Li-substrate tsa DBC bakeng sa li-PCB tsa Ceramic le li-module tsa Matla

Li-substrate tsa DBC (Direct Bonded Copper) li sebelisoa haholo li-module tsa motlakase le meralo ea elektroniki e futhumatsang haholo moo phetiso e sebetsang ea mocheso le karohano ea motlakase li leng bohlokoa. Leqephe lena le fana ka kakaretso e sebetsang ea meaho ea DBC, thepa, lintlha tsa tlhahiso, le hore na li bapisoa joang le mahlale a mang a PCB a letsopa.

---

Ho Highleap Electronics, re moetsi oa li-PCB ea fanang ka litšebeletso tse felletseng, re fana ka li-PCB tsa letsopa, li-substrate tsa DBC, liboto tsa mantlha tsa tšepe, li-PCB tse nang le mekhahlelo e mengata, le lits'ebeletso tse felletseng tsa kopano ea li-PCB.

Li-substrate tsa DBC ke e 'ngoe ea litharollo tsa taolo ea mocheso tseo re li tšehetsang bakeng sa lits'ebetso tse matla le tse tšepahalang haholo joalo ka lisebelisoa tsa motlakase, li-module tsa likoloi le lisebelisoa tsa indasteri. Tataiso ena e hlalosa kamoo theknoloji ea DBC e sebetsang kateng, hore na e lokela ho sebelisoa neng, le hore na e lumellana joang le likhetho tse pharaletseng tsa tlhahiso ea PCB le ceramic PCB.

Fumana Qotsulo e Potlakile Hona Joale

Na u se u loketse ho hlahloba bokhoni ba rona bo ikhethang? Etela leqephe la rona le inehetseng bakeng sa tlhahiso ea PCB ea letsopa kapa ithute ka lits'ebeletso tsa rona tse felletseng tsa tlhahiso ea PCB.

---

1) Karolo e ka tlase ea DBC ke eng?

Substrate ea DBC, e tsejoang hape e le substrate ea koporo e kopantsoeng ka kotloloho , ke mofuta oa boto ea potoloho ea ceramic eo foil ea koporo e hokahanngoang ka kotloloho lehlakoreng le le leng kapa ka bobeli la thepa ea motheo ea ceramic ka ts'ebetso ea oxidation ea mocheso o phahameng. Ho fapana le mekhoa ea setso ea tlhahiso ea PCB e itšetlehileng ka likarolo tsa sekhomaretsi, theknoloji ea DBC e theha tlamo ea tšepe pakeng tsa koporo le ceramic, e leng se fellang ka ho tsamaisoa ha mocheso o ikhethang le ts'epahalo ea mechini.

Mokhoa oa ho kopanya o kenyelletsa ho futhumatsa koporo le ceramic mochesong o haufi le ntlha ea koporo-oksijene eutectic (hoo e ka bang 1065°C). Mochesong ona, lera le lesesaane la oxide ea koporo le thehoa sebakeng sa ho kopana, ebe le arabela le bokaholimo ba ceramic ho theha tlamo e sa feleng, e matla haholo. Ts'ebetso ena e felisa tlhoko ea li-bonding agents tse mahareng 'me e netefatsa khanyetso e fokolang ea mocheso pakeng tsa lera la potoloho ea koporo le substrate ea ceramic.

Hangata di-substrate tsa DBC di na le botenya ba koporo bo tlohang ho 0.127mm ho isa ho 0.635mm (5 mil ho isa ho 25 mil), ka botenya ba ceramic bo tlohang ho 0.25mm ho isa ho 1.0mm. Motswako ona o fana ka tsamaiso e ntle ya motlakase bakeng sa ditshebediso tsa motlakase o phahameng le ho qhala ha mocheso ho hoholo bakeng sa disebediswa tsa semiconductor tsa motlakase.

---

2) Kamoo Di-substrate tsa DBC di Lokelang ho Kenngwa Teng ya PCB

Leha di-substrate tsa DBC di tshwana ka tshebetso le diboto tsa potoloho tse hatisitsweng tsa setso, tshebetso ya tsona ya tlhahiso e fapana haholo le mesebetsi e tloaelehileng ya tlhahiso ya PCB . Di-PCB tsa setso di sebedisa di-laminate tsa tlhaho (tse kang FR-4) tse nang le koporo e foreimisitsweng ka motlakase kapa e laminated, athe di-substrate tsa DBC di hloka disebediswa tse ikgethang tsa ho kopanya mocheso o phahameng le dionto tse laolwang tsa sepakapaka.

Ho kopanngoa ha di-substrate tsa DBC dikopanong tsa elektroniki hangata ho latela tatellano ena: ho lokiswa ha substrate ya ceramic, ho tlamahanya koporo, ho etsa dipaterone tsa potoloho ka photolithography le ho fata, ho qeta bokahodimo, mme qetellong ho kenya dikarolo. Bahlahisi ba bangata ba di-module tsa motlakase ba fumana di-substrate tsa DBC tse nang le dipaterone ho tswa ho bafepedi ba ikgethang jwalo ka Highleap Electronics, ebe ba etsa die attach, ho tlamahanya terata, le ho kenya ka hare ho di-incapsulation dibakeng tsa bona.

Ho utloisisa ts'ebetso ea tlhahiso ea DBC ho bohlokoa bakeng sa baenjiniere ba hlalosang li-substrate tsena, kaha liparamente tsa ts'ebetso li ama ka kotloloho ts'epo ea potoloho ea mocheso, matla a tlamo, le ts'ebetso ea nako e telele libakeng tse hlokang thuso.

3) Litšebeliso tse Tloaelehileng tsa Li-substrate tsa DBC

Li-substrate tsa DBC li sebetsa e le mokokotlo oa lisebelisoa tsa motlakase tsa motlakase ho pholletsa le liindasteri tse ngata. Motsoako oa tsona o ikhethang oa ho tsamaisa mocheso o phahameng, ho itšehla thajana ho babatsehang ha motlakase, le botsitso ba mechini li etsa hore li be tsa bohlokoa bakeng sa lits'ebetso moo taolo ea mocheso e leng ea bohlokoa.

• Li-IGBT le Li-module tsa Matla: Di-module tsa Insulated Gate Bipolar Transistor bakeng sa di-drive tsa dienjini tsa diindasteri, di-inverter tsa traction, le ditsamaiso tsa eneji e ntjhafatswang di itshetlehile haholo hodima di-substrate tsa DBC. Substrate ena e fana ka karohano ya motlakase le phetiso e sebetsang hantle ya mocheso ho tloha ho die tsa semiconductor ho ya tsamaisong ya ho phodisa.
• Lisebelisoa tsa motlakase tsa likoloi tsa motlakase: Li-inverter tsa motlakase tsa EV, li-charger tse ka hare ho sekepe, le li-converter tsa DC-DC li hloka li-substrate tse khonang ho sebetsana le matla a mangata ha li ntse li boloka ts'epo ho feta lipotoloho tse limilione tsa mocheso.
• Mabone a LED a Matla a Phahameng: Liphutheloana tsa LED tse khanyang haholo le meralo ea COB (Chip-on-Board) li sebelisa li-substrate tsa DBC ho laola mocheso o moholo o hlahisoang ke li-array tsa LED tse teteaneng.
• Sepakapaka le Tšireletso: Mekhoa ea radar, li-amplifier tsa motlakase, le li-avionic li hloka li-substrate tse bolokang ts'ebetso ho pholletsa le maemo a mocheso o feteletseng le maemo a thata a ts'ebetso.
• Industrial Automation: Li-drive tsa servo, lisebelisoa tsa ho tjheseletsa, le lisebelisoa tsa motlakase li rua molemo bokhoning ba li-substrate tsa DBC ba ho sebetsana le maqhubu a phahameng ha li ntse li boloka botsitso ba mocheso.
• Sistimi ea Matla a Tsosolositsoeng: Li-inverter tsa letsatsi le li-converter tsa turbine ea moea li sebelisa theknoloji ea DBC bakeng sa ts'epo ea nako e telele lits'ebetsong tsa kantle.

---

4) Melemo ea Bohlokoa ea Tshebetso

Li-substrate tsa DBC li fana ka melemo e 'maloa ea bohlokoa e hlalosang puso ea tsona lits'ebetsong tsa motlakase oa motlakase:

• Superior Thermal Conductivity: Tlamo e tobileng ea koporo le ceramic e fokotsa khanyetso ea sebopeho sa mocheso. Li-substrate tsa aluminium nitride (AlN) DBC li ka finyella ho tsamaisoa ha mocheso ho feta 170 W/m·K, e leng se etsang hore li be ntle haholo ho feta thepa ea PCB ea tlhaho.
• Bokhoni bo Phahameng ba Hona Joale ba ho Jara: Mealo e teteaneng ea koporo (ho fihlela ho 0.635mm) e nolofalletsa li-substrate tsa DBC ho jara maqhubu a fetang 100A, e leng se etsang hore li lokele lits'ebetso tse matla haholo moo li-PCB tse tloaelehileng li ka hlolehang.
• Karohano e Ntle ea Motlakase: Lisebelisoa tsa letsopa li fana ka matla a dielectric a tlhaho, ka boleng bo tloaelehileng ba 15-20 kV/mm bakeng sa alumina le ho feta bakeng sa nitride ea aluminium, ho netefatsa ho itšehla thajana ho sireletsehileng lits'ebetsong tsa motlakase o phahameng.
• Katoloso e Tšoanang ea Thermal: Li-substrate tsa ceramic li na le li-coefficients tsa katoloso ea mocheso (CTE) tse haufi le silicon ho feta li-laminate tsa tlhaho, e leng se fokotsang khatello manonyellong a die attach nakong ea potoloho ea mocheso.
• Ho Tšepahala ha Nako e Telele: Kamano ea tšepe pakeng tsa koporo le letsopa e boloka botsitso nakong ea lipotoloho tse likete tsa mocheso, e fetang haholo nako ea bophelo ea mekhoa e meng e thehiloeng ho sekhomaretsi.

5) Lisebelisoa tsa Ceramic tse Sebelisoang Li-substrate tsa DBC

Khetho ea thepa ea motheo ea ceramic e ama haholo ts'ebetso ea substrate ea DBC. Li-ceramic tse tharo tsa mantlha li laola 'maraka, e' ngoe le e 'ngoe e na le litšobotsi tse ikhethang tse loketseng lits'ebetso tse fapaneng. Bakeng sa papiso e qaqileng ea thepa ena, bona tataiso ea rona e inehetseng ho li-substrate tsa ceramic tsa DBC.

5.1 Alumina (Al₂O₃)

Alumina ke ceramic e sebelisoang haholo bakeng sa li-substrate tsa DBC ka lebaka la tekanyo ea eona e ntle ea ts'ebetso ea litšenyehelo. Ka ho khanna ha mocheso oa 24-28 W/m·K bakeng sa limaraka tsa bohloeki ba 96%, alumina e lumellana le lits'ebetso moo ts'ebetso e feteletseng ea mocheso e sa hlokeheng. Ho fumaneha ha eona ka bongata, theknoloji ea ts'ebetso e hōlileng tsebong, le litheko tsa tlholisano li etsa hore e be khetho ea kamehla bakeng sa meralo e mengata ea li-module tsa motlakase.

5.2 Aluminium Nitride (AlN)

Aluminium nitride e fana ka phallo ea mocheso ea 170-230 W/m·K, e leng e phahameng ka makhetlo a ka bang 7-10 ho feta alumina. Sena se etsa hore li-substrate tsa AlN DBC li be tsa bohlokoa bakeng sa lits'ebetso tsa matla a maholo moo ho qhalana ha mocheso e leng ntlha e thibelang. Litšenyehelo tse phahameng tsa thepa lia lokafatsoa lits'ebetsong tse kang li-inverter tsa EV traction, li-amplifiers tsa RF tse nang le maqhubu a phahameng, le litsamaiso tsa matla a sefofane.

5.3 Silicon Nitride (Si₃N₄)

Silicon nitride e kopanya motlakase o itekanetseng (70-90 W/m·K) ka matla a ikhethang a mechini le ho tiea ha ho robeha. Li-substrate tsa Si₃N₄ DBC lia ipabola lits'ebetsong tse hlokang ho hanyetsa ho thothomela ha mocheso le khatello ea mechini, joalo ka litsamaiso tsa ho hula tse tlas'a ho thothomela le ho potoloha ha mocheso khafetsa. Le hoja li le theko e boima ho feta alumina, botšepehi bo phahameng ba silicon nitride libakeng tse hlokang ho rarahana bo etsa hore e ratoe haholo bakeng sa lits'ebetso tsa likoloi le tsa terene.

---

6) DBC khahlano le Litheknoloji tse ling tsa PCB tsa Ceramic

'Maraka oa PCB oa letsopa o kenyelletsa mahlale a 'maloa ka ntle ho DBC. Ho utloisisa mekhoa ena ho thusa baenjiniere ho khetha tharollo e nepahetseng bakeng sa litlhoko tsa bona tse ikhethileng.

6.1 DBC khahlanong le AMB (Sebetsa sa Tšepe se Sebetsang)

Active Metal Brazing e sebelisa tšepe e tlatsang e nang le titanium ho kopanya koporo le ceramic mochesong o ka bang 850°C. AMB e fana ka matla a tlamo a matla ho feta DBC mme e nolofalletsa mealo e teteaneng ea koporo (ho fihlela ho 0.8mm kapa ho feta). Leha ho le joalo, li-substrate tsa AMB hangata li bitsa chelete e ngata ho feta tse lekanang le DBC 'me li hloka lisebelisoa tse khethehileng. AMB e khethoa bakeng sa lits'ebetso tse tšepahalang haholo le ha ho hlokahala botenya bo boholo ba koporo.

6.2 DBC khahlanong le DPC (Koporo e Tloaelehileng e Tloaelehileng)

Theknoloji ea Koporo e Tloaelehileng e kenyelletsa ho tšela lera la peo holim'a ceramic, e lateloe ke ho polata ka motlakase ho haha ​​​​botenya ba koporo. DPC e fana ka qeto e ntle ea mola ho feta DBC empa e lekanyelitsoe ho lera la koporo le tšesaane (hangata le ka tlase ho 0.1mm). DPC e lumellana le lits'ebetso tse hlokang mekhoa e nepahetseng ea potoloho le ts'ebetso e tlase ea motlakase, joalo ka liphutheloana tsa LED le lipotoloho tse nyane tsa matšoao.

6.3 DBC khahlano le LTCC/HTCC

Ceramic e Futhumatsoang ka Mocheso o Tlase (LTCC) le Ceramic e Futhumatsoang ka Mocheso o Phahameng (HTCC) li nolofalletsa lipotoloho tsa ceramic tse nang le mekhahlelo e mengata tse nang le li-passive tse kentsoeng. Leha mahlale ana a fana ka ho tenyetseha ha moralo, a ke ke a lumellana le ts'ebetso ea mocheso ea DBC kapa bokhoni ba hona joale ba ho sebetsana. Li-ceramic tse futhumatsoang ka mocheso hangata li khethoa bakeng sa lits'ebetso tsa RF/microwave le meralo e rarahaneng ea mekhahlelo e mengata ho fapana le lisebelisoa tsa elektroniki tsa motlakase.

7) Ho Khetha Tharollo e Nepahetseng ea DBC Substrate

Ho khetha substrate e ntle ka ho fetisisa ea DBC ho hloka ho leka-lekanya lintlha tse ngata ho kenyeletsoa litlhoko tsa mocheso, litlhaloso tsa motlakase, lithibelo tsa mechini le tekanyetso. Ho sebetsa le moetsi oa substrate ea nang le boiphihlelo oa DBC ho nolofatsa ts'ebetso ena ea khetho.

7.1 Lintlha tsa bohlokoa tsa ho khetha

• Litlhoko tsa ho Hasana ha Matla: Bala mocheso o hlahisoang ke lisebelisoa tsa motlakase 'me u netefatse hore substrate e ka fetisetsa mocheso ona tsamaisong ea ho pholisa ntle le ho phahama ho feteletseng ha mocheso.
• Tsela e sebetsang: Netefatsa hore botenya ba letsopa le thepa li fana ka motlakase o lekaneng oa ho mamella dielectric ka meeli e loketseng ea polokeho.
• Ts'ebetso ea Hona Joale: Hlalosa botenya ba koporo ho latela ditlhoko tse phahameng ka ho fetisisa tsa hona joale tse tswelang pele le tse nang le tlhoro, tse ikarabellang bakeng sa ho senyeha ha mocheso.
• Profaele ea ho Baesekeletsa Thermal: Nahana ka diphetoho tse lebelletsweng tsa mocheso le palo ya potoloho bophelong ba sehlahiswa ha o kgetha thepa ya letsopa.
• Litšitiso tsa Boholo: Li-substrate tsa letsopa li na le meeli ea boholo ba tlhahiso e ka susumetsang moralo oa li-module.
• Lipakane tsa Litšenyehelo: Leka-lekanya khetho ea thepa khahlanong le bophahamo ba tlhahiso le litšenyehelo tse amohelehang tsa yuniti.

---

8) Mehato e Latelang: Tlhahiso, Prototyping le RFQ

Hore na o ntshetsa pele mohopolo o mocha wa mojule wa motlakase kapa o eketsa moralo o seng o ntse o le teng bakeng sa tlhahiso ya bophahamo, Highleap Electronics e fana ka ditharollo tse felletseng tsa DBC substrate tse etseditsweng mohato wa projeke ya hao.

Bakeng sa ntshetsopele ya pele le netefatso ya moralo, tshebeletso ya rona ya ho etsa di-prototype tsa DBC substrate e fana ka bongata bo bonyenyane ka phetoho e potlakileng, e leng se nolofalletsang tlhahlobo e pheta-phetoang ntle le boitlamo ba tlhahiso.

Ho hlahloba bokgoni ba rona bo pharaletseng ba tlhahiso bakeng sa di-PCB tsa ceramic le diboto tsa potoloho tsa setso, etela kakaretso ya rona ya tlhahiso ya di-PCB tsa ceramic tsa China.

8.1 Seo U Lokelang ho se Kenya ho RFQ ea Hao

• Lifaele tsa moralo: Lifaele tsa Gerber, kemiso ea DXF, kapa litšoantšo tsa mechine
• Litlhoko tsa lintho tse bonahalang: Mofuta oa letsopa, botenya, botenya ba koporo
• Qetellong: Litlhoko tsa ho kenya lipeiti bakeng sa ho kopanya die le terata
• bongata: Palo ea pele le bophahamo ba selemo le selemo bo lebelletsoeng
• Litlhoko tsa boleng: Litlhoko life kapa life tse khethehileng tsa tlhahlobo kapa liteko
• Kemiso ea nako eo sepheo se reretsoeng ho e latela: Matsatsi a bohlokoa a ho tlisa kapa liketsahalo tsa bohlokoa tsa nts'etsopele

Fumana Khoteshene ea Hao ea DBC Substrate