Tataiso le Tšebeliso ea Substrate ea Koporo e Kopantsoeng ka ho Otloloha

Substrate ea koporo e kopantsoeng ka ho toba ke sesebelisoa sa potoloho ea letsopa se entsoeng ka ho kopanya koporo ka ho toba le setsi sa letsopa mochesong o phahameng. E sebelisoa haholo limmojuleng tsa motlakase le meralong e meng ea elektroniki e nang le mocheso o phahameng e hlokang phetiso e sebetsang hantle ea mocheso le ho thibela motlakase. Leqephe lena le hlalosa mantsoe, kamano le theknoloji ea DBC, le litšobotsi tsa bohlokoa tse amanang le tlhahiso ea PCB ea letsopa le PCB.

---

Li-substrate tsa koporo tse tlamiloeng ka kotloloho li sebelisoa hangata li-elektroniki tsa motlakase le meralo e meng ea matla a maholo moo tsamaiso ea mocheso le ho itšehla thajana ha motlakase li leng bohlokoa. Ho Highleap Electronics, re moetsi oa PCB ea fanang ka litšebeletso tse felletseng o fanang ka li-PCB tsa ceramic, li-substrate tsa DBC, liboto tsa mantlha tsa tšepe, li-PCB tse nang le mekhahlelo e mengata, le lits'ebeletso tse felletseng tsa kopano ea PCB. Tataiso ena e thusa baenjiniere le lihlopha tsa ho fumana mehloli ho utloisisa hore na li-substrate tsa koporo tse tlamiloeng ka kotloloho li sebetsa joang le hore na li lumellana joang le likhetho tse pharaletseng tsa tlhahiso ea PCB le ea ceramic.

Kopa Khoteshene bakeng sa PCB ea Hao kapa Morero oa PCB oa Ceramic

Ithute haholoanyane ka bokgoni ba rona ba ho etsa PCB ka letsopa kapa hlahloba ditshebeletso tsa rona tse felletseng tsa tlhahiso le kopano ya PCB.

---

1) Tlhaloso ea Substrate ea Koporo e Kopantsoeng ka ho Otloloha

Substrate ea koporo e kopantsoeng ka ho toba ke substrate e khethehileng ea elektroniki e nang le lera la ho thibela serame le nang le foil ea koporo e kopantsoeng ka tšepe holim'a e 'ngoe kapa ka bobeli. Mantsoe a reng "kamano e tobileng" a totobatsa hore koporo e khomarela ka ho toba ho ceramic ntle le likarolo tse mahareng tsa sekhomaretsi, li-epoxies, kapa ho tiisa ka mechine.

Ho tlamahana ho etsahala mochesong o phahameng (hangata 1065-1085°C) sepakapakeng se laolwang, moo oxide ea koporo e hokahaneng e thusang karabelo ea lik'hemik'hale le bokaholimo ba ceramic. Sena se theha lera la metsoako ea tšepe e kopanyang koporo ka ho sa feleng le ceramics tse kang alumina (Al₂O₃), aluminium nitride (AlN), kapa silicon nitride (Si₃N₄).

Sebopeho se hlahang se kopanya ho tsamaisa motlakase ha koporo le ho tsamaisa mocheso le thepa ea dielectric ea ceramic. Ho fapana le liboto tsa potoloho ea lintho tse phelang, li-substrate tsa koporo tse kopantsoeng ka kotloloho li boloka botsitso mochesong o fetang 300°C 'me li ka mamella lipotoloho tse likete tsa mocheso ntle le ho arohana.

---

2) Kamano Pakeng tsa Koporo e Kopantsoeng ka ho Otloloha le DBC

“Substrate ea koporo e kopantsoeng ka kotloloho” le “ Substrate ea DBC ” li bolela theknoloji e tšoanang. DBC ke khutsufatso ea maemo a indasteri e nkiloeng ho Direct Bonded Copper. Mantsoe ana ka bobeli a hlaha ka mokhoa o fapaneng libukeng tsa tekheniki, litlhalosong tsa theko le litokomaneng tsa tlhahiso.

Litokomane tsa boenjiniere li ka sebelisa lentsoe lefe kapa lefe ho latela moelelo le melao ea libaka. Baenjiniere ba Amerika Leboea le Europe hangata ba sebelisa "DBC" puisanong e sa reroang ha ba ntse ba totobatsa "koporo e kopantsoeng ka kotloloho" litokomaneng tsa semmuso. Bahlahisi ba Asia hangata ba sebelisa "DBC" hoo e ka bang feela. Litsebi tsa theko li lokela ho tseba mantsoe ana ka bobeli ha li fumana li-substrate tsena.

Mantsoe a mang a amanang empa a fapane ka linako tse ling a baka pherekano:

• DCB (Kopanyo e Otlolohileng ya Koporo): Kakaretso e 'ngoe ka linako tse ling e sebelisoang libukeng tsa tekheniki tsa puo ea Sejeremane, e bolelang theknoloji e tšoanang.
• DPC (Koporo e Tloaelehileng): Theknoloji e fapaneng e kenyeletsang ho kenngoa ha koporo e tšesaane ho fapana le ho kopanngoa ha koporo ka bongata.
• AMB (Sesepa sa Tšepe se Sebetsang): Theknoloji e amanang le ho kopanya tšepe ea letsopa e sebelisang li-alloy tsa braze ho e-na le ho kopanya ka ho toba le oxidation.

3) Litšobotsi tsa Bohlokoa le Melemo

Li-substrate tsa koporo tse hokahaneng ka ho toba li bontša litšobotsi tse 'maloa tsa ts'ebetso tse li khethollang ho thepa ea boto ea potoloho e tloaelehileng:

3.1 Ts'ebetso ea Thermal

Tlamo e tobileng e felisa khanyetso ea sebopeho sa mocheso pakeng tsa koporo le ceramic. Ha e kopantsoe le li-conductivity tsa mocheso oa ceramic tse tlohang ho 24 W/m·K (alumina) ho isa ho 230 W/m·K (high-purity AlN), li-substrate tsa koporo tse kopantsoeng ka kotloloho li fetisetsa mocheso ka katleho ho tloha lisebelisoa tsa motlakase ho ea lits'ebetsong tsa ho pholisa. Litekanyetso tsa khanyetso ea mocheso tse tlase ho 0.1°C/W ka skwele centimeter li ka finyelloa ka li-substrate tsa aluminium nitride.

3.2 Thepa ea Motlakase

Lisebelisoa tsa letsopa li fana ka karohano e ikhethang ea motlakase, 'me matla a dielectric a atisa ho feta 15 kV/mm. Sena se nolofalletsa li-substrate tsa koporo tse kopantsoeng ka kotloloho ho arola lipotoloho tsa motlakase tse nang le motlakase o phahameng ka mokhoa o sireletsehileng ho tsoa ho li-heatsink tse thehiloeng fatše. Motsoako oa koporo e teteaneng (0.127-0.635mm) le matla a dielectric a phahameng li etsa hore li-substrate tsena li be ntle bakeng sa li-module tsa motlakase tse sebetsang ho 1200V, 1700V, kapa ho feta.

3.3 Tšepo ea Mekaniki

Tlamo ea tšepe pakeng tsa koporo le letsopa e hanela karohano tlas'a khatello ea mocheso. Li-substrate tsa koporo tse kopantsoeng ka kotloloho tse entsoeng hantle li phela lipotoloho tse 3,000+ tsa mocheso pakeng tsa -40°C le +125°C ntle le ho senyeha ha tlamo. Ho tšepahala hona ho bohlokoa bakeng sa lits'ebetso tsa likoloi, tsa indasteri le tsa lifofane tse nang le litlhoko tse thata tsa bophelo bohle.

3.4 Bokhoni ba ho Sebetsana le Hona Jwale

Botenya ba koporo ba 0.3mm le ho feta bo nolofalletsa di-substrate tsa koporo tse hokahaneng ka ho toba ho jara maqhubu a tswelang pele a fetang 50A ka tatellano ya potoloho. Ha e kopantswe le ho qhala ha mocheso ho babatsehang, sena se dumella meralo ya di-module tsa matla tse nyane tse neng di ke ke tsa kgoneha ka diboto tsa potoloho ya tlhaho.

---

4) Litšebeliso tse Tloaelehileng tsa Liindasteri

Li-substrate tsa koporo tse hokahaneng ka kotloloho li sebeletsa lits'ebetso tse hlokang boiteko liindastering tse ngata moo taolo ea mocheso, ts'epo le ts'ebetso ea motlakase li leng bohlokoa. Ithute haholoanyane ka likhetho tse ikhethileng tsa thepa ea letsopa ho tataiso ea rona ea substrate ea ceramic ea DBC.

4.1 Matla a Elektronike

• Li-module tsa IGBT bakeng sa li-drive tsa liindasteri le litsamaiso tsa ho hula
• Sephutheloana sa sesebelisoa sa motlakase sa SiC le GaN
• Li-inverter tsa motlakase oa motlakase le litjhaja tse ka hare ho sekepe
• Li-inverter tsa letsatsi le li-converter tsa turbine ea moea
• Lisebelisoa tsa ho tjheseletsa tsa indasteri le tsa ho futhumatsa ka induction

4.2 RF le Microwave

• Li-amplifier tsa RF tse matla haholo
• Li-module tsa phetisetso ea radar
• Li-amplifiers tsa motlakase tsa setsi sa 5G

4.3 Mabone a Tiileng a Boemo

• Liphutheloana tsa LED tse khanyang haholo
• Di-module tsa LED tsa COB (Chip-on-Board)
• Mabone a koloi le litsamaiso tsa ponelopele

---

5) Kamoo Theknoloji ena e Lokelang ho Kena Tlhahisong ea PCB

Tlhahiso ea substrate ea koporo e kopantsoeng ka kotloloho e hloka bokhoni bo ikhethang bo fapaneng le tlhahiso ea PCB ea setso . Leha li-PCB tsa setso li sebelisa lamination, ho cheka le ho penta thepa ea tlhaho, substrate ea koporo e kopantsoeng ka kotloloho e hloka:

• Lionto tsa ho kopanya tse nang le mocheso o phahameng: E khona ho laola mocheso ka nepo ho 1065-1085°C ka sepakapaka se laoloang.
• Tsebo ea ho sebetsana le letsopa: Li-substrate tsa ceramic tse senyehileng li hloka ho lokisa le ho sebetsana ka mokhoa o khethehileng nakong eohle ea ts'ebetso.
• Khemistri e ikhethang ea ho betla: Mealo e teteaneng ea koporo e hloka linako tse telele tsa ho qoelisoa le ntlafatso ea ts'ebetso bakeng sa tlhaloso e tsitsitseng ea mola.
• Bokhoni ba ho sebetsana le laser: Meralo e mengata e hloka ho ngolwa kapa ho sehwa ka laser bakeng sa ho singulwa ha letsopa.

Ho sebetsa le moetsi ea nang le boiphihlelo oa DBC substrate ho netefatsa phihlello ea bokhoni bona bo ikhethang le tsebo ea ts'ebetso e hlokahalang bakeng sa boleng bo tsitsitseng.

Bakeng sa kutloisiso e tebileng ea mekhoa ea ho kopanya le liparamente tsa ts'ebetso, sheba tataiso ea rona ea tekheniki mabapi le ts'ebetso ea DBC.

---

6) Ithute Haholoanyane ka Li-substrate tsa DBC

Highleap Electronics e fana ka mehlodi e felletseng bakeng sa baenjiniere le litsebi tsa theko tse sebetsang ka theknoloji ea koporo e kopantsoeng ka kotloloho. Hlahloba maqephe a rona a amanang bakeng sa tlhaiso-leseling e tebileng ea tekheniki:

• Kakaretso ea Sebaka se ka tlas'a DBC – Setsi se bohareng se akaretsang likarolo tsohle tsa theknoloji ea DBC
• Tataiso ea DBC Ceramic Substrate - Papiso e qaqileng ea likhetho tsa thepa ea letsopa
• Tataiso ea Tekheniki ea Ts'ebetso ea DBC – Melao-motheo ea tlhahiso le lintlha tsa boleng
• Litharollo tsa Ceramic PCB - Kakaretso e batsi ea mahlale a boto ea potoloho ea letsopa

6.1 Kopa Tšehetso ea Tekheniki

Sehlopha sa rona sa boenjiniere ba lits'ebetso se thusa ka khetho ea thepa, ntlafatso ea moralo, le nts'etsopele ea litlhaloso bakeng sa merero ea substrate ea koporo e kopantsoeng ka kotloloho. Hore na o hloka tataiso mabapi le khetho ea thepa ea letsopa kapa thuso ea ho ntlafatsa moralo oa hau bakeng sa tlhahiso, re ikemiselitse ho tšehetsa projeke ea hau.

Ikopanye le Tšehetso ea Boenjiniere