Likopo tsa Copper Coin PCB ka Semiconductor Packaging le Test Boards

Selelekela: Hobaneng ha Tsamaiso ea Thermal e le Taba ho Liboto tsa Semiconductor

Mesebetsi ea ho paka le ho etsa liteko tsa semiconductor e tobane le liphephetso tse ntseng li eketseha tsa mocheso ha matla a motlakase a ntse a eketseha. Nakong ea liteko tsa ho chesa le ts'ebetso ea lisebelisoa tsa liteko tse iketsang (ATE), lisebelisoa li feta potolohong ea motlakase e tsoelang pele ha li ntse li boloka litlhoko tse nepahetseng tsa ho kopana le motlakase. Mekhoa ea setso ea taolo ea mocheso, ho kenyeletsoa le likarolo tse teteaneng tsa koporo le li-PCB tsa tšepe, hangata lia fokola ha ho sebetsanoa le libaka tse chesang tse fumanehang ka tlas'a libaka tse chesang tse nang le matla a maholo.

Lisebelisoa tsa PCB tsa koporo li hlahile e le tharollo e tsoetseng pele bakeng sa ntlafatso e lebisitsoeng ea mocheso. Ka ho kenya li-blocks tse tiileng tsa koporo ka ho toba ka tlas'a likarolo tse hlahisang mocheso, theknoloji ena e etsa litsela tse sebetsang hantle tsa mocheso tse otlolohileng ho feta mekhoa e tloaelehileng ea ho hasana ka mahlakoreng.

Kakaretso ea Copper Coin PCB Technology

Sebopeho le Ts'ebetso ea Thermal

Sebopeho sa PCB se kentsweng ka tjhelete ya koporo se kopanya di-slugs tse tiileng tsa koporo ka hara boto e bokellaneng dibakeng tsa mocheso wa mawa. Dikarolo tsena tsa PCB tse nang le tsamaiso e phahameng ya motlakase di theha diphaephe tse otlolohileng tsa mocheso ho tloha hodima dibaka tse kentsweng ka dikarolo ho ya ho dikarolo tse qhalang mocheso kapa dipoleiti tsa motheo tsa tshepe. Koporo e kentsweng hangata e tloha ho 1mm ho isa ho 3mm ka botenya, ka tsamaiso ya mocheso ya 390 W/m·K ha e bapiswa le 0.3 W/m·K ya FR-4.

Melemo Ho Feta Litharollo Tse Tloaelehileng tsa Thermal

Moaho ona o fapane haholo le li-PCB tsa tšepe tsa mantlha, tse tsamaisang mocheso ka thoko ho karolo eohle ea motheo ea aluminium. Lits'ebetso tsa PCB tsa tšepe tsa koporo li shebana le ts'ebetso ea mocheso hantle moo ho hlokahalang, ho boloka sebopeho se feto-fetohang libakeng tseo e seng tsa bohlokoa ha li ntse li fihlella ho ntšoa ha mocheso o phahameng oa lehae. The planar surface topology e boloka ho lumellana le mekhoa e tloaelehileng ea kopano ea SMT ntle le liphephetso tsa sebopeho sa mocheso tse tloaelehileng meralong ea MCPCB.

Likopo tsa PCB tsa Copper Coin ho Teko ea Semiconductor

Makala a mantlha a Kopo

Theknoloji ea PCB ea tšepe ea koporo e sebeletsa libaka tse tharo tsa bohlokoa tsa semiconductor:

• Laola liboto tsa litsamaiso tsa ATE - Liteko tsa morao-rao tse phahameng li hlahisa mocheso o matla ho li-sockets tsa lisebelisoa tse hlokang ho ntšoa ha mocheso o lebisitsoeng.
• Liboto tse cheleng - Teko e atolositsoeng ea ts'epo e hloka botsitso bo tsitsitseng ba mocheso libakeng tse ngata tsa lisebelisoa bakeng sa potoloho ea liteko tsa lihora tse 1000+.
• Liphutheloana tsa liphutheloana le li-module tsa matla - Sehokelo sa Direct chip bakeng sa lisebelisoa tsa SiC le GaN se hloka ts'ebetso ea mocheso e atamelang li-substrates tsa DBC.

Li-platform tsena li arolelana litlhoko tse tšoanang: matla a tsitsitseng a matla a fetang 50 W/cm², mocheso oa ho sebetsa ho tloha -40°C ho ea ho 150°C, le botsitso ba sebopeho tlas'a baesekele e futhumetseng.

Koporo Coin PCB ka Load Board Likopo

Tsamaiso ea Thermal ho Socket Interface

Liboto tsa mojaro tsa ATE li na le phallo e matla ea mocheso ka kotloloho tlas'a li-socket tsa lisebelisoa, moo lipalo tse phahameng tsa li-pin le maqhubu a liteko a hlahisang meroalo e meholo ea mocheso. Chelete ea tšepe ea koporo bakeng sa boto ea mojaro e rala libaka tse kentsoeng tsa koporo ka tatellano e nepahetseng le mehato ea li-socket, e leng se etsang litsela tse otlolohileng tsa mocheso tse fetang thepa ea laminate e nang le motlakase o tlase.

Tsela ena e tobileng ea mocheso e fokotsa mocheso oa mateano ka 15 ° C ho 25 ° C ha e bapisoa le mehaho e tloaelehileng ea FR-4 e nang le likarolo tse boima tsa koporo. Lithempereichara tse tlase tsa ts'ebetso li ntlafatsa botsitso ba khokahano ea motlakase lihokelong tsa nako ea selemo le ho lelefatsa bophelo ba mochini oa socket ka ho fokotsa khatello ea mocheso.

Litlhoko tse nepahetseng tsa moralo

Lits'ebetso tse atlehileng tsa PCB tsa koporo sethaleng sa ATE li hloka ho nepahala ha maemo ka har'a ± 50μm ea socket centerlines. Thermal modelling e tataisa boholo ba koporo ho tsamaisana le moroalo o lebelletsoeng oa mocheso, hangata e lekanya koporo e kentsoeng ka 2mm ho isa ho 5mm e kholo ho feta kemiso ea sokete. Mokhoa ona o tšoara litlamorao tsa ho hasana ha mocheso ha o ntse o qoba ho kena-kenana le likanale tse potolohileng tse tsamaisang mats'oao.

Koporo Coin PCB ho Chesoa-ka le ho Tšepahala Testing

Mocheso o Tšoanang Tekong e Atolositsoeng

Ts'ebetso ea ho chesa mocheso o phahameng e hloka kabo e tsitsitseng ea mocheso libakeng tse ngata tsa lisebelisoa ka lihora tse makholo kapa tse likete. Meralo ea boto ea ho chesa chelete ea tšepe ea koporo e kenyelletsa bongata ba mocheso ka tlas'a sebaka se seng le se seng sa sesebelisoa, e leng se etsang litsela tse tšoanang tsa ho ntša mocheso tse thibelang ho phahama ha mocheso lipakeng tsa libaka tsa liteko. Ho tšoana hona ho netefatsa hore lisebelisoa tsohle li ba le maemo a lekanang a khatello, ho netefatsa ho nepahala ha data ea ts'epo.

Mohaho o kentsoeng oa koporo o boetse o fokotsa ntoa ea boto nakong ea libaesekele tse futhumetseng. Ka ho tiisa sebopeho sa laminate ka tekanyo ea botenya, lichelete tsa tšepe tsa koporo li fokotsa ho senyeha ha sefofane ho ka senyang khatello ea socket nakong ea tatellano ea liteko.

Botsitso ba Mechini ea Nako e telele

Mehaho ea PCB e sebetsang ka mocheso e sebelisang theknoloji ea tšepe ea koporo e bonts'a ts'epahalo e holimo ea solder litekong tsa libaesekele tsa mocheso. Theko e fokotsehileng ea ho tsamaea ha mocheso libakeng tse kopanang le likaroloana e fokotsa ho bokellana ha mokhathala likhokahanong. Tlhahlobo ea likarolo tse fapaneng ka mor'a lipotoloho tsa mocheso oa 1000 ho tloha ho -40 ° C ho ea ho 125 ° C e bonts'a kholo e fokolang ea intermetallic le ho ata ha sekhahla ha ho bapisoa le mehaho e tloaelehileng ea boto.

Copper Coin PCB Applications in Power Module Design

Kopanyo ea Wide-Bandgap Semiconductor

Kantle ho lits'ebetso tsa boto ea liteko, chelete ea koporo bakeng sa ts'ebetso ea module ea motlakase e tšehetsa khokahano ea die e tobileng ka har'a liphutheloana tsa silicon carbide le gallium nitride. Lisebelisoa tsena li hlahisa li-flux tse feteletseng tsa mocheso tse sebakeng se le seng tse fetang 200 W/cm² tse phephetsang bokhoni ba setso ba mocheso oa substrate ea tlhaho. Li-mass tsa koporo tse kenelletseng li fana ka conductivity ea mocheso e atamelang li-substrate tsa DBC ha li ntse li boloka ho lumellana ha ts'ebetso ea PCB ea tlhaho le melemo ea litšenyehelo.

Likopo ho Power Electronics

Lisebelisoa tsena tsa tšepe tsa koporo tsa PCB li sebeletsa li-converter tsa DC-DC, balaoli ba makoloi, le li-module tsa kabo ea matla moo ho hanyetsa mocheso ho amang katleho le matla a matla ka kotloloho:

• Tsela e tobileng ea mocheso - Koporo e kentsoeng e theha sub-2°C/W junction-to-case thermal resistance bakeng sa boholo bo tloaelehileng ba ho shoa ha matla.
• Ho kopanya ho boloka chelete - E felisa likarolo tse arohaneng tsa mocheso oa mocheso ha o ntse o fokotsa likarolo tsa mocheso oa mocheso.
• Ho lumellana ha kopano - E boloka mekhoa e tloaelehileng ea ho phalla le ho kopanya mohala ntle le litlhoko tse khethehileng tsa lisebelisoa.

Mehopolo ea Moralo le Ts'ebetso ea Copper Coin PCB

Taolo ea Ts'ebetso ea Boqapi

Ho etsa meralo ea PCB ea koporo e kentsoeng ho hloka hore ho be le siloa se nepahetseng hantle sa mokoti ho amohela ho kenya koporo, ho lateloe ke ho tlatsa resin ho fihlela tsoelo-pele ea laminate. Ts'ebetso ea planarization e tlosa resin e feteletseng le koporo, e etsa sebaka se bataletseng bakeng sa ho haha ​​​​laminate e latelang. Mamello ea boreleli ba ± 25μm e netefatsa ngoliso e tšepahalang ea lera-to-layer le ho thibela delamination nakong ea maeto a futhumetseng.

Lisebelisoa tsa ho tlatsa resin li hloka li-coefficients tsa katoloso ea mocheso tse tsamaellanang le koporo le FR-4 ho thibela ho bokellana ha khatello ea maikutlo. Li-epoxy formulations tse nang le 50 ho 70 ppm/°C CTE le likhalase tsa phetoho ea likhalase ka holimo ho 170 ° C li fana ka botsitso bo hlokahalang ba mochine.

Thermal Via Integration

Lisebelisoa tsa PCB tsa tšepe tsa koporo li fumana katleho ha li kopantsoe le mocheso o phahameng haholo ka lihlopha tse potolohileng koporo e kentsoeng. Li-vias tsena li atolosa tsela ea mocheso ho ea ho likarolo tsa tšepe tse ka ntle kapa libaka tsa ho senya mocheso. Ka bophara ba 0.3mm ho isa ho 0.5mm ka mats'oao a 9 ho isa ho 16 vias per square centimeter ho ntlafatsa ho hasana ha mocheso ha u ntse u boloka likanale tsa litsela.

Ho Tšepahala le Liteko Maikutlo

Liprothokhole tsa netefatso

Likopo tsa PCB tsa koporo li etsa liteko tse matla tsa ho fumana mangolo ho latela maemo a ts'ebetso a IPC-6012 Sehlopha sa 3 le IPC-9701. Ho palama libaesekele tse chesang pakeng tsa mocheso o feteletseng ho netefatsa botšepehi ba sebopeho, ka litlaleho tse tloaelehileng tsa liteko tse etsang li-cycle tse 500 ho isa ho tse 1000 tse nang le metsotso e 15 ea bolulo ho -40 ° C le 125 ° C.

Microscopy ea likarolo tse fapaneng ka nako ea potoloho e lekola ho khomarela ha koporo-resin le ka botšepehi ba moqomo. Teko ea matla a lekhapetla e lekanya hore laminate e khomaretse likhokahano tsa tšepe ea koporo, ka mokhoa oa ho amohela ka tloaelo o fetang 1.4 N/mm bakeng sa li-bond tsa lesela le ka hare.

Netefatso ea Ts'ebetso ea Mocheso

Sebopeho sa Thermal se sebelisa papiso le netefatso ea matla. Finite Element analysis e bolela esale pele kabo ea mocheso tlas'a matla a matla a boletsoeng, athe infrared thermography le thermocouples tse kentsoeng li netefatsa ts'ebetso ea 'nete. Mehaho ea PCB e kentsoeng hantle ea koporo e bonts'a phokotso ea ho hanyetsa mocheso ho tloha ho 40% ho isa ho 60% ha e bapisoa le meralo ea boto e boima ea koporo.

Qetello: Ho Atolosa Moeli oa Tšepahalang ea Thermal

Lisebelisoa tsa PCB tsa tšepe tsa koporo li rarolla mathata a mocheso a tobaneng le liphutheloana le liteko tsa semiconductor. Ka ho theha litsela tsa ho tsamaisa mocheso ka kotloloho, li ntlafatsa ts'ebetso ea mocheso sebakeng sa heno, li boloka botsitso ba mochini nakong ea libaesekele tse futhumetseng, 'me li netefatsa polane ea holim'a lihokelo tse phahameng haholo. Ha matla a matla le litlhoko tsa liteko li ntse li phahama, litharollo tsa koporo tse kentsoeng li fetohile sesebelisoa sa bohlokoa sa ho ts'epahala ha mocheso lits'ebetsong tse tsoetseng pele tsa semiconductor.

Highleap Electronics e ikhethile ka ho etsa PCB ea lichelete tsa koporo tse nepahetseng bakeng sa liphutheloana tsa semiconductor le liboto tsa liteko. Ka taolo e tsoetseng pele ea ts'ebetso le litekanyetso tse tiileng tsa boleng, re thusa baenjiniere ho fihlela taolo e tšepahalang ea mocheso le ts'ebetso ea nako e telele lits'ebetsong tsa elektroniki tse batloang haholo.