Li-PCB tsa Ceramic tsa High-Frequency bakeng sa 5G, Radar & Antenna Modules
Hobaneng Li-PCB tsa Ceramic tse Phahameng ka ho Fetisisa li le Bohlokoa bakeng sa Litsamaiso tsa Sejoale-joale tsa RF
Katoloso e potlakileng ea meaho ea 5G, lits'ebetso tsa radar ea likoloi, le li-module tsa antenna tse tsoetseng pele li hloka liboto tsa potoloho tse hatisitsoeng tse khonang ho boloka botsitso ba matšoao ho feta lits'ebetso tsa setso. Li-PCB tsa ceramic tsa maqhubu a phahameng li phahamisa lisebelisoa tse kang aluminium nitride, alumina, le silicon nitride ho fana ka ts'ebetso e phahameng ea motlakase, taolo ea mocheso, le botsitso ba sebopeho ha li bapisoa le mefuta e meng e tloaelehileng e thehiloeng ho polymer. Li-substrates tsena tse khethehileng lia sebetsa hantle ha lits'ebetso li hloka taolo e ts'oanang ea matla a phahameng a matla le tahlehelo e tlase ea mats'oao ho maqhubu a fetang 10 GHz.
Leha di-laminate tse thehilweng ho PTFE di fana ka thepa e ntle ya dielectric, di-substrate tsa ceramic di fana ka boleng ba ho tsamaisa mocheso bo phahameng ka makgetlo a leshome ho isa ho a mashome a mabedi, e leng se etsang hore e be tsa bohlokwa bakeng sa dikarolo tse sebetsang tsa RF moo ho qhalana ha mocheso ho amang botshepehi ka ho toba. Phapanyetsano e kenyeletsa ditjeo tse hodimo tsa thepa le mekgwa e rarahaneng ya tlhahiso, e lokelang ho lekanngwa ho ya ka ditlhoko tsa tshebetso tsa tshebediso ka nngwe e ikgethang.
Ho Utloisisa Litlhoko tsa Ts'ebetso ea Maqhubu a Phahameng
Mehato ea khafetsa bakeng sa li-PCB tsa Ceramic
Ts'ebetso ea maqhubu a phahameng hangata e qala moo thepa ea PCB e tloaelehileng e bonts'ang ho senyeha ho ka lekanngoang ts'ebetsong ea motlakase, ka kakaretso ho feta 1 GHz. Bakeng sa li-PCB tsa ceramic tse nang le maqhubu a phahameng, palo ea maqhubu a amehang e tloha ho lihlopha tse tlase tsa microwave ho pota 2 GHz ho isa maqhubung a millimeter-wave a atamelang 100 GHz. Lintlheng tsena tsa ts'ebetso, liketsahalo tsa motlakase tse lulang li sa lekane maqhubung a tlase li fetoha lithibelo tsa mantlha tsa moralo.
Bohlokoa RF Phenomena
Tšusumetso ea letlalo e lebisa tlhokomelo ho phallo ea hona joale haufi le libaka tsa conductor, ka katleho e eketsa khanyetso ha maqhubu a ntse a phahama. Litahlehelo tsa dielectric li fetola matla a pontšo hore e be mocheso, ha li-impedance discontinuities ho li-interface tsa likarolo le liphetoho tsa trace li hlahisa lipontšo tse senyang boleng ba matšoao. Li-PCB tsa ceramic tsa maqhubu a phahameng li sebetsana le liphephetso tsena ka thepa ea dielectric e laoloang ka hloko le botsitso bo phahameng ba boemo bo holimo, e nolofalletsang taolo ea impedance e sa lebelloang le ho fokotsa matšoao a fokolang.
Lisebelisoa tsa PCB tsa Ceramic tsa High-Frequency: Thepa le Mekhoa ea Khetho
Aluminium Nitride (AlN) Substrates
Aluminium nitride e emela khetho ea boleng bo holimo bakeng sa li-PCB tsa ceramic tse nang le maqhubu a phahameng tse hlokang ts'ebetso e ikhethang ea mocheso. Ka conductivity ea mocheso e tlohang ho 150 ho isa ho 180 W/mK, li-substrate tsa AlN li jala mocheso ka katleho ho tsoa ho li-amplifier tsa matla le li-module tsa phetisetso-amohela. Coefficient ea katoloso ea mocheso e ts'oana haufi-ufi le silicon ho hoo e ka bang 4.5 ppm/°C, e fokotsa khatello ea mocheso lits'ebetsong tsa die-attach. Thepa ea dielectric e lula e tsitsitse ka constant ea dielectric e haufi le 8.8 le tangent ea tahlehelo e ka tlase ho 0.001 maqhubung a microwave.
Alumina (Al₂O₃) Substrates
Li-substrate tsa Alumina li fana ka mokhoa o mong o theko e tlaase bakeng sa li-PCB tsa ceramic tse nang le maqhubu a phahameng moo ho nang le motlakase o itekanetseng. Alumina e tloaelehileng ea 96% e fana ka motlakase o ka bang 20-25 W/mK, ha mefuta ea 99.6% e fihla ho 30-35 W/mK. Hangata motsoako oa dielectric o oela pakeng tsa 9.5 le 10.0, ka boleng ba tahlehelo bo ka bang 0.0002 ho isa ho 0.0005 maqhubung a microwave. Matla a mechine a Alumina le lits'ebetso tsa tlhahiso tse hōlileng tsebong li etsa hore e be thepa e sebetsang bakeng sa li-module tsa RF, li-filters le li-substrate tsa antenna.
Silicon Nitride le Lisebelisoa tse khethehileng
Silicon nitride e tlisa matla a babatsehang a mechini le ho tsamaisa mocheso ka tekanyo e itekanetseng ho pota 15-30 W/mK lits'ebetsong tse ikhethileng. Silicon carbide e fana ka ho tsamaisa mocheso ka tekanyo e phahameng le ho feta bakeng sa lits'ebetso tsa matla a feteletseng, leha e le ka litšenyehelo tse eketsehileng. Lisebelisoa tsena li tlatsa litlhoko tsa niche ho li-PCB tsa ceramic tse nang le maqhubu a phahameng empa li bona ho kenngoa ho fokolang ha ho bapisoa le AlN le alumina.
PTFE-Ceramic Composite Laminates
Mekhoa ea Hybrid e kopanya lisebelisoa tsa matrix tsa PTFE le li-filler tsa ceramic ho leka-lekanya thepa. Li-laminate tsena li fihlella li-constants tsa dielectric ho tloha ho 2.2 ho ea ho 10.0 ho itšetlehile ka litaba tsa li-filler, tse nang le tahlehelo e tlaase ka ho fetisisa ea litekanyetso tse ka tlaase ho 0.0009. Thermal conductivity e lula e le tlase ho feta li-substrates tse hloekileng tsa ceramic, hangata 0.5-1.0 W / mK, empa lisebelisoa li fana ka maqheka a bonolo ho sebelisa mekhoa e tloaelehileng ea PCB.
Papiso ea Ts'ebetso ea Boitsebiso
| lintho tse bonahalang | Dielectric Constant (10 GHz) | Tahlehelo Tangent | Thermal Conductivity (W/mK) | Lisebelisoa tsa mantlha |
|---|---|---|---|---|
| AlN | 8.8 | 150-180 | Li-amplifiers tsa matla, li-module tsa T / R | |
| Al₂O₃ (96%) | 9.5-10.0 | 0.0002-0.0005 | 20-25 | Lisebelisoa tsa antenna, li-filters tsa RF |
| Al₂O₃ (99.6%) | 9.8-10.0 | 0.0001-0.0003 | 30-35 | Li-circuits tsa microwave tse lahleheloang tlase |
| Si₃N₄ | 7.0-8.0 | 0.0005-0.001 | 15-30 | Li-module tse tšepahalang haholo |
| PTFE-Ceramic | 2.2-10.0 | 0.5-1.0 | Phetiso ea tahlehelo e tlase haholo |
Thepa ea Motlakase e Hlalosang Ts'ebetso ea PCB ea Ceramic e phahameng-Frequency
Dielectric Constant le Stability
Dielectric e sa fetoheng e etsa qeto ea ho thibela mohala oa phetisetso le lebelo la phatlalatso ea lets'oao ho li-PCB tsa ceramic tsa maqhubu a phahameng haholo. Lisebelisoa tsa ceramic li boloka botsitso bo ikhethang maetong a mocheso, ka li-coefficients tsa mocheso hangata ka tlase ho 50 ppm/°C. Botsitso bona bo tiisa hore lithapo tsa phetisetso tsa 50-ohm tse hlophisitsoeng ka hloko li boloka ho nepahala ha tšitiso ho tloha ho matla a pele a ho nyoloha ka mojaro o felletseng oa mocheso.
Tahlehelo Tangent le Pontšo ea Pontšo
Tantent ea tahlehelo e lekanya matla a felloang ke dielectric nakong ea potoloho e 'ngoe le e 'ngoe ea matšoao. Li-PCB tsa ceramic tsa maqhubu a phahameng a nang le tahlehelo ea boleng bo ka tlase ho 0.001 li nolofalletsa mehala ea phetisetso e tlase e bohlokoa bakeng sa lits'ebetso tsa millimeter-wave. Mohala oa microstrip ho alumina o nang le 0.0003 tahlehelo ea tangent e bonts'a hoo e ka bang 0.05 dB ka leqhubu la tahlehelo ea dielectric ho 10 GHz.
Mekhoa ea Taolo ea Impedans
Impedance e laoloang ho li-PCB tsa ceramic tse nang le maqhubu a phahameng e itšetlehile ka likamano tse nepahetseng pakeng tsa jiometri ea trace, botenya ba dielectric, le thepa ea thepa. Litlhophiso tsa microstrip li beha matšoao a matšoao holim'a bokaholimo bo nang le sefofane sa fatše ka tlase, se fanang ka tsela e fumanehang habonolo empa mahlaseli a mangata maqhubung a millimeter-wave. Stripline e kenya matšoao pakeng tsa lifofane tsa fatše, e fana ka tšireletso e betere ka litšenyehelo tsa ho rarahana haholoanyane ka liphetoho.
Tsamaiso ea Mocheso ho Li-PCB tsa Ceramic tse Phahameng ka ho Fetisisa
Matla a ho Fetola Mocheso
Li-PCB tsa ceramic tsa maqhubu a phahameng li sebetsa hantle haholo lits'ebetsong moo li-amplifiers tsa RF, li-antenna arrays, kapa li-transmit-receive modules li hlahisang mocheso o moholo. Li-substrates tsa aluminium nitride li hasanya mocheso ka thōko ho pholletsa le boto ha li ntse li etsa hore ho be le botenya ho lisinki tsa mocheso. Sesebelisoa se tloaelehileng sa amplifier se hlahisang 10 W ho 5mm x 5mm footprint se etsa hore mocheso o kopane 30-40 ° C tlase ho AlN ha o bapisoa le li-alumina substrates tsa botenya bo lekanang.
Coefficient of Thermal Expansion Matching
Direct die attach e hloka tlhokomelo e hlokolosi ea ho bapisa CTE lipakeng tsa li-PCB tsa ceramic tsa maqhubu a phahameng le lisebelisoa tsa semiconductor. Silicon's CTE ea 2.6 ppm/°C e lumellana hantle le AlN ka 4.5 ppm/°C, e hlahisa maemo a amohelehang a khatello ea maikutlo ka mefuta e tloaelehileng ea mocheso oa ho sebetsa. Alumina's 6.5-7.0 ppm/°C e baka khatello e matla empa e lula e sebetsa bakeng sa lits'ebetso tse ngata tse nang le lisebelisoa tse loketseng tsa ho kopanya.
Mehato ea Mechini
Li-substrates tsa Ceramic li bonts'a litšobotsi tsa brittle fracture tse hlokang tlhokomelo nakong ea ho sebetsana le ho kopanya. Li-PCB tsa ceramic tsa maqhubu a phahameng hangata li sebelisa mefuta ea botenya ho tloha ho 0.25mm ho isa ho 1.0mm ho latela litlhoko tsa ts'ehetso ea mochini le litšitiso tsa moralo oa motlakase. Li-substrates tse tšesaane li fokotsa ka likarolo tsa likarolo 'me li nolofalletsa meralo e kopaneng empa li hloka ts'ebetso e hlokolosi.
Tlhahiso le Kopano ea Li-PCB tsa Ceramic tse Phahameng ka ho Fetisisa
Mekhoa ea ho Etsa Ceramic
Li-PCB tsa ceramic tsa maqhubu a phahameng li sebelisa mekhoa e ikhethang ea tlhahiso ha e bapisoa le laminate ea polymer. Filimi e teteaneng e sebetsana le li-pastes tse tsamaisang skrineng holim'a likaroloana tsa ceramic tse chesitsoeng, tse fanang ka qeto e itekanetseng e nang le litšobotsi tse ntle tsa mocheso. Mocheso o phahameng oa mocheso oa ceramic (HTCC) o sebelisana le tšepe le likarolo tsa ceramic ho 1600 ° C, e leng se nolofalletsang mehaho e rarahaneng ea mahlakore a mararo. Lisebelisoa tsa ceramic (LTCC) tsa mocheso o tlase oa mocheso o ka tlase ho 1000 ° C, li lumella tšepe ea silevera le khauta e nang le bokhoni ba mela e metle.
Metallization le Kopano
Metallization ea koporo ho li-PCB tsa ceramic tse nang le maqhubu a phahameng a mangata li tlameha ho fihlela ho khomarela ka matla ha li ntse li boloka tahlehelo e tlase ho maqhubu a microwave. Botenya bo tloaelehileng bo tloha ho 18μm ho isa ho 100μm ho latela litlhoko tsa hajoale le menahano ea botebo ba letlalo. Kopano ea likarolo e sebelisa mekhoa e tloaelehileng ea ho phalla ha solder, le hoja mocheso o phahameng le litekanyetso tsa marang-rang li hloka phetoho bakeng sa boima ba mocheso oa ceramic substrate.
Moralo bakeng sa Tlhahiso
Litlhaloso tsa bohlokoa bakeng sa tlhahiso ea PCB ea ceramic e phahameng haholo e kenyelletsa:
- Bonyane ba likarolo tsa boholo - Trace bophara le sebaka ka tloaelo 0.1mm ho 0.15mm ho itšetlehile ka tshebetso metallization.
- Ka li-parameter - Diameter e lokela ho feta 0.2mm ka likarolo tse bolokiloeng ka tlase ho 5: 1 bakeng sa plating e tšepahalang.
- Litlhaloso tsa Metallization - Hlalosa botenya ba conductor, pheletso ea bokaholimo, le litlhoko tsa ho khomarela ka ho hlaka.
- Litšitiso tsa liphanele - Boholo bo lula bo le nyane ho feta li-PCB tsa polymer ka lebaka la mefokolo ea ts'ebetso ea ceramic.
Teko le Litšoaneleho tsa Li-PCB tsa Ceramic tse Phahameng ka ho Fetisisa
RF Sebopeho
Litekanyo tsa S-parameter tse tsoang ho bahlahlobi ba marang-rang ba vector li fana ka litlhaloso tse felletseng tsa li-PCB tsa ceramic tsa maqhubu a phahameng. Tahlehelo ea ho kenya e lekanya phokotso ea mats'oao ka likhoele tsa phetisetso kapa li-circuits tse kopaneng, athe tahlehelo ea ho khutla e senola ho se tsoele pele ho sa sebetseng le boleng bo ts'oanang. Time-domain reflectometry e supa libaka tse ikhethileng tsa liphapang tsa impedance, e nolofalletsang khokahano lipakeng tsa likarolo tsa 'mele le ts'ebetso ea motlakase.
Teko ea ho tšepahala
Thermal cycling ho tloha -55 ° C ho ea + 125 ° C ho feta 500 ho ea ho 1000 cycles e netefatsa botšepehi bo kopanetsoeng ba solder le ho khomarela metallization ho li-PCB tsa ceramic tse phahameng-frequency. Teko ea vibration ka MIL-STD-810 e netefatsa ho lekana ha mochini bakeng sa lits'ebetso tsa mehala kapa tse tsamaisoang ke moea. Tlhahlobo ea likarolo tse fapaneng tsa meaho le lihokelo tsa likarolo li senola ho ka 'na ha e-ba le ho qhekella kapa ho phatloha pele ho tsamaisoa tšimong.
Li-PCB tsa Ceramic tse Phahameng ka ho Fetisisa vs Lisebelisuoa tse ling
| Property | Ceramic (AlN/Al₂O₃) | PTFE-E thehiloe | Laminate ea Hydrocarbon |
|---|---|---|---|
| Tangent ea tahlehelo (10 GHz) | 0.0001-0.001 | 0.0009-0.002 | 0.002-0.004 |
| Dk Stability (temp) | ±50 ppm/°C | ±50-200 ppm/°C | ±100-300 ppm/°C |
| Ho khanna ho chesang | 20-180 W/mK | 0.2-0.7 W/mK | 0.3-0.8 W/mK |
| Litšenyehelo tse Batlang | High | Medium | Low |
| Ho rarahana ha boiqapelo | High | Medium | Low |
Likopo tsa li-PCB tsa Ceramic tsa High-Frequency
5G Front-End Modules
Maqhubu a li-millimeter-wave ka har'a litsamaiso tsa 5G a hloka taolo e tiileng holim'a khafetsa ea dielectric ho boloka momahano oa mekhahlelo ho pholletsa le li-antenna. Li-PCB tsa ceramic tse nang le maqhubu a phahameng li etsa hore ho be le ho kopanngoa ha li-phase shifters, amplifiers, le lisebelisoa tse khanyang ho li-substrates tse le 'ngoe tse nang le mocheso oa mocheso o lekaneng bakeng sa phetisetso e tsoelang pele. Litlhophiso tsa Array li rua molemo ho tsoa ho matla a mangata a LTCC bakeng sa marang-rang a compact a mahlakore a mararo a kabo ea matla.
Radar le T/R Modules
Sistimi ea radar ea likoloi le ea sefofane e beha lisebelisoa tsa elektroniki tsa RF maemong a mocheso a feteletseng le maemo a sisinyehang. Li-PCB tsa ceramic tsa maqhubu a phahameng tse sebelisang alumina kapa li-substrates tsa AlN li fana ka matla a mochini le ho ts'epahala ha mocheso ho hlokahalang bakeng sa lits'ebetso tsena. Ts'ebetso ea pulsed e etsa hore mocheso o phalle hang-hang o hlokang ho hasana hantle ha mocheso ho qoba libaka tse chesang.
Li-Module tsa Antenna le Lisefa
Meralo ea li-filthara tse kopaneng li sebelisa lisebelisoa tse phahameng tsa dielectric tsa ceramic ho fokotsa boholo ba 'mele ha li ntse li boloka lintlha tsa Q tse laoloang. Li-PCB tsa ceramic tsa maqhubu a phahameng li thusa ho kenya ts'ebetsong ea antenna moo likarolo tse khanyang, marang-rang a ts'oanang, le likarolo tse sebetsang li kopanang ho li-substrates tse le 'ngoe. Botsitso ba mocheso bo tiisa maqhubu a setsi sa filthara le bandwidth ho pholletsa le mefuta ea mocheso oa ts'ebetso.
Khetho ea Theko le Moetsi bakeng sa li-PCB tsa Ceramic tsa Maqhubu a Phahameng
Litlhaloso tsa li-PCB tsa ceramic tsa maqhubu a phahameng li hloka tlhaloso e hlakileng ea litlhoko tsa motlakase, mocheso le mochini. Dielectric kamehla e lokela ho hlalosoa ka makhetlo a mangata a sebetsang ka lihlopha tse amohelehang tsa mamello. Tahlehelo ea tantent ka mokhoa o ts'oanang e tlameha ho supa khafetsa ea tekanyo le boleng bo amohelehang. Mamello ea botenya ba substrate e ama ka kotloloho taolo ea impedance mme e lokela ho hlalosoa ka thata ho feta mamello e tloaelehileng ea ceramic ha ho le bohlokoa.
Bokhoni ba tlhahiso bo fapana haholo hara bafepedi ba PCB ba letsopa . Khetho ea ts'ebetso ea HTCC khahlanong le LTCC e ama boholo ba likarolo tse fumanehang le likhetho tsa metallization. Kopa litlankane tsa liteko bakeng sa tlhaloso ea S-parameter le netefatso ea likarolo tse fapaneng pele u itlama ho hlahisa ka botlalo. Bahlahisi ba tšoanelehang ba lokela ho fana ka setifikeiti sa thepa, liphetho tsa tlhahlobo ea litekanyo, le data ea liteko tsa motlakase ka lotho ka 'ngoe.
Qetello: Ho kenya ts'ebetsong ka katleho li-PCB tsa Ceramic tsa High-Frequency
Li-PCB tsa ceramic tsa maqhubu a phahameng li fana ka ts'ebetso e ke keng ea lekanngoa bakeng sa lits'ebetso tse batlang tsa RF le microwave moo lisebelisoa tse tloaelehileng li sitoang ho fihlela litlhoko tsa motlakase le tsa mocheso ka nako e le 'ngoe. Motsoako oa tahlehelo e tlase ea dielectric, conductivity e phahameng ea mocheso, le botsitso bo botle ba boemo bo botle bo nolofalletsa ts'ebetso e tšepahalang litsing tsa 5G, radar ea likoloi le litsamaiso tsa sefofane.
Khetho e nepahetseng ea thepa pakeng tsa aluminium nitride le alumina e itšetlehile ka ho leka-lekanya litlhoko tsa ts'ebetso ea mocheso khahlanong le lithibelo tsa litšenyehelo. Katleho ea moralo e hloka tlhokomelo e hlokolosi ho tse laoloang ke impedance routing, meaho ea lifofane tse fatše, le maano a taolo ea mocheso a ikhethileng ho li-substrates tsa ceramic.
Highleap Electronics High-Frequency Ceramic PCB Matla a PCB
Highleap Electronics e fana ka litharollo tse felletseng bakeng sa lits'ebetso tse tsoetseng pele tsa RF tse hlokang theknoloji ea substrate ea ceramic:
- Tsebo ea lintho tse ngata - Boiphihlelo ba ho etsa lintho ka AlN, alumina, le LTCC bakeng sa lits'ebetso ho tloha ho 1 GHz ho isa ho maqhubu a millimeter-wave.
- Taolo ea impedance e nepahetseng - Botenya ba dielectric bo laoloang le ho lata geometry ho fihlela ± 5% mamello ea ho se be teng methapong ea bohlokoa ea phetisetso ea RF.
- Litšebeletso tse kopanetsoeng tsa kopano - Litharollo tse felletseng tsa li-turnkey tse kenyelletsang "die attach", ho tlama mohala ka terata, le kopano ea likarolo tse nang le ts'ebetso ea taolo ea mocheso.
- Teko ea RF le netefatso - Tekanyo ea S-parameter ea ka tlung le bokhoni ba ho bonts'a nako ea sebaka sa marang-rang ho netefatsa ts'ebetso ea motlakase pele o tlisoa.
- Tšehetso ea moralo - Sehlopha sa boenjiniere ba kopo se fana ka tataiso ea khetho ea thepa, likhothaletso tsa ho bokella, le maikutlo a DFM ho tsoa mohopolong oa pele ka tlhahiso.
Na u se u loketse ho buisana ka litlhoko tsa hau tsa PCB tsa ceramic tse sebelisoang khafetsa? Ikopanye le Highleap Electronics ho hlahloba litlhaloso tsa hau le ho fumana likhothaletso tse qaqileng tsa tekheniki bakeng sa projeke ea hau e latelang ea RF. Sehlopha sa rona sa boenjiniere se ikhethile ho fetolela litlhoko tse thata tsa ts'ebetso hore e be litharollo tse ka hlahisoang le tse theko e tlaase.
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Ha re u etsetse tlhahlobo ea DFM/DFA 'me re khutlele ho uena ka tlaleho. U ka kenya lifaele tsa hau ka mokhoa o sireletsehileng ka webosaete ea rona. Re hloka lintlha tse latelang ho u fa quote:
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- Gerber, ODB++, kapa .pcb, spec.
- Lethathamo la BOM haeba o hloka kopano
- bongata
- Nako ea ho fetoha
Ntle le tlhahiso ea PCB, re fana ka mefuta e fapaneng ea lits'ebeletso tsa elektroniki, ho kenyeletsoa moralo oa PCB, PCBA, le tharollo ea turnkey. Hore na o hloka thuso ka prototyping, netefatso ea moralo, ho fumana likarolo, kapa tlhahiso e ngata, re fana ka ts'ehetso ea ho qetela ho netefatsa katleho ea morero oa hau.
Bakeng sa litšebeletso tsa PCBA, ka kopo fana ka BOM ea hau (Bill of Materials) le litaelo tse itseng tsa kopano. Re boetse re fana ka tlhahlobo ea DFM/DFA ho ntlafatsa meralo ea hau bakeng sa tlhahiso le kopano, ho netefatsa ts'ebetso ea tlhahiso e boreleli.
