Tataiso ea Lisebelisoa tsa DBC Ceramic Substrate le Khetho

Ho khetha thepa e loketseng ea letsopa bakeng sa li-substrate tsa DBC ho ama ho qhalana ha mocheso, ho thibela motlakase, le ho tšepahala ha nako e telele. Leqephe lena le bapisa alumina Al2O3 aluminium nitride AlN le silicon nitride Si3N4 ho sebelisoa lintlha tsa boenjiniere tse sebetsang ho tšehetsa khetho ea thepa bakeng sa lisebelisoa tsa motlakase tsa motlakase le meralo ea PCB ea letsopa.

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Di-substrate tsa ceramic tsa DBC di sebedisa thepa e fapaneng ya motheo ho leka-lekanya ho tsamaisa mocheso, matla a mechini le ditjeo. Alumina e fana ka tshebetso e theko e tlase bakeng sa ditshebediso tse akaretsang, aluminium nitride e fana ka ho tsamaisa mocheso ho hoholo bakeng sa meralo e sebedisang mocheso o mongata, mme silicon nitride e ntlafatsa ho tshwarella ha mechini tlasa potoloho ya mocheso. Ho utlwisisa dipharologanyo tsena ho thusa baenjiniere ho kgetha kgetho e loketseng ka ho fetisisa ho latela ditlhoko tsa sistimi le ho tsamaellana le mekgwa ya tlhahiso ya PCB ya ceramic e tlase le mesebetsi e pharaletseng ya tlhahiso le kopano ya PCB.

Bakeng sa merero e hlokang tšehetso ea tlhahiso ea prototype kapa bophahamo ba modumo, o ka kopa khotheishene ka ho toba ka tlase.

Kōpa Quote

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Sebaka sa DBC Ceramic ke Eng?

Substrate ea ceramic ea DBC e kopanya setsi sa tšireletso ea ceramic le li-conductor tsa koporo tse hokahaneng ka ho toba. Lera la ceramic le fana ka karohano ea motlakase, tšehetso ea mechini, le phallo ea mocheso pakeng tsa lisebelisoa tsa motlakase le sistimi ea ho pholisa. Ho utloisisa likhetho tsa thepa ea ceramic ho bohlokoa bakeng sa ho ntlafatsa ts'ebetso ea substrate ea DBC ts'ebelisong efe kapa efe.

Thepa ea 'mele ea thepa ea letsopa e khetholla bokhoni ba substrate ka botlalo:

• Thermal conductivity: E laola hore na mocheso o fetisetsoa joang ka katleho ho tloha lisebelisoa tsa motlakase ho ea ho heatsink
• Katoloso e sebetsang hantle ea mocheso (CTE): E ama ts'epahalo tlas'a potoloho ea mocheso ha e sa tsamaisane le lisebelisoa tse ling
• Matla a mochini: E khetholla ho hanyetsa ho petsoha tlas'a khatello ea mocheso le ea mechine
• Matla a dielectric: E hlalosa bokgoni bo phahameng ka ho fetisisa ba motlakase o sebetsang

Litekanyetso tsa ts'ebetso ea DBC lia fapana ho latela thepa ea letsopa, 'me e' ngoe le e 'ngoe e hloka mocheso o itseng oa ho kopanya le sepakapaka bakeng sa liphetho tse ntle.

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2) Lisebelisoa tse Tloaelehileng tsa Ceramic tse Sebelisoang ho DBC

Lisebelisoa tse tharo tsa letsopa li laola tlhahiso ea substrate ea DBC, e 'ngoe le e 'ngoe e fana ka litšobotsi tse ikhethang tsa ts'ebetso:

2.1 Alumina (Al₂O₃)

Li-ceramic tsa alumina li sebelelitse e le thepa e sebetsang bakeng sa li-substrate tsa DBC ho tloha ha theknoloji e thehoa. E fumaneha ka limaraka tsa bohloeki ho tloha ho 92% ho isa ho 99.6%, alumina e fana ka ketane ea phepelo e hōlileng tsebong, ts'ebetso e ka boleloang esale pele, le litheko tse qothisanang lehlokoa. Kereiti ea bohloeki ea 96% e emela khetho e tloaelehileng haholo bakeng sa lits'ebetso tse tloaelehileng tsa elektroniki tsa motlakase.

Thepa ea bohlokoa ea alumina ea 96%:

• Thermal conductivity: 24-28 W/m·K
• CTE: 7.1 ppm/°C
• Matla a Flexural: 350-400 MPa
• Matla a dielectric: 15-20 kV / mm

2.2 Aluminium Nitride (AlN)

Aluminium nitride e fana ka phallo ea mocheso ka makhetlo a 7-10 ho feta alumina, e leng se etsang hore e be khetho e ratoang bakeng sa lits'ebetso tse hlokang mocheso. Liserame tsa AlN tsa boleng bo holimo li fihlella phallo ea mocheso ea 170-230 W/m·K ho latela bohloeki le ts'ebetso. Ts'ebetso ena e ikhethang ea mocheso e lokafatsa litšenyehelo tse phahameng tsa thepa lits'ebetsong moo ho qhala ha mocheso ho fokotsang bongata ba matla.

Litšobotsi tsa bohlokoa tsa AlN:

• Thermal conductivity: 170-230 W/m·K
• CTE: 4.5 ppm/°C (e bapisa hantle le 2.6 ppm/°C ea silicon)
• Matla a Flexural: 300-350 MPa
• Matla a dielectric: 15-17 kV / mm

2.3 Silicon Nitride (Si₃N₄)

Silicon nitride e fana ka matla a phahameng ka ho fetisisa a mechini le ho tiea ha ho robeha hara di-ceramic tse tlwaelehileng tsa DBC. Le hoja ho tsamaisa ha yona mocheso ho wela pakeng tsa alumina le AlN, ho hanyetsa ha yona mocheso ka tsela e ikgethang le kgatello ya mechini ho etsa hore e tuma haholo bakeng sa ditshebediso tse hlokang di-automotive le tsa terene moo ho tshepahala ha nako e telele tlasa maemo a thata ho leng bohlokwa.

Litšobotsi tsa bohlokoa tsa Si₃N₄:

• Thermal conductivity: 70-90 W/m·K
• CTE: 2.6 ppm/°C (e tšoana hantle le silicon)
• Matla a Flexural: 700-900 MPa
• Ho tiea ha ho robeha: 6-7 MPa·m^½

3) AlN khahlano le Al₂O₃ khahlano le Si₃N₄ DBC Substrates

Ho kgetha pakeng tsa thepa ya letsopa ho hloka ho leka-lekanya dintlha tse ngata tsa tshebetso kgahlanong le ditjeo le boteng ba yona. Papiso e latelang e totobatsa dipharologanyo tsa bohlokwa tse amanang le kgetho ya substrate.

3.1 Tekanyetso ea Tshebetso ea Thermal

AlN > Si₃N₄ > Al₂O₃

Li-substrate tsa AlN li fokotsa khanyetso ea mocheso oa junction-to-case ka 60-70% ha li bapisoa le alumina ka li-geometri tse tšoanang. Molemo ona oa mocheso o fetolela ka ho toba bokhoni bo phahameng ba ho sebetsana le matla kapa mocheso o tlase oa ts'ebetso.

3.2 Boemo ba Tšepo ea Mekaniki

Si₃N₄ > Al₂O₃ > AlN

Ho tiea ho hoholo ha silicon nitride ho etsa hore e hanele ho petsoha ho bakoang ke ho thothomela ha mocheso kapa khatello ea mechine. Li-substrate tsa Si₃N₄ DBC li phela khafetsa lipotolohong tsa mocheso tse fetang 5,000 moo li-substrate tsa AlN tsa moralo o tšoanang li ka 'nang tsa hlōleha ka mor'a lipotoloho tse 3,000.

3.3 Boemo ba Litšenyehelo (Botlaase ho isa ho Boholo)

Al₂O₃ < AlN < Si₃N₄

Hangata di-substrate tsa Alumina DBC di bitsa tjhelete e ka tlase ho 30-50% ho feta tse lekanang le AlN, ha Si₃N₄ e laela theko e phahameng ka lebaka la ditlhoko tse rarahaneng tsa ho sebetsana le letsopa. Bophahamo ba bophahamo le ho rarahana ha dibopeho di ama haholo ditheko tsa nnete.

3.4 Papali ea CTE le Silicon

Si₃N₄ (2.6 ppm/°C) ≈ Silicone (2.6 ppm/°C) < AlN (4.5 ppm/°C) < Al₂O₃ (7.1 ppm/°C)

Ho bapisa CTE e haufi pakeng tsa substrate le semiconductor die ho fokotsa kgatello ya mocheso manonyellong a solder le di-interface tsa die attach, ho ntlafatsa botshepehi tlasa potoloho ya mocheso.

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4) Papiso ea Tshebetso ea Mocheso le Motlakase

Ho utloisisa dipharologanyo tsa tshebetso ya bongata ho thusa baenjiniere ho etsa diqeto tsa kgetho ya thepa ho latela ditlhoko tsa tshebediso. Hlahloba sebaka se pharaletseng sa mahlale a potoloho ya letsopa leqepheng la rona la kakaretso ya PCB ya letsopa.

4.1 Papiso ea Khanyetso ea Thermal

Bakeng sa substrate ea letsopa e teteaneng ea 1mm ka boholo ba 10mm × 10mm:

• Al₂O₃: ~0.42°C/W khanyetso ea mocheso
• AlN: ~0.05°C/W khanyetso ea mocheso
• Si₃N₄: ~0.13°C/W khanyetso ea mocheso

Liphapang tsena lia kopana ha ho raloa mocheso o itseng oa li-junction, li ama ka kotloloho bongata ba matla bo ka fihlellehang.

4.2 Tshebetso ya Dielectric

Liserami tsohle tse tharo li fana ka karohano e ntle ea motlakase bakeng sa lits'ebetso tsa motlakase oa motlakase.

• Motlakase oa ho qala ho ntša metsi ka karolo e itseng: Hangata AlN e bontša motlakase o tlaase oa ho qala ho ntša metsi ho feta alumina ka botenya bo lekanang, e leng se hlokang ho nahanoa meralong ea motlakase o phahameng.
• Resisivity ea molumo: Lisebelisoa tsena tse tharo li boloka matla a ho hanyetsa >10^14 Ω·cm mochesong oa kamore, li theoha haholo mochesong o phahameng.
• Tahlehelo ea tahlehelo: Bohlokoa bakeng sa lits'ebetso tsa RF; AlN e fana ka tahlehelo e tlase ka ho fetisisa ea dielectric har'a liseramike tsena.

5) Khetho ea Lintho tse Sebetsang ka Ts'ebeliso

Khetho e ntle ka ho fetisisa ea letsopa e itšetlehile haholo ka litlhoko tsa ts'ebeliso. Litataiso tse latelang li thusa ho bapisa thepa le linyeoe tse tloaelehileng tsa ts'ebeliso.

5.1 Khetha Alumina (Al₂O₃) Neng:

• Ntlafatso ea litšenyehelo ke taba ea bohlokoa
• Litlhoko tsa mocheso li mahareng (botenya ba matla <50 W/cm²)
• Thempereichara ea ts'ebetso e lula e le ka tlase ho 150°C
• Moralo o ka amohela sebaka se seholo sa substrate bakeng sa ho hasana ha mocheso
• Li-drive tse tloaelehileng tsa liindasteri, litsamaiso tsa UPS, le lisebelisoa tsa motlakase tse akaretsang

5.2 Khetha Aluminium Nitride (AlN) Neng:

• Ho hlokahala ts'ebetso e phahameng ka ho fetisisa ea mocheso
• Boima ba matla bo feta 100 W/cm²
• Lithibelo tsa boholo li thibela ho ata ha mocheso ka alumina
• Lisebelisoa tsa SiC kapa GaN tse nang le lekhalo le pharaletseng li hloka ho pholisa ho ntlafalitsoeng
• Li-inverter tsa motlakase tsa motlakase oa EV, lisebelisoa tsa elektroniki tsa motlakase oa sefofane, le li-amplifiers tsa RF tse nang le maqhubu a phahameng

5.3 Khetha Silicon Nitride (Si₃N₄) Neng:

• Ho hlokahala ho tšepahala ho potoloha ha mocheso o feteletseng (li-potoloho tse ka holimo ho 5,000)
• Tšebeliso e kenyelletsa liphetoho tse matla tsa mocheso
• Ho tšoha le ho thothomela ha mechini ke lintho tse tšoenyang haholo
• Linako tse telele tsa waranti li hloka ts'epo e ikhethang
• Mekhoa ea ho hula likoloi, li-inverter tsa literene, le lisebelisoa tsa indasteri tse tšepahalang haholo

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6) Ho Khetha Sebaka se Nepahetseng sa DBC Ceramic

Khetho ea thepa e hloka ho hlahloba litlhoko tsa tekheniki khahlanong le lithibelo tse sebetsang. Ho sebetsa le moetsi oa substrate ea nang le boiphihlelo oa DBC ho fana ka phihlello ea boiphihlelo ba ts'ebeliso le tataiso ea thepa.

6.1 Lipotso tsa Bohlokoa Tse Lokelang ho Sebetsa Nakong ea Khetho ea Litaba

• Mocheso o moholo ka ho fetisisa o lumelletsoeng oa junction ke ofe? Sena se etsa qeto ea ts'ebetso e hlokahalang ea mocheso.
• Sebopeho sa substrate se tla ba le boemo bofe ba potoloho ea mocheso? Ho potoloha ka matla ho ka hloka Si₃N₄ ho sa tsotelehe litlhoko tsa mocheso.
• Ke motlakase ofe o sebetsang o hlokahalang? Sena se etsa qeto ea bonyane ba botenya ba letsopa.
• Tefo ea yuniti e reriloeng ke bokae? Tlhahiso ea bongata e ka lokafatsa lisebelisoa tse sebetsang hantle ka ho ntlafatsa chai.
• Lithibelo tsa boholo ke life? Sebaka se fokolang sa ho futhumatsa se ka hloka AlN ho fihlella ts'ebetso e reriloeng ea mocheso.

Highleap Electronics e fana ka tataiso ea tekheniki mabapi le khetho ea thepa ea letsopa, e thusang baenjiniere ho leka-lekanya ts'ebetso, ts'epo le litšenyehelo. Bokhoni ba rona bo akaretsa tlhahiso ea PCB ho pholletsa le tlhahiso e tsoetseng pele ea DBC substrate, ho tšehetsa merero ho tloha khopolo-taba ho isa tlhahisong ea bophahamo.

Bakeng sa tlhaloso ea mantsoe le kutloisiso ea motheo, etela leqephe la rona la tlhaloso ea substrate ea koporo e kopantsoeng ka kotloloho.

Kopa Keletso ea Lintho Tse Boleloang