PCB ea Copper Coin bakeng sa Li-Modules tsa Matla: Tharollo ea Tsamaiso ea Thermal

Mathata a ntseng a eketseha a Thermal Module PCBs Design

Di-module tsa motlakase tsa semiconductor tse sebedisang mahlale a IGBT, SiC, le GaN e se e le dikarolo tsa bohlokwa dikoloing tsa motlakase, di-inverter tsa diindasteri, le phepelo ya motlakase e sebetsang hantle haholo. Ha maqhubu a ho fetola a ntse a eketseha mme matla a ntse a eketseha, di-substrate tsa setso tse kang PCB ya tshepe le koporo e kopantsweng ka kotloloho di thatafallwa ke ho laola mocheso ka katleho. Dithempereichara tsa dikgokelo di ka feta meedi e bolokehileng, tsa beha tshepahalo ya sesebediswa kotsing le ho kgutsufatsa nako ya tshebetso.

Bothata ba mantlha bo ho thehoeng ha litsela tse sebetsang hantle tsa ho ntša mocheso ho tloha ho die tsa semiconductor ho ea tsamaisong ea ho pholisa ea kantle. Liboto tse tloaelehileng tse thehiloeng ho FR4 li fana ka conductivity e sa lekaneng ea mocheso, ha li-substrate tsa ceramic tse kang DBC li fana ka ts'ebetso e ntle ka theko e phahameng le ho rarahana ha tlhahiso. Theknoloji ea PCB ea tšepe ea koporo e sebetsana le sekheo sena ka ho kenya li-vias tsa mocheso tse nang le conductivity e phahameng tse fumanehang sebakeng seo ka kotloloho tlas'a lisebelisoa tsa motlakase, ho theha liteishene tse sebetsang hantle tsa mocheso o otlolohileng ka har'a meaho e tloaelehileng ea PCB.

Litlhoko tsa Moralo oa Mocheso oa li-PCB tsa Mojule oa Matla

Tsela ea Phallo ea Mocheso ka Li-Module tsa Matla

Meralo ea li-PCB tsa mojule oa motlakase e qhala mocheso tseleng e hlalositsoeng: khokahano ea semiconductor ho isa lera le hokelang, substrate, baseplate, 'me qetellong ho heatsink. Sebopeho se seng le se seng se thusa ho hanyetsa mocheso, 'me lera la substrate hangata le emela bothata bo boholo. Bakeng sa lits'ebetso tsa IGBT PCB le SiC power PCB, ho fokotsa khanyetso ena ho bohlokoa ho boloka mocheso oa khokahano ka har'a libaka tse sireletsehileng tsa ts'ebetso.

Litlhoko tsa Matla a Phahameng a Matla

Lisebelisoa tsa SiC le GaN li sebetsa ka li-voltage tse phahameng le maqhubu ho feta li-IGBT tsa silicon, e leng se bakang phallo e matla ea mocheso libakeng tse nyane tse shoang. Bophahamo ba mocheso oa mocheso bo ka fihla ho 100-300 W/cm², tse hlokang li-substrates tse nang le conductivity e phahameng ea mocheso le botsitso ba mochini. Lisebelisoa tsa setso tsa PCB ha li khone ho sebetsana le maemo ana ntle le ho ipeha kotsing ea delamination kapa ho baleha mocheso.

Litekanyetso tse Bohlokoa tsa Ts'ebetso ea Substrate

Meralo ea li-PCB tsa module ea matla e tlameha ho khotsofatsa litlhoko tse tharo tsa mantlha:

• Ho hanyetsa mocheso o tlase - Ts'ebetso e sebetsang ea mocheso ho tloha lisebelisoa tse sebetsang ho ea ho litsamaiso tse pholileng
• Botsitso bo phahameng ba mechine - Ho mamella khatello ea libaesekele tse futhumatsang le ho sisinyeha
• Motlakase o ka tšeptjoang - Ho thibela karohano lipakeng tsa mesaletsa ea matla a phahameng

Theknoloji ea PCB ea tšepe ea koporo e kopana le litlhoko tsena ka ho kopanya boima ba koporo ea lehae ka thepa e tloaelehileng ea dielectric.

Sebopeho sa PCB ea Copper Coin bakeng sa Likopo tsa Module oa Matla

Mehaho ea Chelete ea Koporo e Kenyelitsoeng

PCB ea tšepe ea koporo e sebelisa lisilindara tse teteaneng tsa koporo kapa liboloko tse kentsoeng ka har'a sebopeho sa boto , tse behiloeng ka kotloloho tlas'a lisebelisoa tsa semiconductor tsa motlakase. Ho na le mekhoa e meraro ea tlhahiso: lichelete tsa tšepe tse lekanang ka khatello tse kentsoeng ka har'a masoba a mochini o nepahetseng, lichelete tsa tšepe tse kentsoeng ka botlalo tse koahetsoeng ka lesela nakong ea tlhahiso ea boto, le mehaho e ka hare moo lichelete tsa tšepe li etsang karolo ea stack ea lera le ka hare. Mokhoa o mong le o mong o theha tsela ea mocheso e sa hanyetseng haholo ho tloha karolong ho ea ho heatsink.

Thermal Conductivity Ntlafatso

Mekhoa e tloaelehileng ea koporo ea PCB e tsamaisa mocheso ka lehlakoreng le leng ka phetisetso e lekantsoeng ea mocheso o otlolohileng ka likarolo tse tšesaane tsa dielectric. Lichelete tsa tšepe tsa koporo li theha likanale tse emeng tse otlolohileng tse nang le libaka tse fapaneng tse tsamaellanang kapa tse fetang semiconductor footprint. Ts'ebetso ena e tsepamisitsoeng ea mocheso e fokotsa khanyetso ea mocheso ho ea ho nyeoe ka 40-60% ha e bapisoa le meaho e tloaelehileng ea MCPCB, e leng ho nolofalletsang hore ho be le sekhahla se phahameng sa hona joale likopanong tsa motlakase tsa PCBs.

Papiso ea Sebopeho le Li-substrate tsa Setso

Liboto tsa FR4 li itšetlehile ka likarolo tse tšesaane tsa koporo tse arohaneng ke epoxy resin e tlaase-conductivity, ho theha khanyetso e phahameng ea mocheso. MCPCB e eketsa motheo oa tšepe empa e boloka sebaka sa ho itšehla thajana sa dielectric se thibelang phetiso ea mocheso. DBC e kopanya koporo ka kotloloho ho ceramic, e tlosa likarolo tse mahareng empa e hloka ts'ebetso e khethehileng. PCB ea tšepe ea koporo e kopanya phetoho ea tlhahiso ea FR4 le ts'ebetso ea mocheso e atamelang li-ceramic substrates.

Power Module PCBs Substrate Comparison: Copper Coin vs DBC le MCPCB

Tharollo ea Thermal e Senyehileng

Li-substrates tsa DBC li fana ka ts'ebetso e phahameng ea mocheso empa li hloka lisebelisoa tsa ceramic le mekhoa ea ho kopanya e phahameng ea mocheso e eketsang litšenyehelo ka 3-5× ha e bapisoa le tharollo e thehiloeng ho PCB. PCB ea tšepe ea koporo e fihlella 70-80% ea ts'ebetso ea mocheso ea DBC hoo e ka bang 40-50% ea litšenyehelo, e etsa hore e sebetse bakeng sa lits'ebetso tsa matla a mahareng moo methako ea DBC e ke keng ea lokafatsoa. Bakeng sa meralo ea PCB ea matla a SiC e ka tlase ho 50 kW, lichelete tsa tšepe tsa koporo hangata li fana ka tekanyo e nepahetseng ea ts'ebetso ea litšenyehelo.

Melemo ea Tlhahiso le Phepelo

Thepa e tloaelehileng ea ho etsa PCB e sebetsana le ts'ebetso ea chelete ea tšepe ea koporo ka litlatsetso tse nyane tsa lisebelisoa bakeng sa machining ea cavity le ho beha chelete ea tšepe. Tšebelisano ena e fokotsa matsete a lichelete mme e lumella baetsi ba PCB ba teng ho kena 'marakeng oa motlakase oa motlakase. Tlhahiso ea DBC e hloka melapo e khethehileng ea ts'ebetso ea ceramic e nang le bokhoni bo fokolang ba lefats'e, ho theha lithibelo tsa phepelo nakong ea tlhokahalo ea tlhokahalo.

Ho Tšepahala le Liteko Mehopolo bakeng sa Power Module PCBs

Thermal Cycling le Interface Integrity

Li-modules tsa motlakase li futhumala khafetsa le ho pholile nakong ea ts'ebetso e tloaelehileng, li baka khatello ea mochini ho li-interfaces. Bond ea koporo-to-FR4 ka PCB ea koporo e tlameha ho mamella mismatches ea katoloso ea mocheso ntle le delamination. Liteko tse potlakileng tsa ho palama libaesekele ho latela maemo a IPC-9701 hangata li matha -40°C ho ea ho +125°C bakeng sa lipotoloho tse 1000-2000 ho netefatsa botsitso ba sebopeho bakeng sa lits'ebetso tsa likoloi le tsa indasteri.

Matla a Peel le Boleng ba Bonding

Ho hokela tjhelete ya koporo ho itshetlehile hodima ho boloka ho lekana ha kgatiso ka mechine kapa ho hokela ho kgomarelang nakong ya ho lamination. Meralo ya ho lekana ha kgatiso e fihlella matla a ho hlohlora a 15-25 N/mm ka ho lekana ha tshitiso le ho notlela katoloso ya mocheso. Ditjhelete tsa tshepe tse laminated tse sebedisang epoxy prepreg ya mocheso o phahameng di fihla ho 20-30 N/mm, tse tshwanang le dibopeho tse tloaelehileng tsa PCB tsa module ya motlakase wa motlakase. Diprothokhole tsa teko di latela ditlhoko tsa IPC-6012 Sehlopha sa 3 bakeng sa ditshebediso tse tshepahalang haholo.

Ho netefatsoa ha Ts'ebetso ea Nako e Telele ea Thermal

Koporo ea tšepe PCB ho hanyetsa mocheso ho ka eketseha ha nako e ntse e feta haeba ho senyeha ha sebopeho ho etsahala ka lebaka la oxidation kapa botsofali ba sekhomaretsi. Liteko tse atolositsoeng tsa boemo ba mocheso ho 125-150 ° C bakeng sa lihora tse 2000-3000 li hlahloba botsitso ba nako e telele. Mehaho e entsoeng hantle ea tšepe ea koporo e bonts'a keketseho e ka tlase ho 5% ea ho hanyetsa mocheso ka mor'a botsofali, ho boloka ts'ebetso ho pholletsa le bophelo bohle ba sehlahisoa sa selemo sa 10-15 lits'ebetsong tsa IGBT PCB.

Tataiso ea ho Rala le ea Tlhahiso bakeng sa li-PCB tsa Copper Coin Power Module

Jiometry ea Chelete le Leano la ho Bea

Bophara ba chelete ea tšepe ea koporo bo lokela ho ts'oana kapa ho feta hanyenyane sebaka sa lisebelisoa tsa matla, hangata 10-30 mm bakeng sa li-IGBT tse sa tšoaneng le 20-50 mm bakeng sa li-module tsa matla. Coin botenya ranges ho tloha 1.5-3.0 limilimithara ho itšetlehile ka kakaretso PCB botenya le hlokahala boima mocheso. Ho beha lichelete tsa tšepe ka ho toba ka tlas'a libaka tsa semiconductor die attach ho fokotsa litlhoko tsa ho hasana ha mocheso le ho fokotsa mocheso oa mateko ka 10-20 ° C ha o bapisoa le ho behoa ha offset.

Taolo ea Ts'ebetso ea Tlhahiso

Mekhahlelo ea bohlokoa ea tlhahiso ea li-PCB tsa module ea matla tse nang le lichelete tsa tšepe tsa koporo li kenyelletsa:

• Ho mamella machining a Cavity - ± 0.05 mm ho nepahala ho netefatsa hore chelete ea tšepe e nepahetse ntle le likheo tsa moea
• Litokisetso tsa holimo - Mechini ea abrasion kapa kalafo ea plasma e fokotsa ho hanyetsa mocheso ho tloha ho 0.3-0.5 K·cm²/W ho isa ho 0.1-0.2 K·cm²/W
• Lamination control - Khatello e ntlafalitsoeng le boemo ba mocheso li fihlella ho ikopanya ka botlalo ntle le papali ea boto

Ntlafatso ea Interface Thermal Resistance Optimization

Tsela e feletseng ea mocheso e kenyelletsa li-interfaces tsa tšepe tsa koporo tse nang le PCB laminate le likarolo tse ka ntle. Die attach layer thermal resistance e atisa ho rena ho 0.2-0.5 K/W bakeng sa dimmojule tsa IGBT, ha coin-to-PCB interface e kenya letsoho 0.1-0.3 K/W. Botenya ba solder pakeng tsa karolo le bokaholimo ba chelete ea tšepe bo lokela ho fokotsoa ho 50-100 μm bakeng sa ts'ebetso e nepahetseng.

Lisebelisoa: SiC le GaN Power Module PCBs Solutions

Li-Module tsa Inverter tsa Koloi ea Motlakase

Li-module tsa matla tsa SiC ho li-inverters tsa EV traction li sebetsa ho 400-800V ka maqhubu a ho fetoha a 10-20 kHz, a hlahisa mocheso o matla oa 150-300W ka sesebelisoa. PCB ea tšepe ea koporo e thusa meralo ea inverter ea mekhahlelo e meraro e nang le li-SiC MOSFET tse ngata tse arolelanang sefofane se tloaelehileng sa mocheso. Lithempereichara tsa mateano li lula li le ka tlase ho 150 ° C le nakong ea ho potlakisa tlhōrō, ho netefatsa ts'ebetso e tšepahalang ho feta 200,000 km ea bophelo ba koloi.

Lisebelisoa tsa Motlakase oa Seva le Telecom

Li-module tsa matla a GaN bakeng sa li-converter tsa 48V DC-DC litsing tsa data li hloka li-substrates tse tšehetsang ts'ebetso ea maqhubu a phahameng ho 500 kHz-1 MHz. Copper coin power module PCBs e fana ka khanyetso e tlase ea mocheso ha e ntse e boloka inductance e tlase ea parasitic ka mekhoa e ntlafalitsoeng ea trace. Matla a matla a fetang 60 W/in³ a ka finyelloa, a fokotsa sebaka sa phepelo ea motlakase ka 30-40% ha e bapisoa le meralo e thehiloeng ho silicon ho MCPCB.

Liindasteri Motor Drives le Solar Inverters

Li-drive tsa liindasteri tsa mekhahlelo e meraro tse sebelisang li-module tsa IGBT ho tloha ho 5-50 kW li rua molemo ho tsamaiso ea mocheso ea PCB ea koporo ntle le litšenyehelo tsa substrate tsa DBC. Li-inverters tsa letsatsi tse sebetsang ka katleho ea 97-99% li ntse li senya 50-200W e le mocheso ho li-semiconductors tsa matla. Mehaho ea chelete ea tšepe ea koporo e nolofalletsa ts'ebetso e se nang moea ka har'a meketjana ea kantle ka ho tsamaisa mocheso hantle ho li-heatsink tsa aluminium extrusion.

Li-Platform tsa PCBs tsa Power Module tse sebetsang hantle le tse ka tšeptjoang

Theknoloji ea PCB ea tšepe ea koporo e fana ka ts'ebetso e leka-lekaneng ea mocheso le ts'ebetso ea tlhahiso bakeng sa li-module tsa morao-rao tsa semiconductor tsa matla. Ka ho theha litsela tse phahameng tsa conductivity tsa lehae ka har'a meaho e tloaelehileng ea PCB, mokhoa ona o fihlela 70-80% ea ts'ebetso ea mocheso oa DBC ka litšenyehelo tse tlase haholo le ho fetoha ha maemo ho hoholo ha tlhahiso. Theknoloji e ipakile e sebetsa ka ho khetheha bakeng sa lits'ebetso tsa SiC power PCB le GaN maemong a 5-50 kW, moo moruo oa DBC o lulang o le thata ha litlhoko tsa mocheso li feta bokhoni ba MCPCB.

Ha matla a matla a ntse a eketseha ka li-semiconductors tse ngata-ngata, PCB ea tšepe ea koporo e fana ka sethala se scalable seo baetsi ba PCB ba ka se sebelisang ntle le matsete a thepa e khethehileng. Motsoako oa ts'epahalo e netefalitsoeng ka netefatso ea libaesekele tse futhumatsang, ho lumellana le mekhoa e tloaelehileng ea kopano, le maemo a theko e tlaase e beha theknoloji ea tšepe ea koporo e le tharollo e sebetsang bakeng sa lisebelisoa tsa motlakase tsa likoloi, tsa indasteri le tse nchafalitsoeng.

Highleap Electronics Power Module PCBs Bokhoni ba

Ka boiphihlelo ba lilemo tse fetang 15 tlhahisong e tsoetseng pele ea PCB le kopanong ea module ea motlakase, Highleap Electronics e fana ka litharollo tse felletseng tsa PCB tsa lichelete tsa koporo:

• Ketsiso ea mocheso le ntlafatso ea moralo - Mohlala oa FEA ho netefatsa ts'ebetso ea mocheso pele ho tlhahiso
• Ho kenya chelete ea tšepe ea koporo ka mokhoa o nepahetseng - Ho mamella machining a Cavity ho ± 0.05 mm ka mekhoa e laoloang ea lamination
• Litšebeletso tse felletseng tsa kopano ea turnkey - Ho fumana likarolo, ho beoa ha SMT, le tlhahlobo ea ho qetela bakeng sa li-module tsa IGBT, SiC, le GaN
• Teko ea netefatso ea boleng - Thermal cycling ka IPC-9701, liteko tsa matla a peel, le tlhahlobo ea ts'epo ea nako e telele

Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka hore na theknoloji ea li-PCB tsa module ea matla a koporo e ka ntlafatsa tsamaiso ea mocheso joang bakeng sa ts'ebeliso ea hau e latelang ea matla a phahameng.