Metal Core PCB vs Ceramic PCB | Tataiso ea Ts'ebetso ea Thermal

Selelekela

Lisebelisoa tsa elektroniki tsa sejoale-joale li hloka litharollo tse matla tsa taolo ea mocheso ha sekhahla sa motlakase se ntse se eketseha. Li-LED tse nang le matla a phahameng, liamplifiers tsa RF, le lisebelisoa tsa elektroniki tsa likoloi li hlahisa mocheso o mongata oo liboto tse tloaelehileng tsa FR-4 li ke keng tsa o qhala ka ho lekaneng.

Ha ba kgetha di-PCB tse nang le motlakase o phahameng, baenjiniere hangata ba bapisa PCB ya ceramic le PCB ya mantlha ya tshepe ho netefatsa tshebetso e ntle ya mocheso ha ba ntse ba leka-lekanya ditjeo le bokgoni ba tlhahiso. Kgetho pakeng tsa ditheknoloji tsena tse pedi e ama ka ho toba botshepehi ba sehlahiswa, nako ya tshebetso, le ditjeo tsohle tsa sistimi.

Papiso ena e hlahloba liphapang tsa sebopeho, litšoaneleho tsa mocheso, le ts'ebeliso e sebetsang ea lisebelisoa tsa tšepe tsa mantlha tsa PCB le tsa ceramic PCB ho thusa baenjiniere ho etsa liqeto tse nang le tsebo.

Ho utloisisa Metal Core PCB le Ceramic PCB Structures

Metal Core PCB Kaho

Li-PCB tsa mantlha tsa tšepe (MCPCBs) li sebelisa substrate ea tšepe , hangata aluminium kapa koporo, e le motheo. Sebopeho sa tsona se kenyelletsa mekhahlelo e meraro: motheo oa tšepe o sebetsang joaloka sinki ea mocheso, dielectric e tsamaisang mocheso bakeng sa ho kenya mocheso oa motlakase, le lera la potoloho ea koporo bakeng sa ho kenya likarolo.

Aluminium MCPCBs e tloaelehile bakeng sa tekanyo ea ts'ebetso ea litšenyehelo, ha mefuta e fapaneng ea koporo e fana ka conductivity e phahameng ea mocheso bakeng sa lits'ebetso tse batlang. Lera la dielectric, hangata 50-200 µm e teteaneng le 1-8 W / mK conductivity ea mocheso, hangata e emela botlolo e kholo ea mocheso.

Kaho ea Ceramic PCB

Li-PCB tsa Ceramic li sebelisa li-inorganic substrates tse kang aluminium oxide (Al₂O₃) kapa aluminium nitride (AlN), e fanang ka tšehetso ea mochini le ho tsamaisa mocheso. Metal e ts'oara tlamahano ka kotloloho ho ceramic ka lits'ebetso tse botenya kapa tse tšesaane.

Ho fapana le li-MCPCB, li-ceramics ka tlhaho li kenya motlakase, li tlosa sebopeho sa dielectric le ho fokotsa ho hanyetsa mocheso. Thermal conductivity ranges ho tloha ho 24 W/mK (Al₂O₃) ho isa ho 170 W/mK (AlN), ho etsa hore li-ceramics li loketse lits'ebetso tse batloang haholo ke mocheso.

Papiso ea Sebopeho: Metal Core PCB vs Ceramic PCB

Ts'ebetso ea Thermal: Metal Core PCB vs Ceramic PCB

Mekhoa ea ho Fetola Mocheso ka Metal Core PCB

Li-PCB tsa mantlha tsa tšepe li laola mocheso ka boima ba mocheso ba substrate ea tšepe le ho tsamaisoa ha motlakase ka ho otloloha ka lera la dielectric . Motheo oa aluminium kapa oa koporo o hasanya mocheso ka mahlakoreng pele o fetisetsoa ho pholisong ea kantle. Mokhoa ona o sebetsana ka katleho le matla a motlakase ho fihlela ho 10 W/cm². Litsela tsa bohlokoa tsa mocheso li kenyelletsa:

• Khokahano ea motsoako ho latela mohlala oa koporo - ka lisebelisoa tsa solder kapa tsa mocheso oa mocheso.
• Tsela ea koporo ka dielectric – conduction e otlolohileng ho motheo oa tšepe.
• Motheo oa tšepe ho teba ha mocheso - ho hasana ka mahlakoreng le ho fetisetsa ho pholileng ka ntle.

Mekhoa ea ho Fetola Mocheso ka Ceramic PCB

Li-PCB tsa Ceramic li fihlella ts'ebetso e phahameng ea mocheso ka ho tsamaisa substrate ka kotloloho, ho tlosa botlolo ea mocheso oa dielectric. Li-substrates tsa aluminium nitride tsa boemo bo holimo li khona ho sebetsana le matla a motlakase>50 W/cm² ha li ntse li boloka mocheso o sireletsehileng oa mateano. Melemo e kenyelletsa:

• Ho tsamaisa substrate ka kotloloho – mocheso phalla hang-hang ka thepa ea letsopa.
• Libaka tse fokolang tsa mocheso - meeli e fokolang e fokotsa khanyetso ea cumulative.
• Botsitso bo phahameng ba mocheso - li-ceramics li boloka thepa moo li-dielectric tsa mantlha tsa tšepe li senyang.

Tlhahlobo ea Ts'ebetso ea Bongata

Ho hanyetsa mocheso ho totobatsa phapang ea bohlokoa lipakeng tsa MCPCB le li-PCB tsa ceramic. Li-MCPCB tse tloaelehileng tsa aluminium hangata li bontša khanyetso ea mocheso ho tloha ho 1–3 °C/W bakeng sa li-LED tsa matla, tse lekaneng bakeng sa mabone a mangata a khoebo. Li-substrates tsa Ceramic li fihlella 0.2-0.8 ° C / W, li tšehetsa maqhubu a phahameng a ho khanna le ho sebetsa hantle ho khanyang lits'ebetsong tse phahameng tsa ts'ebetso.

Li-PCB tsa Metal core li rua molemo ho bongata ba mocheso oa aluminium e teteaneng, ho fokotsa likhahla tsa mocheso nakong ea ts'ebetso ea pulsed. Ka lehlakoreng le leng, li-ceramics li arabela ka potlako liphetohong tsa mocheso ka lebaka la mocheso o fokolang o fokolang, e leng se etsang hore e be tse loketseng bakeng sa lisebelisoa tse potlakileng tsa libaesekele tse kang lisebelisoa tsa radar le lasers ea pulsed.

Liphapang tsa Kopo: Metal Core PCB vs Ceramic PCB

Lisebelisoa tsa Metal Core PCB

Li-MCPCB li loketse lits'ebetso tse theko e tlase, tse nang le molumo o phahameng tse nang le litlhoko tse itekanetseng tsa mocheso. Mabone a LED — a meralo, a likoloi le a khoebo — a emela karolo e kholo ka ho fetisisa. Motsoako oa tsona oa ho qhala mocheso ho lekaneng, kopano e bonolo, le litheko tse qothisanang lehlokoa li etsa hore li-MCPCB li be ntle bakeng sa:

• Lisebelisoa tsa mabone a LED - Mabone a seterateng, lisebelisoa tse phahameng tsa indasteri, le li-module tsa likoloi (1-5 W ka LED).
• Elektronike ea ho fetola matla - Lisebelisoa tsa motlakase oa li-switch-mode, li-drive tsa motlakase, le li-inverters tsa letsatsi tse ntšang mocheso ho tsoa ho li-semiconductors.
• Mechini ea motlakase ea bareki - Lichaja tsa betri, liamplifier tsa molumo, le mabone a morao-rao moo litšenyehelo li leng teng.

Matla a mochini a li-substrates tsa tšepe a boetse a mamella ho thothomela le khatello ea mocheso libakeng tsa indasteri.

Lisebelisoa tsa Ceramic PCB

Li-PCB tsa Ceramic li ipabola lits'ebetsong tse hlokang ts'ebetso e phahameng ea mocheso le ts'epo ea nako e telele tlasa maemo a thata. Tahlehelo ea bona e tlase ea dielectric le mocheso o phahameng oa mocheso o tšehetsa RF ea maqhubu a phahameng le lisebelisoa tse phahameng tsa semiconductor. Lisebelisoa tse tloaelehileng li kenyelletsa:

• Li-amplifiers tsa RF - Baseteishene ba liteishene, litsamaiso tsa radar le likhokahano tsa satellite (> 100 W/mK thermal conductivity).
• Sephutheloana sa semiconductor se nang le matla a phahameng - Li-module tsa IGBT, li-laser diode arrays, le mefuta e nyalisitsoeng ea matla moo mocheso o kopanyang o amang bophelo bohle ba sesebelisoa.
• Elektronike tikoloho e feteletseng - Li-avionics tsa Aerospace, li-sensor tsa fatše, le taolo ea ts'ebetso ea indasteri (-55 °C ho ea ho 300 °C).
• Lisebelisoa tsa bongaka tse kentsoeng - Li-pacemaker le li-stimulators tsa neural tse hlokang biocompatibility le ho tiisoa ha hermetic.

Li-ceramics li fana ka ho se sebetse ha lik'hemik'hale, botsitso ba sebopeho, le ts'epahalo ea ts'ebetso ho theosa le mashome a lilemo, e leng se etsang hore e be tse loketseng bakeng sa lisebelisoa tsa elektronike, tsa bongaka le tse tšepahalang haholo.

Melemo le Mefokolo: Metal Core PCB vs Ceramic PCB

Metal Core PCB Matla

Metal core PCBs (MCPCBs) e ipabola ka ho sebetsa hantle ka litšenyehelo le ho ntlafala ha tlhahiso. Mekhoa e tloaelehileng ea tlhahiso ea PCB-ho cheka, ho tsamaisa litsela le ho kopanya-li sebetsa ka mokhoa o fokolang, ho tšehetsa mokhoa oa ho etsa litšoantšo ka potlako le tlhahiso ea molumo o phahameng. Melemo ea bohlokoa e kenyelletsa:

• Tsamaiso ea mocheso ea theko e tlaase - Li-substrates tsa aluminium li bitsa 2–3× FR-4 ha li ntse li fana ka 5–10× ts'ebetso e ntle ea mocheso.
• Mehaho ea motheo e thehiloeng - Boholo ba baetsi ba lihlahisoa ba ka hlahisa li-MCPCB ntle le lisebelisoa tse khethehileng.
• Matla a mechine - Metal substrates e hanela ho fetoha le ho tšehetsa likarolo tse boima.
• Design bocha - Lisebelisoa le melao e tloaelehileng ea CAD e sebetsa ka liphetoho tse fokolang.

Metal Core PCB Meeli

Li-MCPCB lia lekanyetsoa ha motlakase oa dielectric o feta ~8 W/mK kapa mocheso oa ts'ebetso o feta 150 °C. Ho thibela mocheso oa tlhaho ho ka 'na ha senyeha tlas'a mocheso o molelele, e leng se bakang ho arohana ha mocheso kapa ho hloleha ha motlakase. Ho se lumellane ha mocheso ka ho feletseng ho ka baka khatello ea mechine, 'me lera la dielectric le lula e le bothata bo boholo ba mocheso.

Ceramic PCB Matla

Li-PCB tsa Ceramic li fana ka ts'ebetso e ikhethang ea mocheso, ho kenya motlakase, le botsitso ba tikoloho. Li sebetsa ka botšepehi mochesong o phahameng, li boloka botsitso bo boholo, 'me li hanela tlhaselo ea lik'hemik'hale. Melemo e kenyelletsa:

• Superior thermal conductivity - Li-substrates tsa AlN li tsamaisa mocheso ka 20–40 × ho feta likarolo tsa dielectric tsa MCPCB.
• Mocheso o pharaletseng - E ka tšeptjoa ho tloha mocheso oa cryogenic ho fihlela ho 350 ° C.
• Ho kenya motlakase hantle - Matla a dielectric> 10 kV/mm, a loketse lipotoloho tse phahameng haholo.
• Ho tsitsa ha lik'hemik'hale le tikoloho - Ceramic ea inert e hanela kutu, mongobo le tšilafalo.

Meeli ea Ceramic PCB

Li-PCB tsa Ceramic li bitsa chelete e ngata (5–10× MCPCBs), lia fokola, 'me li hloka tlhahiso e khethehileng joalo ka ho phunya laser kapa li-vias tse entsoeng esale pele. Ho rarahana ha tšebetso ho eketsa linako tsa ho etella pele le ho fokotsa palo ea bahlahisi ba tšoanelehang, haholo-holo bakeng sa meralo e rarahaneng ea li-multilayer.

Papiso Summary Table

Moralo oa Khetho bakeng sa Likopo tse Matla a Phahameng

Lintlha tsa Qeto bakeng sa Metal Core PCB vs Ceramic PCB

Ho khetha lipakeng tsa mantlha tsa tšepe le li-PCB tsa ceramic ho ipapisitse le litlhoko tsa mocheso, tekanyetso le lithibelo tsa tlhahiso. Aluminium MCPCBs ka kakaretso e lekane bakeng sa matla a matla a <5 W/cm² le mocheso oa mateano a <125 °C, e leng se etsang hore e be khetho ea kamehla bakeng sa lihlahisoa tsa khoebo. Li-PCB tsa Ceramic lia hlokahala ha matla a matla a feta 10 W/cm², mocheso o sebetsang o feta 150 °C, kapa ho tšepahala ha nako e telele tlas'a libaesekele tse futhumetseng ho bohlokoa. Litikoloho tse thata, li-circuits tsa maqhubu a phahameng, kapa meralo e kopaneng e nang le mohatsela o lekanyelitsoeng le tsona li rua molemo ho boleng bo phahameng ba mocheso le motlakase oa ceramic. Baenjiniere ba lokela ho hlalosa lipehelo tse hlakileng tsa mocheso pele ba etsa qeto ka substrate.

Litšenyehelo tsa Ts'ebetso ea Ts'ebetso

Kakaretso ea litšenyehelo tsa sistimi ha e akarelletse theko ea PCB feela, empa hape le taolo ea mocheso, tlhahiso ea kopano, le ts'epahalo ea tšimo. Li-MCPCB li ka hloka lisinki tse kholoanyane tsa mocheso kapa ho pholisoa ka matla ka matla a phahameng, ho fokotsa litšenyehelo tsa tsona ka mokhoa o itseng.

Li-PCB tsa Ceramic li ka fokotsa sekhahla sa sehlahisoa le ho felisa ho pholisa ho thusang ka lebaka la ts'ebetso e phahameng ea mocheso. Leha ho le joalo, ba hloka ho ts'oaroa ka hloko le tlhahiso e khethehileng, e amang chai le nako ea ho etella pele. Merero e nang le likhakanyo tse thata tsa lichelete kapa kemiso e hatelletsoeng hangata e rata li-MCPCB, athe lits'ebetso tse bohlokoa haholo li lokafatsa matsete a holimo ho theknoloji ea ceramic.

fihlela qeto e

Ho khetha pakeng tsa tšepe ea mantlha PCB le ceramic PCB ho ipapisitse le litlhoko tsa mocheso, tikoloho ea ts'ebetso le tekanyetso. Li-MCPCB li fana ka tsamaiso ea mocheso e theko e tlaase bakeng sa lisebelisoa tsa elektronike tse tloaelehileng tse nang le matla a itekanetseng a matla, ha li-PCB tsa ceramic li ipabola ka ho batla lits'ebetso tse hlokang mocheso o phahameng oa mocheso le botsitso ba tikoloho.

Baenjineri ba lokela ho hlalosa meeli ea mocheso oa mateano le lipehelo tsa matla a matla pele ho nako. Teko ea prototype e ka senola liphapang tse sebetsang, haholo boitšoarong ba sebopeho sa mocheso le ho ts'epahala ha nako e telele, ho tlatsana le mehlala ea tlhahlobo.

Highleap Electronics Thermal PCB bokhoni

Highleap Electronics e fana ka tharollo e felletseng bakeng sa li-PCB tsa tšepe tsa mantlha le tsa ceramic, tse ntlafalitsoeng bakeng sa ts'ebetso ea mocheso:

• Metal core PCB e entsoeng - Meetso ea aluminium le koporo e fihlang ho 8 W/mK bakeng sa mabone a LED, lisebelisoa tsa elektroniki tsa motlakase le lisebelisoa tsa likoloi.
• Tlhahiso ea Ceramic PCB - Li-substrates tsa Al₂O₃ le AlN bakeng sa RF ea matla a phahameng, liphutheloana tsa semiconductor, le lisebelisoa tsa elektroniki tse feteletseng tsa tikoloho.
• Therisano ea moralo oa mocheso - Khetho ea thepa, mohlala oa mocheso, le ntlafatso ea moralo ho fihlela lipehelo tse khethehileng tsa mocheso.
• Kopano e felletseng ea PCB - Litšebeletso tsa ho roala holim'a sefahleho le ho shoa, ho kenyelletsa ts'ebeliso ea lisebelisoa tsa mocheso le tlhahlobo ea netefatso.
• Prototype ho tlhahiso - Ho etsa li-prototyping ka potlako le ho etsoa ka sekhahla ho tloha ho sefofane ho ea ho tlhahiso e phahameng haholo.

Ikopanye le Highleap Electronics ho buisana ka litlhoko tsa hau tsa taolo ea mocheso. Sehlopha sa rona sa boenjiniere se tla khothaletsa tharollo e ntle ka ho fetisisa pakeng tsa motheo oa tšepe le li-PCB tsa ceramic ho netefatsa ts'ebetso e tšepahalang tlas'a maemo a hau a ikhethileng.