Drone HDI PCB: Tlhahiso e tsoetseng pele bakeng sa Compact UAV Control Systems

Selelekela

Likoloi tsa sejoale-joale tse sa sebetseng li batla litsamaiso tsa elektroniki tse kopaneng le tse bobebe ntle le ho senya ts'ebetso. Mookameli oa sefofane, mochine oa ho tsamaea, le li-sensor tse kopantsoeng li tlameha ho sebetsa ka har'a libaka tse thata haholo tsa 'mele ha li ntse li boloka botšepehi ba matšoao le botšepehi ba mochine.

Theknoloji ea High-Density Interconnect e sebetsana le liphephetso tsena ka mekhoa e tsoetseng pele ea multilayer le mekhoa ea ho hokela ka nepo. Li-PCB tsa drone tse nyane tsa HDI li nolofalletsa moralo o monyane oa molaoli oa sefofane moo ho hokela ka nepo le sebopeho se bobebe li leng bohlokoa. Mokhoa ona oa tlhahiso o sebelisa theknoloji ea microvia, lamination e latellanang, le tlhahiso ea mola o mosesaane ho fihlela boima ba likarolo le bokhoni ba ho tsamaisa lintho bo ke keng ba khoneha ka mekhoa ea PCB e tloaelehileng.

Ke Hobane'ng ha Balaoli ba Compact Drone ba Hloka HDI PCB Technology

Lithibelo tsa Sebaka ho Liboto tsa Taolo ea UAV

Balaoli ba lifofane ba kopanya litsamaiso tse 'maloa tse nyenyane—li-sensor tse ka sehloohong tsa MCU, li-sensor tsa IMU, li-sensor tsa khatello ea barometric, li-module tsa GPS, le li-interface tsa puisano—ka har'a liboto tseo hangata li lekanyang 36×36 mm kapa tse nyane. Theknoloji ea setso ea PCB e ke ke ea fihlella bongata bo hlokahalang ba khokahano ka har'a litekanyo tsena ha e ntse e boloka tsela e nepahetseng ea matšoao le tsamaiso ea mocheso. HDI PCB bakeng sa lits'ebetso tsa boto ea taolo ea UAV e rarolla thibelo ena ka ntlafatso ea palo ea lera le ka katleho ea sebopeho.

Mathata a Matla a Lebelo a Phahameng

Sistimi ea sejoale-joale ea taolo ea li-drone e sebetsana le matšoao a fetang 100 MHz bakeng sa liprothokholo tsa puisano le ho fumana data ea sensor. Litsela tse tloahelehileng ka lesoba li theha litlamorao le li-impedance discontinuities tse nyenyefatsang boleng ba lets'oao. Tlhokahalo ea moralo oa PCB e nyane e qobella ho atamelana haufi, e eketsa likotsi tsa ho kena-kenana le motlakase. Theknoloji ea Drone HDI PCB e sebetsana le litaba tsena ka ho patoa le ho foufala ka meaho e felisang li-stubs le ho fokotsa palo ea lera.

Mekhoa e Metle ea ho tsamaisa

Tlhahiso ea HDI e nolofalletsa bophara ba trace ho fihlela ho 75 µm ka sebaka sa 75 µm, ha e bapisoa le bonyane ba 150 µm tlhahisong e tloaelehileng ea PCB. Ho imena habeli hona ha bongata ba litsela ho lumella litsela tse rarahaneng tsa matšoao ka har'a litekanyo tsa boto e nyane. Theknoloji ena e tšehetsa liphutheloana tsa BGA tse nang le bophahamo ba 0.4 mm, e leng ea bohlokoa bakeng sa li-processor tsa sejoale-joale tsa taolo ea lifofane le li-IC tsa taolo ea matla tse sebelisoang hangata litsamaisong tsa litsebi tsa UAV.

Microvia le Lifofu / Li patoa ka Theknoloji ho Drone HDI PCB

Sebopeho sa Microvia le Melemo

Li-microvia li na le bophara ba 150 µm kapa ka tlase ho moo, li hokahanya likarolo tse haufi ka masoba a chekiloeng ka laser. Ho fapana le ho cheka ka mechine, ho cheka ka laser ho fihlella ho nepahala ha sebaka ka hare ho ±20 µm, e leng sa bohlokoa bakeng sa ho beha likarolo tse teteaneng. Li-via tsena tse nyane li nka thepa e nyane ea boto 'me li ka beoa ka kotloloho ka har'a li-pad tsa likarolo (ka-ka-pad), li felisa litsela tse khelohang le ho fokotsa boholo ba boto ka kakaretso ka ho fihlela ho 30% ha ho bapisoa le meralo ea setso.

Laser Drilling Process Control

Ts'ebetso ea laser ablation e tlosa thepa ea dielectric ka li-pulses tsa matla tse laoloang, ho theha masoba a hloekileng a cylindrical ntle le khatello ea mochini. CO2 lasers (wavelength 10.6 µm) kapa UV lasers (wavelength 355 nm) li khethoa ho ipapisitsoe le sebopeho sa thepa le bophara bo hlokahalang ba lesoba. Desmear e latelang le koporo e se nang electroless li lokisoa ka mabota bakeng sa electroplating. Mehaho ea tlhahiso e beha leihlo li-parameter tsa laser ho tsoela pele ho boloka botsitso ho pholletsa le lihlopha tsa tlhahiso.

Sequential Via Structures

Ho foufala ha li-oda tse ngata ka meralo ho thusa likhokahano tse otlolohileng lipakeng tsa likarolo tse sa bapisang ntle le ho phunyeletsa botenya bohle ba boto:

• 1+N+1 sephutheloana - Lera le le leng la microvia buildup holim'a bokaholimo bo bong le bo bong bo nang le mantlha a setso
• 2+N+2 sephutheloana - Mekhahlelo e 'meli ea li-buildup ka lehlakoreng le leng bakeng sa likarolo tse phahameng tsa likarolo
• E phuthetsoe ka tsela - Li-microvia li behiloe ka kotloloho holim'a tse ling ka lipotoloho tse latellanang tsa lamination
• Bokhoni ba ho tsamaisa lets'oao - Lihokelo tse otlolohileng ho tloha ho mekhahlelo e ka ntle ho ea ho lifofane tse ka hare tse nang le tšebeliso e fokolang ea sebaka sa lateral

Meaho ena e ipaka e le ea bohlokoa ha u tsamaisa li-BGA tsa lipalo tse phahameng ho liboto tsa taolo tsa compact drone moo milimithara e 'ngoe le e 'ngoe e leng bohlokoa.

HDI Stackup le Boitsebiso ba Lintho bakeng sa Liboto tsa UAV

Meetso e Tloaelehileng ea Drone HDI PCB Stackup Architectures

Sebopeho sa 1+N+1 se sebelisa lesela le le leng la microvia buildup holim'a sebaka se seng le se seng se ka ntle se nang le motheo oa setso, o loketseng liboto tsa drone tse itekanetseng. Litlhophiso tse rarahaneng haholoanyane tsa 2+N+2 li eketsa mekhahlelo e 'meli ea ho haha ​​​​lehlakoreng le leng le le leng, ho tšehetsa likarolo tse phahameng tse hlokahalang ho balaoli ba lifofane tse tsoetseng pele. Karolo e 'ngoe le e' ngoe ea ho haha ​​​​e eketsa ho rarahana ha tlhahiso empa e fana ka lisebelisoa tse eketsehileng tsa ho tsamaisa.

Khetho ea Lintho tsa Dielectric

Lisebelisoa tsa mantlha le tsa prepreg li ama botšepehi ba lets'oao ka kotloloho ka thepa ea tsona ea kamehla ea dielectric le tangent tangent. FR-4 e tloaelehileng e lekane bakeng sa matšoao a taolo ea maqhubu a tlase, ha li-interface tsa puisano tse lebelo le phahameng li rua molemo ho lisebelisoa tse nang le Dk e tlase joalo ka Panasonic Megtron 6 (Dk 3.6 ho 1 GHz) kapa laminate e ikhethang ea tahlehelo e tlase (Dk 3.48). Likarolo tse tšesaane tsa dielectric—hangata 50-100 µm lipakeng tsa likarolo tsa matšoao—li fokotseha ka likarolo tsa likarolo le ho ntlafatsa ts'ebetso ea maqhubu a phahameng bakeng sa li-module tsa puisano tsa RF tsa GHz-range.

Litlhokahalo tsa Taolo ea Impedance

Meralo ea taolo ea sefofane e totobatsa impedance e laoloang bakeng sa matlooa a bohlokoa a matšoao—hangata 50Ω bakeng sa pheletso e le 'ngoe kapa 100Ω bakeng sa lipara tse fapaneng. Ho fihlella impedance e reretsoeng ho hloka taolo e nepahetseng ea jiometri ea trace, botenya ba dielectric, le boima ba koporo. Lifensetere tsa mamello ea tlhahiso li tšesaane haholo ka dielectric tse tšesaane tse sebelisoang ho li-stackups tsa drone HDI PCB . Mehaho e tsoetseng pele ea tlhahiso e sebelisa li-coupon tsa teko ea impedance 'me e fetola liparamente tsa ho betla ho boloka mamello ea impedance ea ±10 lekholong.

Mokhoa oa Tlhahiso le Taolo ea Boleng

Sequential Lamination Process

Tlhahiso ea HDI e tsoela pele ka lipotoloho tse pheta-phetoang tsa ho lamination, ho cheka ka laser, le ho penta ka koporo. Karolo ea mantlha e etsoa ts'ebetsong ea pele, ebe e fumana mekhahlelo ea prepreg le ea koporo ka potoloho ea ho penta ka mocheso o laoloang. Kamora ho penta ka 'ngoe, ho cheka ka laser ho etsa li-microvia pele ho penta ka koporo le ho etsa lipaterone tsa potoloho. Tatellano ena e pheta bakeng sa lera ka leng le bokellanang. Ho nepahala ha ho hokahanya lipakeng tsa mekhahlelo e latellanang ho tlameha ho lula ka har'a 75 µm ho thibela ho se ngolisoe hantle ka tsela e nepahetseng ka tsela e itseng.

Mekhoa ea ho Hlahloba le ho netefatsa

Sistimi e ikemetseng ea tlhahlobo ea mahlo e hlahloba laser e 'ngoe le e 'ngoe e phuntsoeng ka bophara bakeng sa bophara bo nepahetseng, boemo le bohloeki pele ho tšepe. Tlhahlobo ea X-ray e netefatsa hore e patiloe ka sebopeho le tlhophiso e ka hare ea liboto tse phethiloeng. Teko ea motlakase ka lisebelisoa tse fofang kapa mekhoa ea ho lokisa e tiisa ho tsoelapele le ho itšehla thajana. Liheke tsena tsa boleng li thibela liboto tse nang le bothata ho fihla kopanong, ho bohlokoa haholo ha ho nahanoa ka sekhahla se phahameng sa likarolo tsa meralo ea drone HDI PCB.

Plating Uniformity le Via Fill

Ho lumellana ha koporo ea koporo ho ama ka kotloloho ka ho ts'epahala le bokhoni ba ho tsamaisa hona joale:

• Sidewall coverage - Botenya ba koporo bo sa fetoheng ka marako bo tiisa khokahano e tšepahalang
• Botenya bo tlase - Ts'ebetso e lekaneng ea koporo ka botlaaseng e thibela li-circuits tse bulehileng
• Ka ho tlatsa - Ho tlatsa koporo ka botlalo ho felisa likheo tse ka tšoasang litšila
• Tsamaiso ea ts'ebetso - Lik'hemik'hale tsa Plating, letsoalo la hajoale, le ho ferekana ha phanele li susumetsa ho qetela ka boleng

Li-microvias tse tlatsitsoeng li bonts'a ts'epo e phahameng ha e bapisoa le meralo e sa tlatsoang tlasa tlhahlobo ea khatello ea mocheso le mochini.

Tšepahala le Ts'ebetso ho Tikoloho ea Harsh Drone

Mechanical Stress Resistance

Ts'ebetso ea Drone e beha lisebelisoa tsa elektroniki hore li thothomele khafetsa ho tsoa ho lienjineri le li-propeller, hammoho le meroalo e ts'oenyehileng nakong ea ho theoha. Mehaho ea HDI e nang le likarolo tse ngata tse tšesaane tsa dielectric li theha li-interfaces moo delamination e ka bang teng tlas'a khatello ea cyclic. Khetho e nepahetseng ea resin le khatello ea lamination e laoloang e tiisa hore ho tlamahanngoa ho matla ha interlayer. Li-microvia tse tlatsitsoeng li mamella mokhathala ntle le ho peperana tlas'a tlhahlobo ea vibrate ho latela litekanyetso tsa IPC-9701.

Thermal Cycling Durability

Ho fetoha ha mocheso ho tloha ho -40 ° C ho ea ho +85 ° C ho etsahala nakong ea ts'ebetso ea lifofane. Motsoako oa katoloso ea mocheso o sa tsamaisaneng lipakeng tsa koporo (17 ppm/°C) le lisebelisoa tsa dielectric (hangata 14-16 ppm/°C bakeng sa FR-4) li baka khatello ea maikutlo ka likhokahano. Tlhahiso ea Drone HDI PCB e ntlafatsa botenya ba koporo ea koporo mme e sebelisa lisebelisoa tse tlase tsa CTE ho fokotsa khatello ena. Liteko tsa libaesekele tse futhumetseng ka li-cycle tse 500-1000 li netefatsa ka botšepehi pele ho netefatso ea moralo.

Tšireletso ea tikoloho

Likotsi tsa ho kena ha mongobo lia eketseha ka meaho e mengata ka har'a mapolanka a HDI. Tšebeliso ea sekoahelo se sa reroang kamora ho kopanngoa e fana ka tšireletso ea mantlha, empa khetho ea thepa nakong ea tlhahiso le eona ea bohlokoa. Ho tlatsa hantle ho felisa masoba moo mongobo o ka bokellanang, ha sekoahelo sa maske ea solder holim'a li-vias tse patiloeng se thibela litsela tsa ho bola. Lintho tsena li ipaka li le bohlokoa bakeng sa li-drone tse sebetsang libakeng tse mongobo kapa tsa leoatle.

Mehlala ea Ts'ebeliso ho Lits'ebetso tsa Drone

Maboto a Maholo a Molaoli oa Sefofane

Maboto a mantlha a taolo ea sefofane a kopanya li-processor tsa mantlha, li-interfaces tsa sensor, le li-module tsa puisano maemong a compact form. HDI PCB bakeng sa meralo ea boto ea taolo ea UAV hangata e sebelisa li-stackups tsa 6-8 tse nang le likarolo tse ngata tsa microvia, tse tšehetsang liphutheloana tsa BGA ho fihla ho 0.4 mm pitch. Theknoloji e nolofalletsa ho behoa ha li-gyroscopes, accelerometers le magnetometers ka har'a limilimithara tsa processor ha e ntse e boloka litsela tse hloekileng tsa mats'oao a analog a arohaneng le lerata la switching ea dijithale.

Li-Module tsa Phetiso ea Video

Phatlalatso ea video e phahameng haholo e hloka li-circuits tsa RF tsa GHz-frequency le li-interface tsa digital tsa lebelo le phahameng. Taolo ea sefofane sa Drone PCB e rala lits'ebetso tsa FPV e sebelisa theknoloji ea HDI ho boloka 50Ω phetiso ea mohala oa phetisetso ho pholletsa le litselana tse tsamaisanang. Li-vias tse foufetseng li hokahanya likarolo tsa RF le lifofane tse fatše ntle le ho senya likarolo tse haufi tsa matšoao, tse bohlokoa bakeng sa ho boloka tahlehelo ea ho kenya ka tlase ho 1 dB le tahlehelo ea ho khutla ka tlase -15 dB litlhaloso.

Tšebelisano ea Electronic Speed ​​Controller

Meralo e tsoetseng pele ea ESC e kopanya ho fetoha ha matla, taolo ea MCU, le likhokahano tsa puisano ho liboto tsa komporo e le 'ngoe:

• Karohano ea tsela ea matla - Lifofane tsa koporo tse patiloeng li sebetsana le maqhubu a motlakase ho fihla ho 50A ha likarolo tsa holim'a mats'oao a taolo ea tsela
• Tsamaiso ea ho futhumatsa - HDI lera sebopeho nolofalletsa leqheka placement ea vias mogote tlas'a likarolo matla
• Ho ikopanya ha tsamaiso - ESC e kopantsoeng le meralo ea taolo ea sefofane e fokotsa boima ba sistimi ka liperesente tse 20-30
• Botšepehi ba pontšo - Lifofane tse arohaneng tsa fatše bakeng sa li-circuits tsa analog le tsa dijithale li fokotsa ho kopanya lerata

Kopanyo ena e ipakile e le ea bohlokoa haholo lits'ebetsong tsa UAV tsa mabelo le mamello e telele moo boima le mathata a sebaka a leng bohlokoa.

fihlela qeto e

Theknoloji ea Drone HDI PCB ha e le hantle e thusa meralo ea elektronike e kopanetsoeng, e phahameng haholo e hlokahalang litsing tsa sejoale-joale tse sa sebetsoeng. Motsoako oa likhokahano tsa microvia, lits'ebetso tse latellanang tsa lamination, le moralo o laoloang oa impedance o fana ka tharollo ea boemo ba boto e fihlelang boholo bo thata, boima le litlhoko tsa ts'ebetso.

Ka mokhoa o nepahetseng oa ho cheka ka laser, lisebelisoa tse tšesaane tsa dielectric, le taolo e matla ea boleng, mekhoa ena ea tlhahiso e fihlella likhakanyo tsa likarolo le bokhoni ba ho tsamaisa mats'oao boo theknoloji e tloaelehileng ea PCB e ke keng ea fana ka eona. Ho tšepahala ho bonts'itsoeng ka ho palama libaesekele tse futhumatsang, tlhahlobo ea ho thothomela, le netefatso ea ho pepeseha tikolohong ho netefatsa ho tšoaneleha ha HDI bakeng sa lits'ebetso tsa taolo ea sefofane tsa bohlokoa haholo.

Ha meralo ea UAV e ntse e tsoela pele ho sutumelletsa linthong tse nyane tsa sebopeho ka ts'ebetso e atolositsoeng, bokhoni ba tlhahiso bo fumanehang lits'ebetsong tsa HDI bo ntse bo le bohlokoa ho ntlafatseng ts'ebetso ea lisebelisoa tsa elektroniki tsa sefofane.