Drone PCB Manufacturing Process: Ho tloha Copper Clad ho ea ho Flight-Ready Board

Selelekela: Ke Eng e Etsang Hore Drone PCB Manufacturing e Ikhetha

Ts'ebetso ea tlhahiso ea PCB ea drone e hloka ho nepahala ho feta tlhahiso ea boto ea potoloho e tloaelehileng ka lebaka la tikoloho e thata ea ts'ebetso ea likoloi tsa sefofane tse se nang bapalami. Boto e 'ngoe le e 'ngoe ea taolo ea sefofane e tlameha ho fana ka ts'ebetso e nepahetseng ea matšoao, kabo e sebetsang ea matla, le kopanyo e tšepahalang ea sensor ha e ntse e mamella ho thothomela, ho feto-fetoha ha mocheso, le tšitiso ea motlakase sebakeng se phahameng.

Lisebelisuoa tsa morao-rao tsa UAV li kopanya li-processor tsa taolo ea sefofane, li-module tsa GPS, li-circuits tsa puisano tse se nang mohala, le litsamaiso tsa taolo ea matla libotong tse kopaneng, tse bobebe. Ho etsa likopano tsena tsa drone PCB ho hloka taolo e thata ea ts'ebetso ho netefatsa ts'epo ea boemo ba sefofane.

Tataiso ena e lekola tšebetso e felletseng ea tlhahiso ea UAV PCB, ho tloha khethong ea substrate ea koporo ho isa ho netefatso ea boleng ba ho qetela, e senola ho nepahala ha tekheniki ka mor'a liboto tsa potoloho tse seng li loketse sefofane.

Khetho ea lintho tse bonahalang ho Drone PCB Manufacturing Process

Ho Khetha Copper Clad Laminates bakeng sa Likopo tsa UAV

Lisebelisoa tsa PCB tsa Drone li qala ka li-laminate tse koahetsoeng ka koporo tse entsoeng bakeng sa ts'ebetso ea sefofane. Substrate e tlameha ho fana ka botsitso ba mechini, mamello ea mocheso, le ho nepahala ha boholo nakong eohle ea tlhahiso le ts'ebetso. Khetho ea thepa e ama ka kotloloho boima ba boto ea ho qetela, ts'epo le litšobotsi tsa motlakase.

FR4 e ntse e le khetho e ka sehloohong bakeng sa tlhahiso ea PCB ea drone ka lebaka la thepa e leka-lekaneng le katleho ea litšenyehelo. Standard FR4 e fana ka mocheso oa phetoho ea likhalase ho pota 130-140 ° C ka li-contants tse laoloang tsa dielectric bakeng sa botšepehi ba matšoao lits'ebetsong tsa UAV tsa bareki.

Likhetho tsa Substrate tsa Ts'ebetso e Phahameng

Mefuta e fapaneng ea High-Tg FR4 e eketsa matla a mocheso ho 170-180 ° C, a bohlokoa bakeng sa liboto tsa taolo ea lifofane tsa drone tse sebetsang haufi le balaoli ba likoloi kapa maemong a phahameng a tikoloho. Lisebelisoa tsena li thibela delamination le ho boloka botsitso ba dimensional nakong ea lits'ebetso tsa solder ntle le lead le libaesekele tse futhumatsang tse sebetsang.

Li-substrates tsa Polyimide li fana ka lisebelisoa tse khethehileng tse hlokang ho tenyetseha kapa ho hanyetsa mocheso o feteletseng ho fihlela ho 260 ° C. Li-PCB tsa Metal core li sebetsana le taolo ea mocheso lipotolohong tse matla haholo ka melemo ena:

• Phallo e tobileng ea mocheso - Likarolo tsa motheo tsa aluminium kapa tsa koporo li tsamaisa mocheso hole le likarolo tse matla a phahameng
• Mocheso o fokotsehileng oa ho sebetsa - Lithempereichara tse tlase tsa mateano li eketsa nako ea bophelo ea karolo le ho ntlafatsa ts'epahalo
• Moqapi o tsitsitseng oa mocheso - E felisa li-heatsink tse ngata ka har'a likopano tsa drone tse thibetsoeng sebakeng

Mokhoa oa ka hare oa Layer Patterning ho Drone PCB Manufacturing Process

Photolithography for High-Density Circuits

Sebopeho sa potoloho se ka hare se theha litsela tsa conductive tse hlalosang ts'ebetso ea motlakase. Ts'ebetso ea tlhahiso ea drone PCB e sebelisa litšoantšo tsa photoresist ho fetisetsa lipaterone tsa CAD holim'a bokaholimo ba koporo ka nepo ea boemo ba micron, e bohlokoa bakeng sa tlhahiso e phahameng ea UAV PCB.

Ho roala ha photoresist ho etsa lera le hlabang khanya ea polymer ho pholletsa le bokaholimo ba koporo. Ho pepeseha ha UV ka li-photomasks ho thatafatsa libaka tse ikhethileng tse tsamaellanang le moralo oa potoloho. Nts'etsopele e tlosa libaka tse sa pepesoang, e senola koporo bakeng sa etching e ikhethileng ha libaka tse sirelelitsoeng li ntse li le teng.

Precision Etching bakeng sa Botšepehi ba Letšoao

Ho tjhesa ka dikhemikhale ho tlosa koporo e pepeneneng, ho siya feela masalla a potoloho a rerilweng. Meralo ya PCB ya drone ya mekhahlelo e mengata e hloka bophara bo nepahetseng ba mola le taolo ya sebaka ho boloka tshebetso ya motlakase. Dipotoloho tsa taolo ya sefofane tse sebetsanang le matshwao a dijithale a lebelo le hodimo kapa tse sebetsang maqhubung a seyalemoya di hloka masalla a taolo a impedance ho thibela ho senyeha ha matshwao.

Etching compensation e lokisa litekanyo tsa mohlala ho ikarabella bakeng sa lateral copper undercutting nakong ea lik'hemik'hale. Tekanyetso ena e netefatsa hore trace geometry ea ho qetela e lumellana le litlhaloso tsa moralo, ho boloka taolo ea impedance le botšepehi ba matšoao bakeng sa ts'ebetso e tšepahalang ea UAV PCB.

Mokhoa oa Lamination: Ho aha Multilayer Drone PCBs

Layer Stackup le Taolo ea Ngoliso

Multilayer PCB lamination fetola mekhahlelo ea potoloho motho ka mong ka mehaho e momahaneng. Ts'ebetso e bokella likarolo tse ka hare tse nang le maqephe a prepreg le li-foil tsa ka ntle tsa koporo, ebe li sebelisa mocheso (170-180 ° C) le khatello (300-400 psi) ho phekola tsamaiso ea epoxy resin le ho tlama kopano.

Mamello ea ngoliso e ama ka kotloloho ka ho ts'epaha ha tlhahiso ea drone PCB. Tlhahiso ea sejoale-joale e sebelisa li-optical alignment system tse behang likarolo ka har'a li-micrometer tse 75, ho netefatsa khokahano e nepahetseng lipakeng tsa mekhahlelo ea potoloho. Ho se tsamaisane hantle ho baka ho ngolisoa hampe ka tsela ea-to-pad hoo ho fokolisang likhokahano tsa motlakase le ho fokotsa matla a mochini.

Vacuum Pressing bakeng sa Lamination-Free Lamination

Vacuum pressing e tlosa moea o qabeletsoeng le metsoako e sa tsitsang pele ho phekoloa ka resin. Mohato ona o thibela li-voids le delamination tse senyang matla a mochini le ho kenya motlakase. Ts'ebetso ena e theha kabo e ts'oanang ea khatello ho liphanele, e hlahisa botenya bo sa fetoheng le maqhama a lera ho pholletsa le tlhahiso ea UAV PCB.

Moralo oa li-stackup oa Multilayer drone PCB hangata o arola lifofane tsa motlakase ho tloha ho likarolo tsa matšoao li sebelisa lifofane tse fatše e le litšupiso le ts'ireletso. Tokisetso ena e fokotsa khokahano ea lerata 'me e fana ka kabo ea motlakase e tsitsitseng ho taolo ea sefofane le lisekethe tsa ho tsamaea.

Ho cheka le ho Plating ka Drone PCB Manufacturing

Precision Hole Formation

Ho tjheka ho theha dikgokelo tse otlolohileng pakeng tsa dikarolo tsa potoloho. Ho tjheka ka mechine ho sebetsana le di-vias tse phunyeletsang le masoba a ho kenya dikarolo tse nang le bophara ba ho tloha ho 0.3mm ho isa ho 6.0mm. Ho tjheka ka laser ho hlahisa di-microvia bakeng sa meaho ya kgokelo e nang le bongata bo boholo, ho nolofalletsa dibopeho tse nyane tse hlokahalang bakeng sa ho etsa hore boto ya taolo ya sefofane ya drone e be nyane.

Theknoloji ea Microvia e fana ka likhokahano tsa layer-to-layer ntle le ho tšela botenya bohle ba boto. Sena se ts'ehetsa meralo e kopaneng ha e ntse e boloka botsitso ba matšoao ka litsela tse khutšoane tsa hajoale. Maemo a tloaelehileng a microvia a tloha ho 0.1mm ho isa ho 0.15mm ka likarolo tse ka tlase ho 1:1.

Electroplating bakeng sa likhokahano tse tšepahalang

Ka-hole plating metallizes e phuntsoeng masoba ho theha tsoelo-pele ea motlakase. Ts'ebetso e qala ka ho beoa ha koporo e se nang motlakase ho theha lera la peo ea conductive maboteng a se nang tšepe. Electrolytic plating ebe e haha ​​​​botenya ba koporo ho li-micrometer tse 25-35, e fana ka litšobotsi tsena tsa bohlokoa tsa ts'ebetso:

• Ho tšoarella ha mechine - Botenya bo lekaneng ba koporo bo hanela ho phunyeha tlas'a vibrate le libaesekele tse futhumetseng
• Bokhoni ba hona joale - Ho roala ka mokhoa o ts'oanang ho tiisa bokhoni bo tsitsitseng ba hona joale ho pholletsa le litsela tsohle
• Tshebetso ea mocheso - Plated vias tsamaisa mocheso pakeng tsa lera, ho tšehetsa tsamaiso ea mocheso

Bakeng sa tlhahiso ea UAV PCB, ho boloka botenya bo sa fetoheng ho bophara ba lesoba ho netefatsa ts'epahalo libakeng tse hlokang sefofane moo khatello ea mochini le phapang ea mocheso e phephetsang bots'epehi ba boto.

Mask ea Solder le Silkscreen ho Drone PCB Fabrication

Kopo ea Mask ea Solder le Ngoliso

Ho roala maske a solder ho sireletsa mesaletsa ea koporo ho oxidation le ho thibela borokho ba solder nakong ea kopano. Ts'ebetso ea tlhahiso ea drone PCB e sebelisa mask a solder e ka bonoang ka metsi hohle holim'a boto, e pepesa lipampiri feela, li-vias le lintlha tsa liteko ka mokhoa oa ho etsa litšoantšo.

Ho nepahala ha ngoliso pakeng tsa mask a solder le likarolo tsa koporo ho etsa qeto ea boleng ba tlhaloso ea pad. Thepa ea sejoale-joale e boloka ho tsamaisana ka har'a li-micrometer tse 75, ho thibela tšireletso ea pad e sitisang ho soasoa kapa koporo e pepesitsoeng e behang kotsi ea tšenyo ea tikoloho. Mask e tala ea solder e busa ka lebaka la phapang e nepahetseng ea tlhahlobo le kholo ea ts'ebetso.

Ho Tšoaea Silkscreen bakeng sa Kopano

Khatiso ea silkscreen e fana ka litšupiso tsa likarolo, matšoao a polarity, le likhoutu tsa ho latela. Matšoao a hlakileng a ntlafatsa katleho ea kopano ea PCB ea drone ka ho nolofalletsa sebaka se potlakileng sa likarolo le netefatso ea tataiso. Enke e tšoeu maskeng e tala ea solder e fana ka phapang e kholo, leha enke e mosehla e fana ka ponahalo e betere maskeng e ntšo kapa e putsoa.

Matshwao a ho latedisa a kenyelletsa dikhoutu tsa matsatsi, dinomoro tsa ntlafatso, le boitsebiso ba moetsi. Tlhahisoleseding ena e tšehetsa tsamaiso ea boleng, tlhokomelo ea tšimo, le tlhahlobo ea ho hlōleha ho pholletsa le bophelo ba ts'ebetso ea UAV PCB.

Ho Qetella Bokaholimo ho Ts'ebetso ea Tlhahiso ea Drone PCB

ENIG: Khetho ea Premium

Qetello ea bokaholimo ba ENIG (Khauta ea ho Immersion ea Nickel e se nang Electroless) e fana ka libaka tse bataletseng, tse tšoanang tse loketseng likarolo tse nang le molumo o mosesaane holim'a mapolanka a taolo ea sefofane sa drone. Lera la nickel (li-micrometer tse 3-6) le fana ka ho hanyetsa ho tsofala le ho khona ho li kopanya, ha lesela la khauta (li-micrometer tse 0.05-0.23) le thibela oxidation nakong ea polokelo le ts'ebetso.

Bokaholimo ba polane ea ENIG bo ts'ehetsa sebopeho se kopaneng sa solder likopanong tse nang le sekhahla se phahameng, ho fokotsa likoli ho tsoa ho liphapang tsa coplanarity. Qetello ena e sebetsa hantle haholo lits'ebetsong tse hlokang hore ho be le li-cycles tse ngata, bokhoni ba ho kopanya mehala, kapa nako e telele ea bophelo pele ho kopano.

Mefuta e meng ea Phekolo ea Bokaholimo

HASL (Hot Air Solder Leveling) e fana ka ts'ireletso ea moruo empa e theha topology e sa tšoaneng e sa lokelang bakeng sa meralo e teteaneng ea SMT e nang le likarolo tse ka tlaase ho 0.5mm pitch. Silivera ea ho qoelisoa e fana ka thekiso e ntle ka libaka tse bataletseng ka litšenyehelo tse itekanetseng, leha ho senya ho hloka phutheloana ea vacuum le maemo a laoloang a polokelo.

Ho roala ha OSP (Organic Solderability Preservative) ho fana ka masela a PCB a theko e boima a nang le litlhoko tse khutšoane tsa bophelo. Lera le tšesaane la lintho tse phelang le boloka koporo e solderability empa e fana ka tšireletso e fokolang khahlanong le ho ts'oaroa le lipotoloho tse ngata tsa mocheso ha li bapisoa le lisebelisoa tsa tšepe.

Teko ea Motlakase ho Ts'ebetso ea Tlhahiso ea Drone PCB

Mekhoa e Ikemetseng ea Tlhahlobo

Teko ea li-flying probe e netefatsa ho tsoela pele ha motlakase le ho itšehla thajana ntle le lisebelisoa tse inehetseng tsa liteko. Lintlha tsa tlhahlobo ea li-probes tse tsamaeang ka har'a liboto, ho lekanya khanyetso lipakeng tsa matlooa le ho lemoha ho buloa, marikhoe a makgutshwane, kapa dikgokelo tse fosahetseng. Mokhoa ona o feto-fetohang o lumellana le tlhahiso ea UAV PCB moo ho pheta-pheta ha moralo le mefuta e itekanetseng e etsang hore matsete a tsitsitseng a se ke a sebetsa.

AOI (Tlhahlobo ea Optical e Iketsetsang) e sebelisa lik'hamera tse nang le qeto e phahameng tse hlahlobang ngoliso ea maske ea solder, jiometri ea motsamao oa koporo, le liphoso tsa bokaholimo. Li-algorithms tse iketselitseng li bapisa liboto tsa 'nete khahlanong le maemo a litšupiso, li khetholla liphetoho tsa boholo kapa mathata a botle a amang kopano kapa ts'epo.

Netefatso ya Tshebetso

Teko ea impedance e netefatsa hore lithapo tsa phetisetso li kopana le litlhaloso tsa moralo bakeng sa matšoao a lebelo le holimo le li-circuits tsa RF. Litlankana tsa liteko tsa nako-domain reflectometry kapa impedance test li lekanya ts'oaetso ea sebopeho ho tloha ho 25 ho isa ho 120 ohms, e tiisang ts'ebetso e nepahetseng ea li-stackup le thepa ea bohlokoa bakeng sa lipotoloho tsa puisano tsa drone PCB.

Bareki ba lokela ho netefatsa hore morekisi oa bona o etsa liteko tse felletseng ho latela litekanyetso tsa IPC-6012 Class 3. Tlhaloso ena e hlalosa mokhoa oa ho amohela lisebelisoa tsa elektroniki tse ts'epahalang haholo ka litlhokahalo tsena:

• Mamello e thata - Litumello tse fokotsehileng bakeng sa sebaka sa conductor, selikalikoe sa annular, le boleng ba lesoba
• Tlhahlobo e ntlafalitsoeng - Teko ea motlakase ea 100% le tlhahlobo ea pono khahlano le mekhoa ea lisampole
• Meeli e matla ea sekoli - Merero e tlase ea ho amoheloa bakeng sa mefokolo ea litlolo le ea ts'ebetso

Tokisetso ea ho Qetela: Li-PCB tsa Drone tsa Kopano-Ready

Ho Hloekisa Bokahohle le ho Pakaletsa

Ho hloekisa ka mor'a tlhahiso ho tlosa mesaletsa ea ho lokisa, metsoako ea flux, le tšilafalo ea likaroloana tse sitisang ts'ebetso ea kopano. Sistimi ea alkaline kapa ea semi-aqueous e qhala litšila tsa ionic le organic ntle le ho senya likarolo tsa bokaholimo kapa botšepehi ba mask a solder.

Ho kenngoa ha vacuum ka desiccant ho boloka ho rekisoa ha holimo nakong ea polokelo le thepa. Mekotla e thibelang mongobo e thibela ho kenngoa ha mongobo ho bakang delamination kapa popcorning nakong ea reflow soldering. Likarete tsa matšoao a mongobo li netefatsa botšepehi ba tiiso ho pholletsa le ketane ea phepelo.

Litokomane tsa boleng

Sehlopha se seng le se seng sa tlhahiso ea UAV PCB se kenyelletsa litokomane tse felletseng tse tšehetsang ho lateloa le taolo ea boleng. Litifikeiti tsa tumellano li netefatsa sebopeho sa thepa, boikamahanyo ba ts'ebetso ea tlhahiso, le liphetho tsa liteko. Litokomane tsena li thusa ho tšoaneleha bakeng sa likopo tsa sefofane le ho tšehetsa tlhahlobo ea ho hloleha ha masimo ha ho hlokahala.

Tokisetso e nepahetseng ea ho qetela e tiisa hore boto e 'ngoe le e 'ngoe ea taolo ea sefofane sa drone e fihla e itokiselitse ho kopana ka mokhoa o nepahetseng ka mokhoa o tsitsitseng o tsitsitseng le ts'ebetso ea motlakase e netefalitsoeng.

Qetello: Ho nepahala ho Ts'ebetso ea Tlhahiso ea PCB ea Drone

Ts'ebetso ea tlhahiso ea drone PCB e fetola li-laminate tsa koporo hore e be liboto tsa potoloho tse lokiselitsoeng ho fofa ka khetho ea thepa e laoloang, mokhoa o nepahetseng oa paterone, lamination ea multilayer, le tlhahlobo e felletseng. Mokhahlelo o mong le o mong o kenya letsoho ts'ebetsong ea motlakase, ho tšoarella ha mochini, le ho tiea ha tikoloho hoo litsamaiso tsa sefofane tse sa sebetsoeng li li hlokang bakeng sa ts'ebetso e tšepahalang.

Ho lumellana ho pholletsa le lihlopha tsa tlhahiso ho netefatsa boits'oaro ba sistimi le lits'ebetso tse nolofalitsoeng tsa mangolo. Taolo e matla ea boleng boemong bo bong le bo bong ba tlhahiso e thibela mefokolo e behang tšireletseho ea sefofaneng kapa ts'epahalo ea ts'ebetso maemong a batlang a sepakapaka.

Highleap Electronics: Selekane sa Hao sa Drone PCB Manufacturing

Ho Highleap Electronics, re fana ka tlhahiso e nepahetseng ea UAV PCB ka bokhoni bona ba mantlha:

• Theknoloji e tsoetseng pele ea tlhahiso - Multilayer lamination, laser drilling, le ts'ebetso e laoloang ea impedance bakeng sa lisebelisoa tse rarahaneng tsa elektroniki tsa drone
• Taolo ea boleng bo felletseng - Teko ea motlakase ea 100%, tlhahlobo ea AOI, le netefatso ea tumellano ea IPC-6012 Sehlopha sa 3
• Tsebo ea lintho tse bonahalang - High-Tg FR4, polyimide, le ts'ebetso ea tšepe ea mantlha ea tšepe bakeng sa litlhoko tse hlokahalang tsa mocheso le mochini.
• Litšebeletso tse feletseng tsa kopano - Theko ea likarolo, ho beoa ha SMT, le tlhahlobo ea ts'ebetso bakeng sa litharollo tse felletseng tsa taolo ea sefofane

Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka litlhoko tsa hau tsa tlhahiso ea li-drone PCB le ho fumana khotheishene e qaqileng bakeng sa projeke ea hau e latelang ea UAV.