerated Stress Screening (HASS) e sebetsa khatello ea kelello e laoloang nakong ea tlhahiso ho potlakisa ho hloleha ha lefu la masea, ho ntlafatsa boleng bo tsoang.

Semiconductor PCB Reliability in Manufacturing

Khetho ea Boitsebiso le Litšoaneleho

Netefatso ea ts'epo e qala ka ho fumana mangolo. Li-laminates tse phahameng tsa Tg (≥170 ° C mocheso oa phetoho ea likhalase) li boloka botsitso ba sebopeho nakong ea maeto a mangata a mocheso. Lisebelisoa tse tlaase tsa CTE li fokotsa khatello ea kelello ho li-interfaces tsa koporo-laminate. Mananeo a setifikeiti sa barekisi a netefatsa thepa e ts'oanang ho lotho ea tlhahiso, a theha ts'ebetso ea bohlokoa bakeng sa tlhahlobo ea ho se atlehe.

Lamination and Drilling Process Control

Litlaleho tsa mocheso oa lamination ka ho toba li susumetsa khatello ea kelello e setseng meahong ea li-multilayer. Litefiso tse laoloang tsa ho futhumatsa le ho pholisa li thibela likotsi tsa warpage le delamination nakong ea tlhahlobo ea botšepehi ba PCB ea semiconductor. Ntlafatso ea paramethara ea Drill e fokotsa khatello ea maikutlo 'me e netefatsa likarolo tse nepahetseng bakeng sa plating ea koporo e tšepahalang.

Microvia Copper Plating Quality

Microvia electroplating e hloka taolo e nepahetseng ea sets'oants'o sa hona joale ho fihlela ho tlatsoa ha koporo ntle le letho. Tlhahlobo ea likarolo tse fapaneng e netefatsa ho tlala ka botlalo le ho koahela sekhutlo se lekaneng, ho bohlokoa bakeng sa ts'ebetso ea libaesekele tse futhumetseng. Tlhahlobo ea X-ray e lemoha likheo tse ka tlas'a lefatše tse ka qalang ho hlōleha tlas'a khatello ea mocheso, e leng ho nolofalletsang ho hlahloba lits'ebetso tsa bohlokoa.

Tlhahlobo ea ho Qetela le Teko ea Motlakase

Netefatso ea tlhahiso e kenyelletsa mekhahlelo e mengata ea netefatso:

• Tlhahlobo e Ikemetseng ea Optical Inspection (AOI) - Ho tsebahatsa bofokoli ba sefahleho pele ho tlhahlobo ea motlakase
• Tlhahlobo ea Flying Probe - Tiisetso ea ho tsoela pele ka motlakase le litekanyo tsa ho hanyetsa
• Tlhahlobo ea Microsectioning - Bopaki bo tobileng ba botenya ba koporo le boleng ba ngoliso ea lera
• Tlhahlobo ea X-ray - Ho sibolla sekheo sa kahare le netefatso ea ho tlatsa microvia

Ho Highleap Electronics, lits'ebetso tsohle tsa tlhahlobo ea botšepehi ba PCB ea semiconductor le tlhahiso li sebetsa tlas'a litsamaiso tsa boleng ba IPC-6012 Class 3 le ISO/IATF.

Teko e Phahameng ea ho Tšepahala bakeng sa li-Semiconductors tsa Matla

Power Cycling bakeng sa Wide Bandgap Devices

Lisebelisoa tsa Silicon carbide (SiC) le gallium nitride (GaN) li sebetsa ka mocheso o phahameng oa mateano le maqhubu a ho fetola ho feta li-semiconductors tsa silicon. Liteko tsa ho palama libaesekele tsa motlakase li sebelisa maqhubu a 'nete ha li ntse li lekola mocheso oa mateano ka liparamente tsa motlakase. Sena se senola ho senyeha ha sehokelo sa mocheso le mokhathala oa terata ea bond e khethehileng ho li-module tsa matla a bandgap.

Tlhahlobo ea Thermal Impedance

Teko ea nakoana ea mocheso e bontša khanyetso ea mocheso ho tloha mateanong ho ea ho ambient. Thermal impedance curves e senola ho senyeha ha li-interface tsa mocheso le delamination ka har'a stack ea PCB. Litšoantšo tsa infrared tsa mocheso nakong ea libaesekele tsa motlakase li supa libaka tse chesang le ho netefatsa mehlala ea papiso ea mocheso.

Ketsiso-Assisted Reliability Prediction

Mefuta ea Finite element analysis (FEA) e bolela esale pele kabo ea khatello ea maikutlo le bophelo ba mokhathala pele ho tlhahiso ea mohlala. Lipapiso tse kopantsoeng tsa thermal-mechanical tse kenyelletsang thepa ea sebele li thusa ho fumana mangolo, ho fokotsa nako ea tlhahlobo ea 'mele. Kamano lipakeng tsa likhakanyo tse boletsoeng esale pele le liphetho tsa liteko e tsoela pele ho ntlafatsa ho nepahala ha mohlala bakeng sa liteko tse tšepahalang tsa semiconductor PCB.

fihlela qeto e

Teko ea ts'epo ea Semiconductor PCB e fetola sepheo sa moralo hore e be hardware e tšepahalang ka netefatso e hlophisitsoeng. Ho latela litekanyetso tsa IPC-6012, IPC-9701, le JEDEC ho fana ka moralo oa tlhahlobo e felletseng, athe liprothokholo tse matla tsa liteko li senola mekhoa e ka bang teng ea ho hloleha pele ho romelloa masimong. Litaolo tsa ts'ebetso ea tlhahiso li netefatsa hore meralo e tšoanelehang e fetolela tlhahiso e tsitsitseng ea tlhahiso.

Highleap Electronics e fana ka ts'epo e pakiloeng ea PCB ea semiconductor ka:

• Ho latela Melao - Ho ikamahanya ka botlalo le litlhoko tsa thuto ea IPC-6012 Sehlopha sa 3 le IPC-9701
• Teko e Felletseng - Ho palama baesekele e futhumetseng, ho ts'oha, ho sisinyeha, le bokhoni ba HALT/HASS
• Ho netefatsa Ts'ebetso - Litšoaneleho tsa thepa, tlhahlobo ea ts'ebetso, le liprothokholo tsa netefatso ea ho qetela
• Tlhahlobo e tsoetseng pele - Microsectioning, tlhahlobo ea X-ray, le sebopeho sa tšitiso ea mocheso
• Mekhoa ea Boleng - Tlhahiso e netefalitsoeng ea ISO le IATF e nang le traceability e felletseng

Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka hore na mokhoa oa rona oa tlhahiso o shebaneng le botšepehi o tšehetsa litlhoko tsa hau tsa kopano ea semiconductor joang.