Optimizing Etching and Lamination in Heavy Copper PCB Fabrication

Selelekela: Hobaneng ho Etching le Lamination Matter in Heavy Copper PCB Fabrication

Tlhahiso ea PCB ea koporo e boima e bolela liboto tsa potoloho tse hatisitsoeng tse nang le boima ba koporo bo tlohang ho 3oz ho isa ho 10oz kapa ho feta, tse fetang haholo botenya ba koporo bo tloaelehileng ba 1-2oz bo fumanoang libotong tse tloaelehileng. Liboto tsena li sebeletsa lits'ebetso tsa bohlokoa ho lisebelisoa tsa motlakase, litsamaiso tsa likoloi le lisebelisoa tsa indasteri moo bokhoni bo phahameng ba ho jara motlakase le taolo ea mocheso li leng bohlokoa.

Botenya bo eketsehileng ba koporo bo hlahisa mathata a maholo a tlhahiso tlhahisong e boima ea PCB ea koporo . Mealo e teteaneng ea koporo e eketsa liphephetso tsa ho fata, 'me ho seha ka lehlakoreng ho ba matla hanyane ka hanyane ha boima ba koporo bo ntse bo eketseha. Nakong ea ho lamination, topology e hlahelletseng ea bokaholimo e hlahisoang ke mesaletsa e teteaneng ea koporo e sitisa ho tšoana ha phallo ea resin, e leng se hlahisang menyetla ea ho arola le ho theha lefela. Sengoloa sena se hlahloba ntlafatso ea ts'ebetso e reriloeng e sebetsanang ka kotloloho le liphephetso tsena le ho ntlafatsa ts'epo ea boto.

Etching Liphephetso ka Koporo e Matla ea Koporo ea PCB

Litšobotsi tsa 'Mele tsa ho Etching ka Koporo e Boima

Etching e boima ea koporo e hlahisa mathata a ikhethang a 'mele a thehiloeng ho bongata ba thepa e hlokang ho tlosoa. Lateral undercut e matlafala ka ho lekana le botenya ba koporo hobane etchant e tlameha ho kenella ka hare ho thepa ha e ntse e boloka tlhaselo e otlolohileng. Nako ena e atolositsoeng ea ho pepeseha e lumella etching e otlolohileng hore e tsoele pele e sa ts'oaroe, e sitisa trace geometry le ho nepahala ha sebopeho sa koporo e boima ea PCB.

Mathata a Taolo ea Bophara ba Line

Matšeliso a sa lekanang a paterone a lebisa ho kheloha ka mokhoa o hlophisehileng oa bophara ba trace. Ho penya ho feta tekano ho fokotsa li-conductor ho feta mamello e amohelehang, ha ho e-ea ka tlaase ho siea koporo e setseng e ka bakang marikhoe. Botenya ba koporo bo monya ka mokhoa o sa tsitsang, moo libaka li fumanang khatello e fokolang ea sefafatsi kapa mocheso o tlase o nang le sekhahla sa ho tlosoa ha thepa butle.

Etching Rate Variability Factors

Ts'ebetso ea Etchant libakeng tse boima tsa koporo e fapana ho ipapisitsoe le botenya ba koporo, matla a mokelikeli botong, le likhahla tsa mocheso ka har'a phaposi ea etching. Phapang ea lebelo la phallo lipakeng tsa liboto le litsi li kenya letsoho taolong e sa ts'oaneng, e hlokang taolo e hlokolosi ea paramethara.

Mekhoa ea Taolo ea Ts'ebetso bakeng sa Etching ea Koporo e Matla ea Koporo

Mekhoa e fapaneng ea ho Etching le Pulse Etching

Etching e fapaneng e sebetsa ho tse fapa-fapaneng etchant kapa mocheso ho lefella liphapano tsa botenya ba koporo ho pholletsa le phanele. Pulse etching e hlahisa linako tse laoloang nakong ea potoloho ea etching, e lumellang "etchant" e ncha ho fihla libakeng tsohle ka mokhoa o ts'oanang ha e ntse e fokotsa tlhaselo ea morao. Mekhoa ena e boloka li-profiles tsa etch e otlolohileng, e fokotsa ho teba ha tlase ka 30-40% ha e bapisoa le etching e tsoelang pele.

Mekhoa ea Matšeliso ea Mohlala

Puseletso ea boemo ba CAM e fetola bophara ba trace ka har'a fotomask ho ikarabella bakeng sa undercut e ka bonoang nakong ea ho etsoa ha PCB e boima ea koporo. Litefiso tsa matšeliso hangata li tloha ho 0.1mm ho ea ho 0.3mm ka lehlakoreng le leng, ho itšetlehile ka boima ba koporo le tsamaiso ea etchant. Li-algorithms tsa software li lekanya litokiso tse nepahetseng tse ipapisitseng le botenya ba koporo, bophara ba mohala oa sepheo, le data ea nalane ea etching.

Ntlafatso ea Sisteme ea Spray

Phetoho ea angle ea nozzle pakeng tsa likhato tse 15-30 ho tloha moo e otlolohileng e matlafatsa tšusumetso e matla libakeng tse teteaneng tsa koporo. Litefiso tsa phallo li hloka ho lekanyetsoa ho leka-lekanya lebelo la ho tlosa thepa khahlanong le taolo e tlase, ka boima bo phahameng ba koporo bo hlokang lebelo le fokotsehileng. Sistimi ea taolo ea mocheso e lula e ts'oana lipakeng tsa 45-50 ° C ka botsitso ba ± 2 ° C, e netefatsa litekanyetso tse tsitsitseng tsa etching.

Khetho ea Sistimi ea Lik'hemik'hale

Sistimi ea Cupric chloride e fana ka taolo e phahameng ea undercut bakeng sa masela a boima a koporo a PCB ka lebaka la litšobotsi tsa bona tse otlolohileng. Sistimi ea ammonia ea alkaline e fana ka litheko tse potlakileng empa e hlahisa tlhaselo e ka morao. Tlhokomelo ea nako ea 'nete ea mahloriso a ion ea koporo le matla a khoheli a khethehileng a etsa hore ho be le taolo e koetsoeng e bolokang maemo a nepahetseng a etching.

Lamination Techniques for Heavy Copper PCB Fabrication

Mathata a mantlha ho Lamination e boima ea Koporo

The topology ea holim'a metsi e entsoeng ke mesaletsa e teteaneng ea koporo e etsa hore ho be le litšitiso tsa ho phalla ha resin e tšoanang nakong ea lamination. Liphapano tsa botenya ba koporo ho phanele li hlahisa likhatello tsa kahare tse hlahang joalo ka warpage ka mor'a ho pholile. Likamano tsa coefficient tsa katoloso ea mocheso lipakeng tsa likarolo tse teteaneng tsa koporo le lisebelisoa tsa epoxy resin li eketsa ts'oaetso ea delamination le sebopeho sa lefeela.

Khetho ea Prepreg le Taolo ea Phallo ea Resin

Boqapi bo boima ba koporo ea PCB bo hloka litsamaiso tsa prepreg tse nang le litšobotsi tse ntlafalitsoeng tsa phallo ho tlatsa liphula tse entsoeng ke mesaletsa e teteaneng. Li-prepregs tse nang le li-resin tse ngata tse nang le 55-65% ka boima ba 'mele li netefatsa ho fumaneha ha lintho tse lekaneng, ha li-resin tse tlaase tsa CTE li fokotsa phapang ea ho eketseha ha mocheso. Nako ea gel ea resin e tlameha ho eketseha ka ho lekaneng ho lumella ho phalla ho feletseng pele phekolo e qala.

Multi-Stage Press Cycles

Lithempereichara tsa mocheso li thibela li-resin gelation pele ho nako ha li ntse li netefatsa phallo e phethahetseng:

• Ho futhumatsa ha pele ho 100-120 ° C ho 2-3 ° C / motsotso ho kenya ts'ebetso ea resin ntle le ho tsosa pheko.
• Kopo ea khatello e latela boemo bo fumaneng mangolo ho tloha 150-200 PSI ho ea ho 300-350 PSI bakeng sa ho kopanya.
• Vacuum e nka metsotso e 5-15 mochesong o bohareng e ntša likhase tse qabeletsoeng pele ho pheko ea ho qetela.
• Pheko ea ho qetela e etsahala ho 170-180 ° C ho tlatsa resin cross-linking

Mekhoa ea ho Laola Ngoliso

Ngoliso ea lera-to-rayer ka PCB e boima ea koporo e hloka litsamaiso tsa pin lamination tse nang le tlhophiso e nepahetseng ea lesoba la lisebelisoa. Keketseho ea mocheso nakong ea lipotoloho tsa khatiso e baka motsamao o moholo oa liphanele tsa koporo tse teteaneng, e leng se hlokang matšeliso a ho beoa ha lesoba la lisebelisoa. Mamello ea bophara ba Pin ea ± 0.025mm le ho nepahala ha boemo ba lesoba ka har'a ± 0.05mm ho boloka ka ho tsamaisana.

Mekhoa e tsoetseng pele ea Lamination bakeng sa Tlhahiso e boima ea Koporo ea Koporo ea PCB

Sequential Lamination Process

Lamination e latellanang e haha ​​​​liboto tse boima tsa koporo tse ngata ka mekoloko ea khatiso e mengata, ho fokotsa khatello ea mocheso e ntseng e eketseha. Lipara tse ka hare tsa lera li etsa lamination ka bomong pele li kopantsoe ka har'a stackup e felletseng. Mokhoa ona o arola likarolo tsa koporo tse teteaneng, tse lumellang liparamente tse ntlafalitsoeng bakeng sa kopano e 'ngoe le e 'ngoe ea li-sublayer.

Hybrid Copper Thickness Design

Ho beoa ha boima bo fapaneng ba koporo ka har'a stackup ka maqiti ho leka-lekanya litlhoko tsa hona joale tsa ho jara khahlanong le liphephetso tsa lamination. Mealo ea motlakase e sebelisa koporo e boima moo ho hlokahalang, ha mealo ea matšoao e sebelisa boima bo tloaelehileng ho fokotsa maemo a feteletseng a topology. Mokhoa ona o kopaneng o boloka ts'ebetso ea motlakase ha o ntse o ntlafatsa ho tšoana ha phallo ea resin.

Lamination e Thusang ka Vacuum

Lisebelisoa tsa vacuum lamination li ntša moea ho tloha ka har'a stackup pele le nakong ea ho hatella, ho tlosa li-precursors tse se nang letho. Vacuum e tsitsitseng ea 25-28 inches Hg nakong ea phallo e netefatsa hore resin e tlatsa likheo tsohle tse potolohileng likarolo tse teteaneng tsa koporo. Mokhoa ona o sebetsa ka ho khetheha bakeng sa ho etsoa ha PCB e boima ea koporo e nang le boima ba koporo bo fetang 6oz.

Thermal Press Ketsiso

Finite element modelling e bolela esale pele litsela tsa ho phalla ha resin le ho supa libaka tse se nang letho pele ho tlhahiso. Software ea simulation e ikarabella bakeng sa kabo ea botenya ba koporo, thepa ea phallo ea prepreg, le liparamente tsa potoloho ho bolela esale pele boitšoaro ba phanele. Teko ea sebele ea litlhophiso tse ling tsa li-stackup e fokotsa ts'ebetso ea liteko le liphoso.

Mefokolo e Tloaelehileng le Tharollo ea Mathata ho Tlhahiso e Matla ea Koporo ea PCB

Etching-Related Mefokolo

Overcut lateral undercut e etsa hore ho be le li-trace profiles moo bophara ba motheo bo oelang ka tlase ho tlhaloso ha bophara bo ka holimo bo ntse bo amoheleha. Ho chesoa ho sa fellang ho siea masala a koporo lipakeng tsa mesaletsa, haholo-holo libakeng tse sa tsitsang tse nang le phihlello e fokolang. Liphetoho tsa sekhahla sa li-etch ho pholletsa le phanele li hlahisa ho se lumellane ha bophara ba trace boo ho senyang taolo ea impedance.

Litaba tsena li hloka litokiso tse lebisitsoeng:

• Sistimi ea Etchant e leka-lekaneng ho khutlisa khatello e nepahetseng ea koporo le maemo a pH
• Spray bar repositioning ho ntlafatsa phallo e ts'oanang ho pholletsa le bokaholimo ba phanele
• Litokiso tsa mats'eliso a lipaterone ho khahlano le liphetoho tse hlophisitsoeng

Litšitiso tsa Lamination

Delamination pakeng tsa koporo le resin hangata e bakoa ke ho se lokisoe ho lekaneng ha bokaholimo kapa ho phalla ha resin e lekaneng ho potoloha likarolo tse teteaneng. Libaka tse nang le tlala ea resin li hlaha e le matheba a masoeu holim'a likarolo tse fapaneng, e leng se bontšang prepreg e nang le li-resin tse sa lekaneng. Leqephe la ntoa le fetang 0.75% le bonts'a kabo ea koporo e sa leka-lekanang kapa mocheso o feteletseng oa khatiso.

Maano a ho Lokisa

Liphetoho tsa moralo oa stackup tse leka-lekaneng boima ba koporo pakeng tsa mealo e ka holimo le e ka tlase li fokotsa mekhoa ea ho warpage tlhahisong ea PCB ea koporo e boima. Lisebelisoa tsa press pad tse nang le thepa ea katoloso ea mocheso e lumellanang li tšehetsa liphanele nakong ea ho pholisa, li fokotsa ho fetoha ho bakoang ke khatello ea maikutlo. Linako tse telele tsa ho tšoara vacuum hammoho le sekhahla se liehang sa ho futhumatsa li lumella ho ntšoa ha khase ka botlalo pele ho gelation ea resin.

Qetello: Ts'ebetso ea Ts'ebetso bakeng sa Tlhahiso e Tšepahalang ea Koporo e Matla ea PCB

Katleho ea ho etsa koporo e boima ea PCB e ipapisitse le ntlafatso e kopaneng ea lits'ebetso tsa etching le lamination ho fapana le liphetoho tse ikhethileng tsa paramethara. Phetoho ea ho tloha ho mokhoa o tloaelehileng oa ho fafatsa ho lebisa taolong e nepahetseng ea lik'hemik'hale, e kopantsoeng le mekhoa e tsoetseng pele ea mekhahlelo e mengata, e nolofalelitse tlhahiso e tšepahalang ea liboto tse nang le boima ba koporo tseo pele li neng li nkoa li sa sebetse bakeng sa tlhahiso ea molumo.

Highleap Electronics e fana ka bokhoni bo felletseng ba ho etsa koporo e boima ea PCB:

• Boima ba koporo bo tloha ho 3oz ho isa ho 20oz ka li-profiles tse laoloang ka tlase ho 15%
• Matšeliso a tsoetseng pele a CAM le pulse etching bakeng sa ho nepahala ha dimensional ka hare ho ± 0.05mm
• Multi-stage vacuum lamination systems e etsa bonnete ba hore kaho e se nang letho
• Mekhoa e latellanang le e nyalisitsoeng ea lamination bakeng sa li-stackups tse rarahaneng tsa multilayer
• Ketsiso e felletseng ea ts'ebetso le ntlafatso bakeng sa litlhoko tse ikhethileng tsa ts'ebeliso

Sehlopha sa rona sa boenjiniere se fana ka tšehetso e inehetseng bakeng sa phetoho ea motlakase, lits'ebetso tsa taolo ea likoloi le indasteri. Ikopanye le Highleap Electronics ho buisana ka litlhoko tsa hau tsa koporo e boima le ho fumana likhothaletso tsa ts'ebetso e ikhethileng ea ts'ebeliso tse tšehelitsoeng ke boiphihlelo bo pakiloeng ba tlhahiso.