Ho Utloisisa Litšenyehelo tsa PCB e boima ea Koporo: Lintlha tsa Bohlokoa le Maano a Ntlafatso

Indasteri ea lisebelisoa tsa elektroniki e ntse e itšetleha haholo ka li-PCB tse boima tsa koporo (≥3 oz) bakeng sa lits'ebetso tsa motlakase o phahameng le tse nang le matla a mangata, ho kenyeletsoa li-module tsa motlakase, li-inverter, li-drive tsa motlakase le litsamaiso tsa taolo ea indasteri. Liboto tsena li sebetsana le meroalo e meholo ea motlakase ha li ntse li boloka botsitso ba mocheso libakeng tse hlokang matla.

Leha ho le joalo, theko e boima ea koporo ea PCB e feta haholo litheko tse tloaelehileng tsa boto ea potoloho ka lebaka la litlhoko tsa thepa le ho rarahana ha tšebetso. Ho utloisisa lits'enyehelo tsa mantlha ho thusa baenjiniere ba meralo le lihlopha tsa ho reka thepa ho ntlafatsa ts'ebetso le moralo oa lichelete ka nepo.

Bakhanni ba Litšenyehelo tse ka Sehloohong ho Tlhahiso e Matla ea Koporo ea PCB

1. Botenya ba Foil ea Koporo le Litšenyehelo tsa Lintho

Botenya ba foile ea koporo bo ama ka ho toba litšenyehelo tse boima tsa PCB ea koporo, ka litlhaloso tse tloaelehileng tse tlohang ho 2 oz ho isa ho 10 oz. Keketseho e 'ngoe le e 'ngoe e ntseng e eketseha ea boima ba koporo e eketsa litšenyehelo tsa thepa haholo ha e ntse e thatafatsa lits'ebetso tsa electroplating, etching, le lamination . Koporo e teteaneng e boetse e hloka li-substrate tse phahameng tsa mocheso oa phetoho ea khalase (Tg) le thepa e khethehileng ea dielectric ho laola ho se lumellane ha katoloso ea mocheso.

Ntlafatso ea moralo e fana ka phokotso e utloahalang ea litšenyehelo. Baenjiniere ba lokela ho hlakisa koporo e boima holim'a likaroloana tse nang le matla a phahameng, ha ba ntse ba boloka boima bo tloaelehileng ba koporo libakeng tse ling. Ho kenya ts'ebetsong libaka tsa koporo tse boima tse sebakeng sa heno ho fapana le ho koahela ka botlalo ho ka fokotsa tšebeliso ea koporo ka kakaretso ka 30-40% ntle le ho senya ts'ebetso ea motlakase.

2. Electroplating le Current Density Control

Ho fihlella botenya bo lekanang ba koporo tlhahisong e boima ea PCB ea koporo ho hloka lipotoloho tse ngata tsa electroplating tse nang le taolo e nepahetseng ea khatello ea hona joale. Mekhoa ea ho plating ea mehato e eketsa nako ea tlhahiso haholo 'me e eketsa tšebeliso ea electrolyte, litlhoko tsa tlhokomelo le litšenyehelo tsa matla.

Taolo e sa lekaneng ea sets'oants'o sa methapo e baka phapang ea botenya, bofokoli ba ho penta ho feta tekano, kapa ho haella ha koporo e lekaneng, 'me kaofela ha tsona li baka litšenyehelo tse boima. Baetsi ba sebelisang litsamaiso tsa hona joale tsa ho lekola boima ba 'mele le mehala e tsoetseng pele ea electroplating ba fumana chai e phahameng ea pele, ba fokotsa litšenyehelo tse patiloeng tse amanang le tokiso ea liphoso.

3. Etching le Pattern Definition Complexity

Ho kenya mesaletsa ea koporo e teteaneng ho hlahisa liphephetso tse kholo tsa tekheniki tse amang ka kotloloho litšenyehelo tse boima tsa koporo ea PCB. Mekhoa e tloaelehileng ea etching e loantšana le likarolo tsa koporo tse fetang 4 oz, hangata li hlahisa li-undercuttings, mabota a mahlakoreng a makukuno, le ho se nepahale ha sebopeho. Meeli ena e hloka litharollo tse phahameng tsa lik'hemik'hale, nako e atolositsoeng ea nako, le litšenyehelo tse eketsehileng tsa kalafo ea litšila.

Ntlafatso ea mekhahlelo ea moralo ea bophara ba ho hlaka le sebaka se fokotsang mathata a ho hlaka. Ho boloka lits'oants'o tse lekaneng le ho qoba li-conductors tse patisaneng ho sa hlokahale ho ntlafatsa tlhahiso. Sistimi e tsoetseng pele ea taolo ea phapang e thusa bahlahisi ho lebella mathata a ts'ebetso pele ba itlama ho etsa tlhahiso e felletseng.

4. Lamination Cycles le Pressing Process

Multilayer boima koporo PCB kaho hloka lipotoloho multiple lamination ho haha ​​e feletseng stack-up. Mekhahlelo e metenya ea koporo e sitisa phallo e nepahetseng ea resin nakong ea ho tobetsa le ho rarahana ho ngolisoa ha layer-to-lay. Potoloho e 'ngoe le e' ngoe e eketsehileng ea lamination e hlahisa kotsi ea ho hokahanya, e eketsa nako ea potoloho, 'me e phahamisa litšenyehelo tsa tlhahiso haholo.

Moralo o sebetsang hantle oa ho bokellana o fokotsa lipotoloho tsa ho lamination ha o ntse o fihlela litlhoko tsa motlakase. Ho sebetsa le baetsi ba nang le boiphihlelo ba utloisisang liparamente tsa ho hatella koporo e boima ho ntlafatsa sekhahla sa katleho sa potoloho e le 'ngoe le ho fokotsa makhetlo a tlhahiso a kenyang litšenyehelo tsa PCB ea koporo e boima ka kakaretso.

5. Ho rarahana ha lihlahisoa le ts'ebetso

Tahlehelo ea lihlahisoa e emela ntlha ea bohlokoa e patiloeng ea theko ea koporo e boima ea koporo ea PCB. Ha botenya ba koporo bo ntse bo eketseha ho feta 6 oz, lifensetere tsa ts'ebetso li fokotseha haholo, li phahamisa litekanyetso tsa bofokoli ho kenyelletsa ho tenyetseha ho feta tekano, warpage, opens, shorts, and plating non-uniformity. Boto e 'ngoe le e 'ngoe e lahliloeng e aba litšenyehelo tse tsitsitseng tsa tlhahiso ho pholletsa le likarolo tse fokolang tse amohelehang, e leng ho phahamisang litheko tse sebetsang hantle.

Tlhahlobo e felletseng ea ts'ebetso e sebelisang tlhahlobo ea mahlo e ikemetseng (AOI), litšoantšo tsa X-ray, le lisebelisoa tse nepahetseng tsa ho metha botenya li fumana liphoso kapele. Ho etsa litlhahlobo tsa moralo oa tlhahiso ea tlhahiso (DFM) pele tlhahiso e qala ho supa mathata a ka bang teng ha liphetoho li bitsa chelete e tlase ho li kenya tšebetsong.

Maano a Koporo ea Boima ba Litšenyehelo tsa PCB

1. Ntlafatso ea Boemo ba Moqapi

Tsamaiso e sebetsang ea litšenyehelo e qala nakong ea mokhahlelo. Baenjiniere ba lokela ho bala bophara bo hlokahalang ho latela maemo a UL le litahlehelo tse amohelehang tsa I²R ho e-na le ho sebelisa marang-rang a feteletseng. Maano a bohlokoa a moralo a kenyelletsa:

• Meetso ea koporo e kopaneng e sebelisang litekanyo tse fapaneng tsa koporo ka mekhahlelo e fapaneng, e beha koporo e boima feela moo boima ba hona joale bo e hlokang.
• Libaka tsa koporo tse boima tsa sebakeng sa heno ho fapana le ho koahela ka botlalo ho fokotsa tšebeliso ea thepa
• Ketsiso ea mocheso le tlhahlobo ea hona joale ea letsoalo ho khetholla kabo e nepahetseng ea koporo
• Ho qoba ho qolla ka ho fetelletseng ho eketsang litšenyehelo tse boima tsa koporo ea koporo ntle le melemo e ts'oanang ea ts'ebetso

2. Ntlafatso ea Boemo ba Ts'ebetso

Ho sebetsa hantle ha tlhahiso ho ama ka kotloloho meaho e boima ea koporo ea PCB. Lithapo tsa plating tse ikemetseng tse nang le ts'ebeliso ea nako ea nnete li boloka sebopeho se ts'oanang libakeng tsohle. Ho kopanya mekhoa ea AOI methating e mengata ea ts'ebetso ho tšoara liphoso pele ho eketsa boleng ka ts'ebetso e latelang.

Ho kgetha bahlahisi ba nang le disetifikeiti tsa ISO 9001 le IATF 16949 ho netefatsa taolo e tsitsitseng ya tshebetso le ditsamaiso tsa taolo ya boleng tse fokotsang ditjeo tse amanang le diphetoho. Ho betla ho laolwang ka dipotoloho tsa lamination tse arohaneng ho fokotsa sekgahla sa ditshila ha ka nako e ts'oanang ho boloka ho nepahala ha dibopeho.

3. Phepelo ea Phatlalatso

Theko ea thepa e tala e ama haholo litšenyehelo tse boima tsa koporo ea koporo le linako tse etellang pele. Ho fumaneha ha foil ea koporo ho fapana le maemo a mmaraka, 'me lisebelisoa tse khethehileng tsa koporo e boima li ka hloka nako e telele ea ho batla. Puisano ea pele le baetsi ba thepa mabapi le litlhaloso tsa thepa e thusa ho qoba litefiso tsa kapele.

Ho beha meralo e leka-lekaneng ho pota-potileng thepa ea substrate e fumanehang hangata le botenya ba koporo ho fokotsa litlhoko tse tlase tsa odara. Litlhaloso tsa thepa tse tloahelehileng hangata li jara litefello tsa litšenyehelo tsa 15-25% le ho atolosa linako tsa ho fana, tse amang ka kotloloho litšenyehelo tse boima tsa koporo ea PCB.

Papiso ea Litšenyehelo tse ngata

Litšenyehelo tsa thepa le ts'ebetso li se li sa tsamaellane le botenya ba koporo. Boto e sebelisang koporo ea 4 oz hangata e bitsa 40-60% ho feta moralo o lekanang oa 1 oz. Ho eketseha ho 8 oz koporo ho eketsa e 'ngoe ea 50-70% holim'a motheo oa 4 oz ka lebaka la ho kopanya mokhoa o rarahaneng.

Nako ea electroplating e le 'ngoe e ka imena hararo ha e tloha ho 4 oz ho ea ho 8 oz koporo, e ama ka kotloloho matla a tlhahiso le kabo ea litšenyehelo. Litšenyehelo tsena tse ntseng li eketseha li totobatsa bohlokoa ba ho hlakisa botenya ba koporo ka nepo ho ipapisitsoe le litlhoko tsa motlakase ho fapana le ho sebelisa likarolo tse sireletsehileng tsa polokeho.

fihlela qeto e

Litsenyehelo tse boima tsa koporo ea PCB li bakoa haholo-holo ka ho rarahana ha mokhoa oa tlhahiso ho e-na le litšenyehelo tsa thepa feela. Katleho ea ho ntlafatsa litšenyehelo e hloka boiteko bo hokahaneng lipakeng tsa boenjiniere ba meralo le boitseanape ba ho etsa lintho. Liqeto tsa maano mabapi le ho ajoa ha koporo, meralo ea li-stack-up, le khetho ea barekisi li boloka chelete e ngata ha li ntse li boloka ts'ebetso ea motlakase le ts'epahalo eo lits'ebetso tsa morao-rao li li hlokang.

Highleap Electronics e ikhethile ka tlhahiso ea li-PCB tsa koporo e boima ka bokhoni bo felletseng:

• Mehala e tsoetseng pele ea li-electroplating e tšehetsang 2 oz ho isa ho 10 oz botenya ba koporo e nang le taolo e nepahetseng ea hona joale ea letsoalo.
• Litsamaiso tse ikemetseng tsa AOI le X-ray tsa tlhahlobo tse netefatsang litefiso tse phahameng tsa chai
• Mekhoa e netefalitsoeng ea ISO 9001 le IATF 16949 bakeng sa boleng bo tsitsitseng
• Sehlopha sa boenjiniere se nang le boiphihlelo se fanang ka ntlafatso ea DFM le litharollo tse baballang chelete e ngata
• Bokhoni ba ts'ebeletso e felletseng ho tloha ho prototyping ho isa tlhahiso ea molumo bakeng sa lits'ebetso tsa morao-rao le tse tšepahalang haholo

Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka hore na tlhahiso ea li-PCB tse boima tsa koporo e ntlafalitsoeng e ka fihlela litlhoko tsa hau tsa ts'ebetso joang ha e ntse e laola litšenyehelo tsa projeke.