Tataiso e Feletseng ea Semiconductor PCB Manufacturing

Selelekela

Tlhahiso ea li-PCB tsa semiconductor e bapala karolo ea bohlokoa ho paketeng ea li-chip, litsamaisong tsa liteko le lits'ebetsong tse tsoetseng pele tsa elektroniki. Liboto tsena tse ikhethileng li sebetsa e le liboto tsa liteko , liboto tsa mojaro , likarete tsa probe , le li-platform tsa sebopeho tse hlokang ho nepahala le ho tšepahala ho ikhethang. Tlhahiso ea li-PCB tsa semiconductor e kenyelletsa lits'ebetso tse laoloang haholo tse netefatsang ho nepahala, ho tšepahala le ho lumellana le lisebelisoa tsa semiconductor.

Ho tloha ho moralo oa pele ho ea ho kopano ea SMT, mohato o mong le o mong o khetha tšebetso ea ho qetela ea boto le chai. Tataiso ena e tsamaea ka phallo e felletseng ea tlhahiso, e totobatsang kamoo litšebeletso tse kopaneng tsa PCBA li tsamaisang tlhahiso bakeng sa lits'ebetso tsa semiconductor.

Semiconductor PCB Manufacturing: Moralo le moralo oa motheo

Mehaho e Meholo e Meholo e Meholo e Meholo

Ntlafatso ea moralo e qala ka theknoloji ea HDI e lumellang mesaletsa ea molumo o motle, li-microvias le ho patoa ka bofofu ka meaho ea liphutheloana tse rarahaneng tsa semiconductor. Taolo ea tšitiso, litsela tse fapaneng, le phokotso ea crosstalk li boloka botsitso ba matšoao maemong a holimo. Lisebelisoa tse tloaelehileng tsa EDA tse kang Altium Designer, Cadence, le Mentor Graphics li fana ka tlhahlobo ea melao ea moralo le bokhoni ba ho etsisa bo hlokahalang bakeng sa ho netefatsa meralo ea tlhahiso ea semiconductor PCB pele e etsoa.

Mekhoa ea Tsamaiso ea Mocheso

Phallo e sebetsang hantle ea mocheso e hloka moralo oa leano la ho bokellana. Lintlha tsa bohlokoa tsa moralo oa thermal li kenyelletsa:

• Metal core substrates - Ts'ebetso e tobileng ea mocheso ho tloha lisebelisoa tse matla tsa semiconductor ho ea ho litepisi tsa mocheso.
• Lichelete tsa tšepe tsa koporo tse kentsoeng - Boima ba mocheso o sebakeng sa heno bo fokotsa mocheso oa hotspot libakeng tse mahlonoko.
• Kaho ea ka-ka-pad - Tsela e khuts'oane ea mocheso ho tloha ho karolo ho ea ho lifofane tse kahare tsa koporo.
• Ho beoa ha sefofane se fatše - Tokiso e ntlafalitsoeng ea li-stackup e fokotsa lerata la motlakase hape e ntlafatsa ho hasana ha mocheso.

Moralo bakeng sa manufacturability le melao-motheo ea testability e sebelisoang mothating ona e fokotsa haholo litaba tsa tlhahiso tlhahisong ea semiconductor PCB.

Khetho ea Boitsebiso ho Semiconductor PCB Manufacturing

Lisebelisoa tsa Substrate le Litšobotsi tsa Ts'ebetso

Khetho ea thepa e khetholla ts'ebetso ea motlakase, botsitso ba mocheso, le ho nepahala ha litekanyo tlhahisong ea PCB ea semiconductor. High Tg FR-4 e fana ka litharollo tse theko e tlaase bakeng sa lits'ebetso tsa mocheso o itekanetseng, ha malapa a polyimide le a khethehileng a laminate a nang le tahlehelo e tlase a fana ka ts'ebetso e phahameng bakeng sa meralo ea maqhubu a phahameng. BT resin le li-substrate tsa ceramic li fana ka botsitso bo ikhethang ba litekanyo bo hlokahalang bakeng sa liphutheloana tsa semiconductor tse nang le pitch e ntle. Khetho e 'ngoe le e' ngoe ea thepa e ama tahlehelo ea lets'oao, coefficient ea katoloso ea mocheso, le ts'epo ea nako e telele.

Lamination Process Control

Ts'ebetso ea lamination e kopanya lihlopha tse ngata tsa koporo tse nang le lisebelisoa tsa prepreg tlas'a mocheso o laoloang le khatello. Sistimi e nepahetseng ea ho hokahanya e netefatsa ho nepahala ha ngoliso ea lera-to-layer ho bohlokoa bakeng sa li-microvias le li-passage tse patiloeng. Vacuum lamination e thibela voids le delamination, athe profiling ea mocheso e netefatsa pheko e felletseng ea resin. Highleap Electronics e boloka liparamente tse thata tsa lamination ho ts'ehetsa meaho ea mekhahlelo e mengata ho tloha ho li-stackups tse tloaelehileng ho isa ho litlhophiso tse tsoetseng pele tsa HDI.

Ho etsa litšoantšo, ho Etching, le ho Cheka ho Semiconductor PCB Manufacturing

Theknoloji ea ho Etsa Litšoantšo ka Laser Direct

Ho etsa semiconductor PCB ho sebelisa litšoantšo tse otlolohileng tsa laser ho fihlela qeto ea mela e metle le phetisetso e nepahetseng. Litsamaiso tsa LDI li felisa li-photomasks, li fana ka phetoho e potlakileng le ho nepahala ho ntlafetseng bakeng sa mekhoa ea potoloho e phahameng. Mokhoa oa ho nka litšoantšo o hlalosa mekhoa ea conductor holim'a likarolo tsa koporo tse koahetsoeng ke photoresist, ho theha motheo oa ts'ebetso e latelang ea etching. Taolo e tiileng ea ngoliso e netefatsa hore tlhophiso ea lera-to-layer e kopana le lintlha tse hlokahalang bakeng sa liboto tsa ATE le likopo tsa likarete tsa lipatlisiso.

Ho cheka ka nepo le ho Etching

Etching ea lik'hemik'hale e tlosa koporo e sa batleheng ho etsa lipaterone tsa potoloho ka bophara bo laoloang le sebaka. Ho cheka ka mechine ho hlahisa masoba a nang le mamello e tiileng ea bophara, ha ho cheka ka laser ho hlahisa microvias bakeng sa mehaho ea HDI. Taolo ea botebo ba ho cheka le taolo ea li-burr tsa ho tsoa li bohlokoa bakeng sa sebopeho se ka tšeptjoang sa likoti, ho netefatsa ts'ebetso ea motlakase nakong eohle ea ts'ebetso ea ho etsa semiconductor PCB.

Ho pola le ho Qetella Bokaholimo bakeng sa li-PCB tsa Semiconductor

Electroplating bakeng sa Khokahano

Electroplating e kenya koporo ka har'a masoba a phuntsoeng ho theha likhokahano tsa motlakase lipakeng tsa mekhahlelo. Kabo ea hona joale ea sekhahla le taolo ea nako ea plating e netefatsa botenya ba koporo bo ts'oanang ho phanele. Ho roala ka lesoba ho hloka hore ho behoe koporo e lekaneng ho fihlela litekanyetso tsa IPC bakeng sa ho ts'epahala tlas'a libaesekele tse futhumetseng. Ho roala mohlala ho eketsa koporo ho mesaletsa ea conductor, ho aha botenya ho sebetsana le litlhoko tsa hajoale lits'ebetsong tsa tlhahiso ea semiconductor PCB.

Khetho ea Qetello ea Bokaholimo

Ho qeta bokaholimo ho sireletsa koporo e pepesitsoeng mme ho fana ka libaka tse rekisoang bakeng sa ho kopanya likarolo:

• ENIG (Electroless Nickel Immersion Gold) - Polane e ntle haholo bakeng sa liphutheloana tsa BGA le CSP tse hlakileng.
• ENEPIG - E eketsa lera la palladium bakeng sa khokahanyo ea terata le tšebelisano e 'ngoe le e 'ngoe ea reflow.
• OSP (Organic Solderability Preservative) - Koko ea manyolo e theko e tlaase e nang le solderability e ntle.
• Silivera ea ho qoelisoa - Phapang e nyane ea botenya e loketse lits'ebetso tsa maqhubu a holimo.

Liboto tsa liteko tsa semiconductor li hloka libaka tse bataletseng haholo ho netefatsa khatello e tsitsitseng ea likhokahano ho pholletsa le li-probe arrays le li-socket interfaces.

Kopo ea Mask ea Solder le Tlhahlobo ea ho Qetela

Mask ea solder le Silkscreen

Mask ea solder e ka bonoang e hlalosa libaka tse rekisoang ha e ntse e fana ka ts'ireletso le ts'ireletso ea tikoloho. Ho nepahala ha ngoliso ho tiisa hore ho na le tumello e nepahetseng ho pota-potile li-pads le vias. Botenya ba mask a solder le ho thatafala ho ama ho hanyetsa khatello ea maikutlo le mocheso oa mochini nakong ea liteko tse pheta-phetoang. Tšōmo ea Silkscreen e eketsa li-identifiers tsa likarolo bakeng sa ho kopanya le ho rarolla mathata ha ho etsoa semiconductor PCB.

Mekhoa ea ho netefatsa boleng

Tlhahlobo e ikemetseng ea optical inspection bakeng sa bofokoli ba mask a solder, trace anomalies, le ho kheloha ha sebopeho. Teko ea li-flying probe e netefatsa ho tsoela pele ha motlakase le ho itšehla thajana ntle le ho hloka lisebelisoa tsa liteko. Tlhahlobo ea X-ray e lekola kahare ka meaho le mefokolo e patiloeng meahong ea multilayer. Mekhahlelo ena ea tlhahlobo e netefatsa phano e se nang sekoli pele liboto li kena mohatong oa kopano.

Semiconductor PCB Manufacturing: Ts'ebetso ea Kopano ea SMT

Surface Mount Technology Integration

Ts'ebetso ea kopano ea SMT e qala ka khatiso ea solder paste ho sebelisoa li-stencil tse nepahetseng tse laolang bophahamo ba peste le ho nepahala ha sebaka. Lisebelisoa tsa ho khetha le ho beha li beha likarolo tse nang le ho pheta-pheta ha boemo ba micrometer, e leng sa bohlokoa bakeng sa liphutheloana tsa BGA, QFN, le CSP tse nang le molumo o motle. Ho kopanya hape ho etsa litlamo tsa tšepe ho sebelisa liprofaele tsa mocheso tse laoloang ka hloko tse thibelang tšenyo ea likarolo ha li ntse li netefatsa manonyeletso a tšepahalang a solder.

Bokhoni bo tsoetseng pele ba Kopano

Highleap Electronics e kopanya mela e tsoetseng pele ea kopano ea SMT le lits'ebetso tse tiileng tsa IPC le ISO, e fana ka litharollo tsa tlhahiso le kopano ea PCB ea semiconductor ea onto e le 'ngoe . Tlhahlobo ea optical e iketsahallang kamora ho phalla hape e netefatsa sebaka sa likarolo, boleng ba manonyeletso a solder, le polarity. Tlhahlobo ea X-ray e hlahloba manonyeletso a solder a patiloeng tlas'a liphutheloana tsa BGA, e netefatsa likhokahano tse se nang letho tse bohlokoa bakeng sa ts'ebetso ea mocheso le motlakase.

Tiisetso ea Boleng ho Semiconductor PCB Manufacturing

Teko ea Motlakase le Ts'ebetso

Teko ea potoloho e netefatsa boleng ba likarolo le ts'ebetso ea potoloho ka lisebelisoa tsa bethe ea lipekere kapa lisebelisoa tse fofang. Teko ea ts'ebetso e netefatsa ts'ebetso ea boto tlasa maemo a ts'ebetso, ho etsisa maemo a sebele a ts'ebeliso. Lithuto tsa liteko tsa ho chesa li kopanya mocheso o phahameng le khatello ea motlakase ho supa liphoso tsa pele. Liteko tsena tsa liteko li netefatsa hore tlhahiso ea semiconductor PCB e fana ka liboto tse khonang ho mamella litlhoko tse matla tsa tlhahlobo ea tikoloho.

Tumellano le Traceability

Litsamaiso tsa taolo ea boleng li boloka ts'ebetso e felletseng ho tsoa ho thepa e tala ka kopano ea ho qetela. Litifikeiti tsa ISO9001, IATF16949, le ISO13485 li bonts'a taolo e hlophisehileng ea ts'ebetso le mekhoa e tsoelang pele ea ntlafatso. Libaesekele tse futhumatsang le tlhahlobo ea khatello ea mochini li netefatsa ho ts'epahala ha nako e telele. Liphutheloana tsa litokomane li kenyelletsa litifikeiti tsa thepa, litlaleho tsa liteko, le lirekoto tsa mohahlauli tse tšehetsang litlhoko tsa litlhoko tsa bareki.

fihlela qeto e

Tlhahiso ea Semiconductor PCB e kenyelletsa phallo e felletseng ea ts'ebetso ho tloha moralong oa pele ho fihlela kopano ea ho qetela le netefatso. Mothati o mong le o mong o hloka taolo e nepahetseng ho fihlela ho nepahala ha boholo, ts'ebetso ea motlakase, le ts'epahalo e batloang ke litsamaiso tsa tlhahlobo ea semiconductor le lits'ebetso tse tsoetseng pele tsa ho paka.

Highleap Electronics e fana ka bokhoni bo felletseng ba ho etsa semiconductor PCB:

• Tlhahiso e tsoetseng pele ea HDI - Ho cheka ka laser, ho nahana ka mela e metle, le ho sitisoa ho laoloang bakeng sa meralo e phahameng haholo.
• Tsebo ea lintho tse ngata – FR-4 high Tg, laminate e khethehileng e nang le tahlehelo e tlase, polyimide, le ts'ebetso ea substrate ea ceramic.
• Kopano e kopantsoeng ea SMT - Lits'ebetso tse netefalitsoeng ke IPC ka tlhahlobo ea AOI le X-ray bakeng sa liphutheloana tsa BGA le CSP.
• Teko e felletseng - ICT, tlhahlobo ea ts'ebetso, le netefatso ea ho chesoa e netefatsa ho ts'epahala ha nako e telele.
• Litifikeiti tsa boleng - Ho lumellana ha ISO9001, IATF16949, le ISO13485 ka traceability e felletseng.

Hore na o hloka diboto tsa ho kenya di-semiconductor, di-PCB tsa dikarete tsa probe, kapa kopanyo e felletseng ya PCBA, Highleap Electronics e fana ka ditshebeletso tsa tlhahiso ya ntho e le nngwe ho tshehetsa projeke ya hao. Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka moo bokgoni ba rona ba tlhahiso ya di-PCB tsa di-semiconductor bo ka potlakisang kemiso ya nako ya ntshetsopele ya sehlahiswa sa hao.