Mathata a ho Rala le Litharollo tse Sebetsang bakeng sa 6oz le 10oz Heavy Copper PCBs

Li-PCB tse boima tsa koporo tse nang le litlhophiso tsa PCB ea koporo ea 6oz le li-PCB tsa koporo ea 10oz li fetohile tsa bohlokoa lits'ebetsong tse nang le matla a maholo ho kenyeletsoa litsamaiso tsa taolo ea likoloi tsa motlakase, li-module tsa motlakase tsa indasteri, le lipotoloho tsa bakhanni ba LED tse nang le matla a phahameng. Ho fapana le liboto tse tloaelehileng tsa botenya ba koporo (hangata 1oz), meralo ena ea PCB e boima ea koporo e tlameha ho sebetsana le meroalo e phahameng haholo ea matla a hona joale ha e ntse e boloka botsitso ba sebopeho le ts'ebetso ea mocheso.

Ho etsoa le ho qaptjoa ha liboto tsa koporo tse teteaneng haholo ho hlahisa liphephetso tse ikhethang tsa boenjiniere tse hlokang tsebo e khethehileng mabapi le boitšoaro ba lintho tse bonahalang, mekhoa ea ho etsa lintho le mekhoa ea ho kopanya.

Liqholotso tsa Moralo oa li-PCB tse boima tsa Koporo

1. Latisa Bophara le Meeli ea Sebaka ho 6oz le 10oz Copper PCB

Meralo e boima ea koporo ea PCB e beha litlhoko tse thata ho bonyane ba bophara ba trace le sebaka ka lebaka la botenya bo eketsehileng ba koporo. Ha ba rala litsela tse tsamaisang hajoale bakeng sa lits'ebetso tsa 6oz tsa koporo ea PCB, baenjiniere ba tlameha ho ikarabella bakeng sa ts'ebetso ea motlakase le lithibelo tsa tlhahiso. Ts'ebetso ea etching bakeng sa koporo e teteaneng e etsa li-angles tse ka holimo ho mahlakoreng, e hlokang sebaka se pharaletseng pakeng tsa mesaletsa ha e bapisoa le boima bo tloaelehileng ba koporo ho thibela lifupi le ho netefatsa lihlahisoa tse tšepahalang tsa tlhahiso.

Lipalo tsa bokhoni ba ho jara hona joale li tlameha ho nahana ka tahlehelo ea I²R, e leng se bohlokoa haholo litseleng tse nang le motlakase o phahameng. Mohlala, trace ea koporo ea 10oz PCB e nang le li-ampere tse 50 e hloka bophara ba lisenthimithara tse ka bang 0.5 (12.7mm) ho boloka mocheso o nyoloha ka 10°C, ha e bapisoa le lisenthimithara tse 1.5 (38mm) bakeng sa koporo ea 1oz. Baqapi ba lokela ho sebelisa mekhoa ea IPC-2221 kapa lisebelisoa tse netefalitsoeng tsa lipalo ho fumana litekanyo tse sireletsehileng tsa trace tse thibelang ho futhumatsa ho feteletseng ha li ntse li fihlela lithibelo tsa sebaka.

2. Lamination le Layer Stack-up Mathata

Ts'ebetso ea lamination bakeng sa kaho ea PCB ea koporo ea 10oz e hlahisa liphephetso tse kholo tse amanang le ho bata ha boto le ho khomarela lera. Mekhahlelo e metenya ea koporo e theha kabo e sa lekanang ea khatello nakong ea potoloho ea khatello, e lebisang ho hloleheng ho ka bang teng ka seqha, ho sotha le delamination. Coefficient ea ho se lumellane ha katoloso ea mocheso pakeng tsa koporo (17 ppm/°C) le FR-4 dielectric materials (14-17 ppm/°C ka tataiso ea XY) e mpefatsa mathata ana nakong ea mocheso oa libaesekele.

Kabo ea koporo e lekanang ho pholletsa le pokello ea lera e ipaka e le ea bohlokoa bakeng sa ho fokotsa ho oa ha leqephe tlhahisong e boima ea PCB ea koporo. Ha lehlakore le leng le na le koporo e ngata haholo ho feta le leng, matla a katoloso a phapang a baka phetoho e sa feleng ea boto. Moralo o nepahetseng oa pokello o hloka lipaterone tsa koporo tse nang le setšoantšo sa seipone holim'a libaka tse fapaneng neng kapa neng ha ho khoneha, ho leka-lekanya kabo ea boima ba koporo ho theha axis ea mechini e sa nke lehlakore.

3. Solderability le Mathata a Kopano

Boima ba mocheso oa koporo e teteaneng bo hlahisa mathata a bohlokoa a ho rekisoa nakong ea kopano ea likarolo ho meralo ea koporo ea 6oz PCB. Litlaleho tse tloaelehileng tsa reflow tse entsoeng bakeng sa mapolanka a koporo a 1oz li bontša hore ha li lekane hobane liphaephe tse boima tsa koporo li sebetsa joaloka licheso tsa mocheso, li thibela solder ho fihla mocheso o qhibilihisang (ka tloaelo 183 ° C bakeng sa SnPb kapa 217 ° C bakeng sa SAC305). Sena se fella ka manonyeletso a batang a solder, ho kolobisa ho sa lekaneng, le likhokahano tsa motlakase tse sa tšepahaleng.

Khetho ea ho qeta bokaholimo e ama ka kotloloho litheko tsa katleho ea kopano libotong tse boima tsa koporo. Liphetho tse sebetsang ka ho fetesisa bakeng sa likopano tsa 6oz le 10oz tsa koporo tsa PCB li kenyelletsa:

• ENIG (Electroless Nickel Immersion Gold) - E fana ka solderability e ntle haholo ebile e mamella lipotoloho tse ngata tsa reflow ntle le ho senyeha.
• Silivera ea ho qoelisoa - E fana ka botsitso bo botle ba mocheso le tšireletso e theko e tlaase bakeng sa libaka tse boima tsa koporo.
• HASL (Hot Air Solder Leveling) - E fana ka koae e matla ea solder empa e hloka taolo e hlokolosi ka lebaka la likotsi tsa ts'oaetso ea mocheso holim'a koporo e teteaneng.
• OSP (Organic Solderability Preservative) - E fana ka khetho ea theko e tlase haholo empa e hloka taolo e thata ea ts'ebetso le bophelo bo fokolang ba shelofo.

4. Litlhoko tsa Tsamaiso ea Mocheso

Leha botenya bo eketsehileng ba koporo meralong e boima ea PCB ea koporo bo eketsa ho tsamaisoa ha mocheso (koporo: 400 W/m·K), ha e rarolle mathata a taolo ea mocheso ka bohona . Ho hlahisoa ha mocheso ho tsepamisa maikutlo likarolong tsa motlakase le mesaletsa ea motlakase o phahameng, ho hloka moralo oa tsela ea mocheso o reriloeng ho aba mocheso ka katleho ho pholletsa le sebopeho sa boto.

Thermal ka li-arrays tse behiloeng ka mokhoa o hlophisitsoeng ka tlas'a lisebelisoa tsa matla li fana ka litsela tsa bohlokoa tsa ho fetisa mocheso ka meralo ea 6oz le 10oz koporo ea PCB. Palo ea ho hanyetsa mocheso e ipapisitse le bophara, bongata le botenya ba plating. Ka mohlala, 12 mil e le 'ngoe (0.3mm) ka 1 mil plating e na le hoo e ka bang 70 ° C/W ea ho hanyetsa mocheso, e hlokang 10-15 vias ka mokoloko ho finyella mocheso o sebetsang hantle bakeng sa likarolo tse senyang li-watts tse 5-10.

Litharollo tse Sebetsang tsa 6oz le 10oz Copper PCB Design

1. Optimized Stack-up le Copper Distribution

Ho kenya ts'ebetsong litlhophiso tsa symmetric layer ho fokotsa khatello ea kelello ea mochine le warpage ho etsoa ha PCB e boima ea koporo. Ha ho etsoa boto ea mekato e tšeletseng e nang le koporo ea 6oz holim'a likarolo tse ka ntle, litekanyo tsa koporo tse ka hare li lokela ho leka-lekana ho etsa hore ho se ke ha e-ba le lehlakore la axis. Mohlala, tlhophiso e sebelisang 6oz-1oz-1oz-1oz-1oz-6oz e tsamaisa matla a katoloso ka ho lekana nakong ea lipotoloho tsa mocheso, e boloka botsitso ba boto nakong eohle ea bophelo ba tlhahiso le ts'ebetso.

2. Latisisa Bophara le Ntlafatso ea Bokhoni ba Hona Joale

Palo e nepahetseng ea bophara ba trace bakeng sa lits'ebetso tsa koporo e boima e hloka ho nahanoa ka mocheso o tikolohong, ho phahama ho amohelehang ha mocheso, le thepa ea koporo ea mocheso oa koporo. Mehaho e sebetsang ea moralo bakeng sa litsela tsa hajoale tsa 10oz koporo ea PCB e kenyelletsa:

• Mesaletsa e phahameng ea hona joale - Sebelisa bonyane bophara ba lisenthimithara tse 0.3-0.5 bakeng sa maqhubu a fetang 30 amperes ho boloka mocheso o bolokehileng oa ts'ebetso.
• Tsela e bapileng - Abela meroalo ho li-conductor tse ngata ha sebaka se lumela, ho fokotsa khatello ea maikutlo ka 40-60%.
• Likhutlo tse kobehileng - Fetola li-angles tsa 90-degree ka 45-degree kapa mesaletsa e kobehileng ho fokotsa litlamorao tse teng hona joale tsa ho petetsa.
• Sebaka se lekaneng - Boloka bonyane li-inch tsa 0.020-0.030 lipakeng tsa likarolo tse boima tsa koporo ho netefatsa tlhahiso e tšepahalang.

3. Taolo e ntlafalitsoeng ea Soldering Process for Heavy Copper PCB

Ho ntlafatsa li-profiles tsa reflow ka ho khetheha bakeng sa likopano tse boima tsa koporo ho netefatsa sebopeho se kopaneng sa solder ho 6oz le 10oz meralo ea koporo ea PCB. Libaka tse atolositsoeng tsa preheat (metsotsoana ea 150-180 ho 150-180 ° C) li lumella ho lekana ha mocheso butle-butle ho pholletsa le likarolo tse teteaneng tsa koporo pele ho fihla mocheso o phahameng oa phallo. Nako e ka holimo ea liquidus e lokela ho atolosoa ka 20-30% ha e bapisoa le litlaleho tse tloaelehileng, hangata metsotsoana e 60-90 ho e-na le metsotsoana e 40-60.

Liphetoho tsa pad geometry li ntlafatsa litšobotsi tsa ho fetisa mocheso nakong ea mekhoa ea kopano. Ho holisa libaka tsa marang-rang ka 15-25% ho feta litlhoko tse fokolang tsa likarolo ho eketsa ho kopana le bokaholimo ba solder, ho ntlafatsa boitšoaro ba ho kolobisa. Ho beoa ka leano la li-spokes tsa liphallelo (hangata li-spokes tse 4 ka bophara ba lisenthimithara tse 0.015-0.020) tse kopanyang lipampiri ho koporo li tšela litlhoko tsa kopano le ts'ebetso ea mocheso o sebetsang.

4. Lamination Lamination Processing

Mekhoa ea mohato oa ho lamination e sebetsana le mathata a ikhethang a ho hatella lihlopha tse boima tsa koporo ka ho haha ​​​​mohaho oa boto butle-butle ho e-na le potoloho e le 'ngoe ea khatiso. Bakeng sa tlhahiso ea koporo ea 10oz ea PCB, bahlahisi ba atisa ho hatisa likarolo tse ka ntle pele ka li-cores, ebe ba eketsa likarolo tse setseng mesebetsing ea khatiso e latelang. Mokhoa ona o lumella taolo e ntle ea ho phalla ha resin le ho fokotsa likotsi tsa moea tse koaletsoeng pakeng tsa likarolo tse teteaneng tsa koporo le lisebelisoa tsa prepreg.

Liphetoho tsa boemo ba mocheso le khatello li lumellana le phapang ea matla a mocheso lisebelisoa tse teteaneng tsa koporo. Liphetoho tse tloaelehileng tsa khatiso li fetela ho metsotso ea 90-120 ho 170-180 ° C ka likhatello tse tsoang ho 300-400 PSI, ha li bapisoa le metsotso ea 60-90 ho 150-170 ° C bakeng sa mapolanka a tloaelehileng. Vacuum-assisted lamination e tlosa likhase tse qabeletsoeng ka mokhoa o atlehileng haholoanyane meahong ea koporo e boima moo khatello e tloaelehileng ea sepakapaka e ka 'nang ea bonahala e sa lekana.

5. Leano le Feletseng la Tsamaiso ea Mocheso

Ho lekanya boima ba koporo ho pholletsa le mekhahlelo ho ntlafatsa tshebetso ya mocheso le bokgoni ba tlhahiso meralong ya PCB ya koporo e boima . Ho sebedisa koporo ya 10oz hodima mekhahlelo e ka ntle bakeng sa bokgoni bo phahameng ba hona jwale ha o ntse o fetohela ho boima ba 4oz kapa 2oz hodima mekhahlelo e ka hare ho lekanya ditlhoko tsa tshebetso le diphephetso tsa lamination. Mokgwa ona o kopantsweng o boloka ditsela tsa bohlokwa tsa hona jwale ha o ntse o fokotsa botenya ba boto ka kakaretso le ho rarahana ha tlhahiso.

Ho tšela koporo e tiileng holim'a likarolo tse ka ntle ho sebetsa e le li-spreaders tse sebetsang hantle tsa mocheso ha li hokahane hantle le lifofane tse boima tsa ka hare tsa koporo ka ho lekana ka meaho. Lintlha tsa moralo oa thermal li kenyelletsa:

• Ka sebaka - Beha li-vias tsa mocheso ho 0.050-0.080 lisenthimithara tse bohareng ho isa bohareng bakeng sa sebaka se lekaneng sa mocheso o hasang ka tlas'a likarolo tsa matla.
• E tlatsitsoe ka tsela - Sebelisa li-vias tse tletseng koporo le tse koaletsoeng ho felisa likheo tsa moea le ho fokotsa ho hanyetsa mocheso ka 30-40% ha ho bapisoa le li-vias tse sa tlatsoang.
• Mekhoa ea liphallelo tsa mocheso - Ho leka-lekanya pakeng tsa matla a mochine (4 spokes bonyane) le ts'ebetso ea mocheso (bophara bo builoeng ke 0.020-0.030 inches).

fihlela qeto e

Ho rala le ho etsa ka katleho PCB ea koporo ea 6oz le lihlahisoa tsa PCB tsa koporo tsa 10oz ho hloka kutloisiso e felletseng ea boitšoaro ba lintho tse bonahalang, litšitiso tsa masela, le litlhoko tsa kopano tse ikhethileng meahong e boima ea koporo. Mathata a mantlha a kenyeletsang mefokolo ea bophara ba ho latela, ho rarahana ha lamination, ho ameha ka solderability, le litlhoko tsa taolo ea mocheso li ka rarolloa ka mokhoa o hlophisitsoeng ka maano a netefalitsoeng a moralo le taolo ea ts'ebetso ea tlhahiso.

Hobaneng o lokela ho kgetha Highleap Electronics bakeng sa tlhahiso ya PCB ya koporo e boima ? Bokgoni ba rona bo kenyeletsa:

• Theknoloji e tsoetseng pele ea tlhahiso - Thepa e khethehileng ea lamination le taolo ea ts'ebetso bakeng sa tlhahiso ea 6oz ho isa ho 10oz koporo ea PCB e nang le warpage e fokolang.
• Tšehetso ea boenjiniere ba moralo - Litšebeletso tse felletseng tsa tlhahlobo ea DFM ho ntlafatsa meralo ea koporo e boima bakeng sa tlhahiso le ts'ebetso pele tlhahiso e qala.
• Netefaletso ea boleng - Li-protocol tse matla tsa ho palama libaesekele, ho arola likarolo, le liteko tsa motlakase li netefatsa ts'epahalo lits'ebetsong tsa matla a phahameng.
• Tsebo ea kopano - Li-profiles tse ntlafalitsoeng le lits'ebetso tse ikhethileng tsa solder tse etselitsoeng kopano e teteaneng ea koporo.

Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka litlhoko tsa hau tsa PCB tsa koporo e boima le ho fumana tataiso ea litsebi mabapi le ntlafatso ea moralo bakeng sa lits'ebetso tsa hau tse matla haholo.