MCPCB Ka Moqapi | Litsela tsa Mocheso oa Boenjiniere bakeng sa Likopo tse Matla a Phahameng

Selelekela: MCPCB Via Design Basics in Heat Management

Ho Metal Core PCBs , li-vias ha li sebeletse feela e le likhokahano tsa motlakase empa hape li sebetsa e le litsela tsa bohlokoa tsa mocheso, li fetisetsa mocheso ho tloha likarolong tse kentsoeng holim'a metsi ho ea ho substrate ea aluminium kapa ea koporo e ka tlase. Moralo le sebaka sa li-vias tsa mocheso li ama ka ho toba mocheso oa li-junction ho li-LED tse matla haholo le ts'ebetso e sireletsehileng ea li-module tsa motlakase.

Lisebelisoa tsa morao-rao tse sebetsang hantle - joalo ka mabone a likoloi tsa LED, li-converter tsa indasteri le li-amplifiers tsa RF - li ipapisitse le ho ntlafatsoa ka meralo ho netefatsa taolo e tšepahalang ea mocheso. MCPCB e sebetsang ka mokhoa oa ho leka-lekanya ho felloa ke mocheso, ho itšehla thajana ha motlakase, le ho etsoa, ​​​​ho nolofalletsa baenjiniere ho lelefatsa bophelo ba sehlahisoa le ho boloka ts'ebetso tlas'a maemo a boima.

Mefuta ea Vias ho MCPCB Via Design Applications

Tsela ea Letšoao

Signal vias ho MCPCB ka moralo e netefatsa khokahanyo e tšepahalang ea motlakase lipakeng tsa mekhahlelo ea potoloho ha o ntse o haola le mokoallo oa dielectric. Lintlha tsa bohlokoa tsa moralo li kenyelletsa bophara bo nepahetseng ka bophara, sebaka sa insulation, le ho latela litlhoko tsa ho tlosoa ha motlakase:

• Taolo ea bophara - Ka tloaelo ho 0.2mm ho isa ho 0.5mm ho boloka ho ts'oana le ho ts'oara ha matšoao
• Sekhahla sa insulation - Bonyane 0.25mm bakeng sa lits'ebetso ho fihla ho 250V AC; 0.5mm kapa ho feta bakeng sa maqhubu a phahameng
• Polokeho ea motlakase - Ho hloekisoa le ho kenngoa ha barrel ho thibela ho khutsufala nakong ea libaesekele tse futhumetseng

Tsela ea Thermal

Li-vias tsa mocheso li theha litsela tse khethehileng tsa ho qhala mocheso ho tloha li-pad tsa likarolo ho ea bohareng ba tšepe, e leng se eketsang ho tsamaisoa ha mocheso le ho fokotsa mocheso oa li-junction. Lintho tse lokelang ho nahanoa ka moralo li kenyelletsa ka boholo, bongata le sebaka:

• Ka bophara - E kholo ho feta li-vias tsa lets'oao, hangata 0.3mm ho isa ho 1.0mm
• Ka density - Mekhahlelo e phahameng ea matla ka tlas'a likarolo tse matla a phahameng a ntlafatsa phetiso ea mocheso
• Sebopeho sa lihlopha - E etselitsoe ho tsamaisana le phano ea phallo ea mocheso le ho fihlela ho hanyetsa mocheso ka tlase ho 1.5 ° C / W lits'ebetsong tse tloaelehileng tsa LED

Batho ba Foufetseng le ba Patoang ka Multilayer MCPCB

Li-Vis tse sa boneng le tse patiloeng li nolofalletsa khokahano e ikhethileng ho li-MCPCB tsa multilayer, ho boloka botšepehi ba tsela e futhumatsang ha e ntse e lumella likarolo tse ngata. Lintlha tsa bohlokoa tsa moralo li kenyelletsa:

• Khokahano e khethehileng ea lera – Blind vias amahanya le dikarolo ka holimo le dikarolo ka hare ntle le phunyeletse botenya feletseng boto
• Karohano ea mocheso - E arola litsamaiso tsa mats'oao ho tsoa litseleng tsa taolo ea mocheso bakeng sa litsamaiso tse rarahaneng tsa matla
• Tlhahiso e nepahetseng - E hloka botebo bo nepahetseng ba ho cheka le ngoliso ea lera

Tsela e tlatsitsoeng kapa e kentsoeng

Khetho ea thepa ea ho tlatsa ho MCPCB ka moralo e ama haholo ts'ebetso ea mocheso le ho ts'epahala ha kopano. Likhetho tse tharo tsa mantlha li laola indasteri:

• Litsela tse tletseng koporo - Thermal conductivity e phahameng ho 385 W/m·K e thusa ho fetisa mocheso o phahameng bakeng sa lisebelisoa tse feteletseng tsa matla
• Epoxy e tletseng silevera - Ts'ebetso e leka-lekaneng ea litšenyehelo ho 15-60 W/m·K conductivity e loketseng meralo e itekanetseng ea matla
• Thermally conductive resin - Tharollo e bolokang litšenyehelo ho 2-8 W/m·K e thibelang ho phunya ha solder ha o ntse o boloka ts'ebetso e amohelehang ea mocheso

MCPCB e Bohlokoa ka Moralo oa Mehaho ea Thermal

Ka Diameter le Density Optimization

Ka bophara le boholo ba marang-rang ka kopanelo li khetholla ho tsamaisoa ha mocheso ho MCPCB ka moralo. Li-vias tse nyane (0.3-0.4mm) li tšehetsa li-arrays tse phahameng, ha li-vias tse khōloanyane (0.8mm) li ntlafatsa tsamaiso ea mocheso ka bomong empa li fokotsa ho paka. Litlhophiso tse nepahetseng li leka-lekanya ho ata ha mocheso le mokhoa oa ho etsoa:

• Sekhahla se senyenyane ka tsela - Mekhahlelo e phahameng haholo (100–120 vias/cm²) e ntlafatsa kabo ea mocheso oa lateral
• E kholo ea bophara ka tsela - Boitšoaro bo tlase (20–30 vias/cm²) empa ho tsamaisana hantle ha motho a le mong
• mohlala - 0.4mm ka tsela e arohaneng ka 1.0mm e fokotsa khanyetso ea mocheso ho 40-60%

Ka Litlhophiso le Lipaterone tsa Sebopeho

Ho beoa ka leano la li-vias tsa mocheso ho eketsa phetiso ea mocheso ka tlasa likarolo tse matla a phahameng:

• Ho tsamaisana ka kotloloho - Vias e tsepamisitsoe tlas'a liphaephe tsa mocheso kapa li-slugs tsa mocheso
• Mefuta e mengata - Li-array tsa hexagonal li fana ka ts'ebetso e ntle ea mocheso ho fihla ho 15% ho feta li-grid tsa khutlonnetsepa
• Sebopeho se ikhethileng ka karolo - LED: 3 × 3 kapa 4 × 4 lihlopha; Li-semiconductors tsa matla: lihlopha tse teteaneng tlas'a libaka tse hokahaneng

Lera la Dielectric Tšusumetso ea Botenya

Botenya ba dielectric le thepa li hlalosa khanyetso ea mocheso pakeng tsa motsoako le tšepe ea mantlha:

• Botenya ba maemo – 75–200μm, mocheso conductivity 1–3 W/m · K
• Li-dielectric tsa Premium – Ceramic e tletseng, 5–8 W/m·K, litšenyehelo tse phahameng
• Tšusumetso ea moralo - Keketseho e 'ngoe le e' ngoe ea 25μm ea botenya e eketsa ~ 0.3-0.5 ° C / W khanyetso ea mocheso; e tlameha ho leka-lekanya ho qhala mocheso le ho itšehla thajana ka motlakase, haholo-holo> 600V lits'ebetso

MCPCB e tsoetseng pele ka Mekhoa ea ho Tlatsa le ho Plating

Ho Tlatsa Koporo ka ho Phethahatso

Litsela tse tlatsitsoeng ka koporo li fana ka ts'ebetso e phahameng ka ho fetesisa ea mocheso ho MCPCB ka moralo, ka conductivity e fihlang ho 385 W/m·K. Electroplating e tlatsa ka libarele ka ho feletseng, e tlosa likheo tsa moea tse fokotsang ho fetisoa ha mocheso. Mokhoa ona o lumellana le lisebelisoa tse matla le tse tšepahalang haholo:

• Molemo oa mocheso - Koporo e se nang letho e eketsa phallo ea mocheso
• Processing - Pula e khethehileng ea pulse; 0.5mm vias hloka lihora tse 3-5 ho tlatsa ka ho feletseng
• Tlhophiso ea boleng - Tlhahlobo ea likarolo tse fapaneng e netefatsa <5% voids; boleng bo phahameng ba void bo fokotsa conductivity ka 15-20%

Litharollo tsa Conductive Epoxy le Resin

Li-epoxies tse tsamaisang mocheso le li-resin li fana ka mefuta e meng e sa sebetseng hantle bakeng sa MCPCB ea matla a itekanetseng ka likopo tsa moralo:

• Epoxy e tletseng silevera - 15-60 W / m · K, ho khomarela hantle le ho hanyetsa mocheso oa potoloho ea mocheso
• Metsoako e tletseng Aluminium - 3–10 W/m·K, e loketseng lisebelisoa tsa elektronike tsa bareki
• Li-resin tse tletseng ka ceramic - 2–5 W/m·K, e thibelang motlakase bakeng sa lits'ebetso tsa bohlokoa tsa ho itšehla thajana

Lisebelisoa tsena li thibela li-solder wicking mme li lumella ka potlako ka ho tlatsa ka khatiso ea skrine, ho fokotsa nako ea tlhahiso ha e bapisoa le electroplating ea koporo.

Ka Litlhare tsa Surface le Capping

Liphekolo tsa sefahleho li ntlafatsa ts'epo ea kopano ha li ntse li boloka ts'ebetso ea mocheso ho MCPCB ka moralo:

• Ho roala maske ka solder - E thibela ho kenella ha solder; botenya ba mask ≤20μm ho fokotsa khanyetso e eketsehileng ea mocheso
• E pentiloe ka likatiba - Lithako tsa silevera tsa ENIG kapa tse qoelisoang li fana ka libaka tse rekisoang ha u ntse u tiisa li-vias; botenya bo tloaelehileng ba 3-5μm
• Plating e khethehileng - E boloka li-vias tsa mocheso li bulehile haeba ho tlatsoa ka mor'a kopano ho hlokahala, ha u ntse u sireletsa li-vias tsa pontšo

Ntlafatso ea MCPCB Ka Maano a Tšebeliso ea Moralo

Taolo e sebetsang ea mocheso ho MCPCB ka moralo e hloka moralo o hokahaneng, papiso le moralo oa tlhahiso. Maano a bohlokoa a ts'ebetsong a kenyelletsa:

• Thermal ka ho beha - Li-arrays tse nang le matla a phahameng li behiloe ka ho toba ka tlas'a lisebelisoa tsa matla, li atolosa 2-3mm ho feta likarolo tsa likarolo ho matlafatsa ho hasana ha mocheso
• Ketsiso ya mocheso - Netefatsa mocheso oa matekoane, ka ho hanyetsa mocheso, le ho hanyetsa ho hasana ha substrate pele ho tlhahiso; shebisisa bonyane 25°C ka tlase ho litekanyetso tse phahameng bakeng sa ho tšepahala
• Litšitiso tsa tlhahiso - Ho cheka ka mechine ho tšehetsa likoti tse 0.2mm; ho cheka ka laser ho nolofalletsa 0.1mm microvias bakeng sa lihlopha tse teteaneng haholo
• Lintlha tsa karo-karolelano - Tekanyo ea botebo ho isa ho bophara ba ≤10: 1 bakeng sa plating e tšepahalang; tlatsoa vias ka tloaelo <1:1 ho etsa bonnete ba lefeela-mahala electroplating

Ho Hlahisa Bokhabane le ho Tšepahala ho MCPCB ka Moralo

Khetho ea mokhoa oa ho cheka e ama boleng le litšenyehelo tsa PCB ea mantlha ea tšepe ka ho kenya tšebetsong moralo. Ho cheka ka mechini ho fana ka boleng bo tsitsitseng ba masoba bakeng sa bophara bo kaholimo ho 0.25mm, ka ho nepahala ha sebaka ka hare ho ±0.05mm. Ho nepahala hona ho loketse lits'ebetso tse ngata tsa taolo ea mocheso moo mamello ea ho beha e tsamaellanang le bokhoni bo tloaelehileng ba tlhahiso ea PCB.

Ho cheka ka laser ho ipabola haholo bakeng sa MCPCB e phahameng ka ho fetisisa ka litlhophiso tsa moralo tse nang le masoba a ka tlase ho 0.2mm bophara. Sistimi ea laser ea UV e fokotsa libaka tse anngoeng ke mocheso ho isa tlase ho 20μm, ho thibela ho senyeha ha dielectric. CO₂ lasers e fana ka ts'ebetso e potlakileng empa e hloka taolo e hlokolosi ea paramente ho thibela carbonization e feteletseng.

Thermal Cycling le Reliability Testing

Ho ts'epahala ha libaesekele tse futhumatsang ho MCPCB ka moralo ho itšetlehile haholo ka ho tšepahala ha sebopeho le boleng ba ho tlatsa. Lintlha tsa bohlokoa tse amang ts'ebetso ea nako e telele li kenyelletsa:

• CTE taolo e sa lumellaneng - Copper (17 ppm/°C) khahlano le substrate ea aluminium (23 ppm/°C) e baka khatello ea maikutlo e hlokang ho nepahala ka moralo.
• Ka botenya ba lebota - Bonyane 20μm plating ea koporo e mamella maeto a phepelo ea mocheso ntle le ho phatloha ha moqomo
• Tlatsa botšepehi ba lintho tse bonahalang - Litsela tse tlatsitsoeng ka nepo li aba likhatello tsa kelello ka mokhoa o atlehileng ho feta ka tsela e se nang letho, ho lelefatsa bophelo ka 2-3×

Netefatso ea boleng ka tlhahlobo e ikemetseng ea optical e netefatsa MCPCB e nepahetseng ka ts'ebetso ea moralo. Tlhahlobo ea likarolo tse fapaneng e tiisa botlalo ba ho tlatsa le ho lumellana ha plating. Litekanyo tsa ho hanyetsa mocheso li sebelisa tlhahlobo ea nakoana ea mocheso li netefatsa hore liboto tse entsoeng li kopana le litlhaloso.

Qetello: Bokhabane ho MCPCB Via Design for Thermal Management

Moralo oa MCPCB ke oa bohlokoa bakeng sa taolo e sebetsang ea mocheso li-elektroniki tse nang le matla a phahameng. Li-vias tsa mocheso tse boholo bo nepahetseng, tse behiloeng hantle le tse tlatsitsoeng li theha litsela tse sa hanyetseng tse bolokang mocheso oa likarolo ka har'a meeli e sireletsehileng, e leng se nolofalletsang matla a mangata le ho tšepahala ha nako e telele. Lisebelisoa tse tsoetseng pele, tlhahiso e nepahetseng ea MCPCB , le ketsiso ea mocheso li ntlafatsa ts'ebetso, e leng se etsang hore meralo e ntlafalitsoeng e be ea bohlokoa bakeng sa lits'ebetso ho tloha ho li-LED tsa likoloi ho ea ho meralo ea motheo ea 5G.

Bokhoni ba Highleap Electronics ho MCPCB Via Design:

• Ho nepahala ka ho cheka - Ho cheka ka mochini le laser bakeng sa li-microvias le li-arrays tse phahameng haholo
• Ka ho tlatsa litharollo - Copper, epoxy e tletseng silevera, le likhetho tsa resin tse tsamaisang mocheso bakeng sa ts'ebetso e hlophisitsoeng ea mocheso
• Phekolo ea holim'a metsi & plating - ENIG, silevera e qoelisoang, le tente ea mask ea solder ho netefatsa ho ts'epahala le boleng ba kopano
• Tšehetso ea moralo & netefatso ea mocheso - Tšebelisano 'moho mabapi le moralo, ka ho beoa, le papiso ea mocheso ho ntlafatsa phallo ea mocheso

Bakeng sa baenjiniere ba batlang MCPCB e tsoetseng pele ka litharollo tsa meralo, Highleap Electronics e fana ka ts'ehetso ea ho qetela ho tloha mohopolong ho isa tlhahisong, ho netefatsa hore lits'ebetso tsa hau tsa matla a phahameng li fihlella ts'ebetso e tšepahalang ea mocheso ka boleng ba tlhahiso ea litsebi.