Lisebelisoa tsa Moralo oa Theknoloji ea DBC Substrate le Lisebelisoa tsa Module ea Matla

Li-substrate tsa DBC

Li-substrate tsa Koporo e Kopantsoeng ka ho Otloloha (DBC) ke li-substrate tsa motlakase tse thehiloeng ho ceramic tse etselitsoeng lits'ebetso tse hlokang bokhoni bo phahameng ba motlakase, ho itšehla thajana ha motlakase, le ho qhala mocheso ka katleho. Tataiso ena e hlalosa hore na li-substrate tsa DBC ke eng, li etsoa joang, li kena hokae mehahong ea motlakase le mesebetsing e tsoetseng pele ea PCB, li bapisoa joang le AMB/DPC/LTCC/HTCC, le seo u lokelang ho se kenyelletsa ho RFQ ho qoba tieho le ho potoloha hape.


Karolo e ka tlase ea DBC ke eng?

Substrate ea DBC (Direct Bonded Copper) ke substrate ea matla a ceramic moo koporo e hokahanngoang ka ho toba lehlakoreng le leng kapa ka bobeli la poleiti ea ceramic (hangata alumina, aluminium nitride, kapa silicon nitride). Ho fapana le li-PCB tsa organic (mohlala, FR-4) tse itšetlehileng ka litsamaiso tsa resin le lifoile tsa koporo tse laminated, DBC e theha sebopeho se matla sa koporo-ceramic se etselitsoeng ho fokotsa khanyetso ea mocheso le ho mamella potoloho e matla ea mocheso.

Hangata di-substrate tsa DBC di sebediswa e le motheo wa motlakase le wa mocheso bakeng sa di-module tsa motlakase le di-platform tsa mocheso tse nang le matla a maholo—tse tshehetsang mesaletsa e teteaneng ya koporo, ho ikarola ha motlakase o phahameng, le ho hasana ha mocheso ka katleho ho tloha disebedisweng tsa semiconductor ho ya ho heatsink kapa poleiti e batang.

Haeba o sa tsoa qala theknoloji ena, kakaretso ena ea substrate ea koporo e kopantsoeng ka ho toba e hlalosa sebopeho sa mantlha le hore na ke hobane'ng ha e sebelisoa bakeng sa taolo ea mocheso o matla haholo.


DBC khahlanong le li-PCB tse Tloaelehileng: Moo DBC e Lokelang Teng

Hangata li-substrate tsa DBC li tšohloa hammoho le li-PCB tsa letsopa , empa li utloisisoa hamolemo e le substrate ea motlakase ho fapana le boto ea potoloho e hatisitsoeng ka sepheo se akaretsang.

  • Li-PCB tse tloaelehileng (FR-4, FR-4 e nang le Tg e phahameng, PTFE, jj.) ipabola ho routing e teteaneng, likhokahano tsa mekhahlelo e mengata, le ho boloka litšenyehelo bakeng sa lisebelisoa tsa elektroniki tsa lets'oao/taolo.
  • Li-substrate tsa DBC ipabola taolong ea mocheso le matla a mangata, haholo-holo moo koporo e teteaneng le ho itšehla thajana ha letsopa li hlokahalang.

Lihlahisoa tse ngata, DBC e kenyelelitsoe tsamaisong e pharaletseng: PCB ea taolo e laola ho khanna ka mokhoa oa logic le oa heke, ha setsi sa DBC se tšehetsa lisebelisoa tsa ho fetola matla a phahameng (li-module tsa IGBTs/MOSFETs/SiC/GaN) le litsela tsa motlakase. Bakeng sa meaho ea boto e tloaelehileng le li-stackup, bona lits'ebeletso tsa rona tsa tlhahiso ea PCB.


Kamoo Li-substrate tsa DBC li Etsoang Kateng

Leha lintlha tsa ts'ebetso li fapana ho ea ka moetsi, tlhahiso ea DBC hangata e latela mekhahlelo ena:

  1. Tokisetso ea letsopa: Lipoleiti tsa letsopa lia khethoa, lia hloekisoa, 'me lia lokisoa ho netefatsa boemo bo tsitsitseng ba bokaholimo le hore bo bataletse.
  2. Kopanyo ea koporo: Maqephe/lifoile tsa koporo li hokahanngoa le letsopa ho sebelisoa mokhoa oa mocheso o phahameng tlas'a sepakapaka se laoloang. Sepheo ke sebopeho se tsitsitseng sa koporo-serame se nang le matla a ho hokahana a phahameng le khanyetso e tlase ea mocheso.
  3. Paterone: Koporo e betliloe ka mokhoa oa photolithography le ho fata ho etsa litsela tsa hona joale, li-pad le libaka tse arohaneng.
  4. Qetello ea ho betla/holim'a metsi: Liqeto li sebelisoa ho latela litlhoko tsa kopano (khomaretso ea terata, ho kopanya, ho sintering, jj.).
  5. Tlhahlobo le teko ea ho qetela: diteko tsa boholo, tlhahlobo ya pono, diteko tsa ho kgomarela (jwalo ka ha ho boletswe), diteko tsa motlakase (jwalo ka ha ho hlokahala), le ditokomane/ho fumaneha ha dintho tse ka latelwang.

Hobane DBC e kenyelletsa ho sebetsana le letsopa le koporo e teteaneng, tlhahiso e susumetsoa haholo ke botenya ba koporo, jiometri ea likarolo, litlhoko tsa ho itšehla thajana, le taolo ea ho batalla/ho warpage. Tlhaloso e qaqileng haholoanyane ea mohato ka mohato e fumaneha tataisong ea rona ea ts'ebetso ea tlhahiso ea DBC.

Likopo tse Tloaelehileng ho Power Electronics

Li-substrate tsa DBC li sebelisoa haholo moo ts'ebetso ea mocheso le karohano li lokelang ho bolokoa nako e telele tlas'a potoloho e matla ea motlakase:

  • Di-module tsa matla tsa IGBT le MOSFET: di-drive tsa dienjini, ho hula ha motlakase, di-inverter tsa diindasteri, le phetoho ya matla.
  • Lisebelisoa tsa motlakase tsa EV/HEV: li-inverter tsa ho hula, li-charger tse ka hare ho sekepe (OBC), li-converter tsa DC-DC.
  • Li-converter tsa matla a ntjhafatswang: li-inverter tsa letsatsi, li-converter tsa matla a moea.
  • Li-platform tsa LED tse matla haholo le tsa laser: Li-LED tse nang le chip-on-board (COB), li-module tse khanyang haholo.
  • Sepakapaka le tšireletso: Tikoloho e matla ea mocheso, ho thothomela, litlhoko tsa bophelo bo bolelele ba thomo.
  • Lisebelisoa tsa motlakase tsa indasteri le lisebelisoa tsa ho tjheseletsa: litsela tse phahameng tsa motlakase le liforomo tse matla tsa mocheso.

Melemo ea Bohlokoa le Meeli e Sebetsang

Bokhoni Ke hobane'ng ha e le habohlokoa Lintlha tse sebetsang
Tshebetso ea mocheso Ho hanyetsa mocheso ho tlase ho thusa ho fokotsa mocheso oa junction le ho ntlafatsa ts'epo ea sesebelisoa. Khetho ea thepa (Al₂O₃/AlN/Si₃N₄), botenya ba koporo, le moralo oa sebopeho sa sebopeho li susumetsa ts'ebetso.
Litsela tsa motlakase o phahameng Koporo e teteaneng e tšehetsa maqhubu a phahameng a tsoelang pele le a tlhoro. Koporo e teteaneng e eketsa lithibelo tsa ho tjhesa 'me e ka ama litšenyehelo, chai, le boholo ba bonyane ba likarolo.
Ho itšehla thajana ka motlakase Ceramic e fana ka karohano e matla ea dielectric bakeng sa mekhahlelo ea matla a motlakase o phahameng. Ho tlosa dikotwana, ditsela tsa ho tjhesa, moralo wa mathoko, le botenya ba letsopa di lokela ho tsamaellana le dipheo tsa motlakase.
Tšepahalo ea ho potoloha ha mocheso Li-stack tse entsoeng ka letsopa li ka tsitsa ho feta li-laminate tsa tlhaho nakong ea potoloho ea mocheso. Ho tšepahala ho itšetlehile ka khetho ea letsopa, ho leka-lekana ha botenya ba koporo, ho tsepamisa maikutlo khatellong ea sebopeho, le mokhoa oa ho kopanya mojule.
Matla a mechine Bohlokoa lits'ebetsong tsa ho thothomela/ho hula. Hangata Si₃N₄ e khethoa ha ho ba thata le ts'ebetso ea ho palama baesekele e le lintho tsa bohlokoa.

Meeli ea ho rera: Hangata DBC ha e sebelisoe bakeng sa ho tsamaisa li-routing tsa maemo a holimo, likhokahano tsa dijithale tse nang le molumo o mosesaane, kapa meralo e rarahaneng ea matšoao a mekhahlelo e mengata. Ke sethala sa matla/mocheso—se kopantsoeng hantle le li-PCB tse arohaneng tsa taolo ha ho hlokahala.


Dikgetho tsa Ceramic tsa DBC: Al₂O₃ khahlano le AlN khahlano le Si₃N₄

Thepa ea motheo ea ceramic ke e 'ngoe ea ts'ebetso ea bohlokoa ka ho fetisisa le litšebeliso tsa litšenyehelo khethong ea DBC. Bakeng sa papiso e tebileng e shebaneng le thepa, bona li-substrate tsa ceramic tsa DBC.

Alumina (Al₂O₃)

  • Matla: e theko e tlase, e fumanehang hohle, le tikoloho ea tlhahiso e hōlileng tsebong.
  • Tšebeliso e tloaelehileng: dimmojule tse ngata tse tloaelehileng tsa motlakase moo tshebetso e feteletseng ya mocheso e seng yona ntho e thibelang.
  • Phetisetsano: ho khanna ha mocheso ho tlase ha ho bapisoa le AlN, kahoo ho phahama ha mocheso ho ka etsahala ka matla a mangata haholo.

Aluminium Nitride (AlN)

  • Matla: ho tsamaisa mocheso ka lebelo le phahameng; e thusa ha dithibelo tsa mocheso di fokotsa bongata ba matla.
  • Tšebeliso e tloaelehileng: Li-inverter tsa motlakase oa ...
  • Phetisetsano: Litšenyehelo tse phahameng tsa thepa le litlhoko tse thata tsa taolo ea ts'ebetso ha li bapisoa le Al₂O₃.

Silicon Nitride (Si₃N₄)

  • Matla: ho tiea ha mechini ho babatsehang le ts'ebetso e matla ea potoloho ea mocheso; hangata e khethoa bakeng sa tikoloho e ts'epahalang haholo ea ho hokahana le ho thothomela.
  • Tšebeliso e tloaelehileng: litsamaiso tsa ho hula, literene, li-module tsa likoloi moo bophelo bo bolelele ba ho palama baesekele bo leng bohlokoa haholo.
  • Phetisetsano: hangata theko e hodimo ho feta Al₂O₃; kgetho e susumetswa ke ditlhoko tsa botshepehi le ho tiya.

Botenya ba Koporo, Mehlala, le Litšitiso tsa Moralo

Hangata DBC e sebelisa koporo e teteaneng ho feta li-PCB tse tloaelehileng. Sena se nolofalletsa ho sebetsana le motlakase o phahameng empa se hlahisa lithibelo tsa bohlokoa tsa ho etsa dipaterone:

  • Mohala/sebaka se fokolang: koporo e teteaneng ka kakaretso e hloka mesaletsa e pharaletseng le sebaka se seholo ka lebaka la lintlha tsa ho tjhesa.
  • Tlhaloso ea moeli: Ho betla koporo e boima ho ka baka diprofaele tse sa sehiloeng hantle le tse ka thoko; dijiometri tsa pad di lokela ho nahana ka mamello ya tlhahiso.
  • Khatello ea mocheso: Libaka tse kholo tsa koporo li ka kenya letsoho khatellong nakong ea potoloho ea mocheso; ho lekana (tekanyo ea koporo e holimo/tlase) ho ka fokotsa ho oa le ho tsepamisa maikutlo khatellong.
  • Moralo oa ho itšehla thajana: Lipheo tsa motlakase li tsamaisa litlhoko tsa ho tlosa le ho kheloha ha motlakase. Likhutlo tse bohale le likheo tse tšesaane li ka eketsa kotsi ea ho ntša metsi ka karolo e itseng libakeng tse nang le motlakase o phahameng.

Lethathamo la tlhahlobo le sebetsang la DFM (mokhahlelo oa sebopeho)

  • Hlalosa motlakase o sebetsang 'me mamella voltage lipheo pele ho nako (melao ea ho tlosa/ho kheloha e latela).
  • Hlalosa botenya ba koporo 'me u netefatse mohala/sebaka se ka hlahisoang le mofani pele u etsa routing ea ho qetela.
  • Qoba ho se leka-lekane ho sa hlokahaleng ha koporo pakeng tsa mealo e ka holimo le e ka tlase.
  • Sebelisa mahlaseli a maholo 'me u qobe likhutlo tse bohale tsa kahare libakeng tse nang le motlakase o phahameng.

Ho Qetella ka Bokaholimo le ho Lumellana ha Kopano

Hangata di-substrate tsa DBC di sebetsa e le motheo wa mekgwa ya ho hokela le ho hokahanya ya semiconductor ya matla. Kgetho ya ho qeta bokahodimo e lokela ho tsamaisana le tshebetso ya kopano e theohelang tlase.

Tlhoko ea kopano Lintho tse tloaelehileng tse lokelang ho nahanoa ka ho qeta Notes
Khokahano ea mohala Qetello e lumellana le litlhoko tsa ho tlama terata ea aluminium/gold Ho hokahana ho ama boemo ba bokaholimo, taolo ea oxidation le bohloeki.
Sehokelo sa solder Qetello e tšehetsang ho kolobisa ha solder le nako ea polokelo Boima ba mocheso le botenya ba koporo li ama ho kgutlela ha phallo ya metsi.
Ho kopanya ka ho tjhesa/hokela ho tswetseng pele Litlhoko tsa ho qetela le tsa planari ea bokaholimo li ka ba thata haholoanyane Buisanang ka mokhoa oa ho hokela esale pele ho qoba ho lokisa mosebetsi le tieho ea ho tšoaneleha.

Bakeng sa dimmojule tse tshepahalang haholo, taolo ya bohloeki, mokgwa wa ho paka le maemo a polokelo e ka ba tsa bohlokwa jwalo ka qetello ka boyona.


DBC vs AMB vs DPC vs LTCC/HTCC

DBC ke e 'ngoe ea litheknoloji tse 'maloa tse thehiloeng ho ceramic. Khetho e lokela ho ipapisa le litlhoko tsa hona joale, tsa mocheso, qeto ea likarolo le lipheo tsa ts'epo.

Technology E ntle ka ho fetisisa ho Likopo tse tloaelehileng Litšebelisano tse kholo
DBC Sethala se phahameng sa motlakase + sethala se matla sa mocheso Dimmojule tsa motlakase, motlakase wa motlakase/wa indasteri Ha e loketse haholo bakeng sa likarolo tse ntle haholo
AMB (Sesepa sa Tšepe se Sebetsang) Tlamo e matla haholo, dikgetho tse phahameng tsa ts'epo Li-module tse tšepahalang haholo, litlhoko tse teteaneng tsa koporo Litšenyehelo tse phahameng; ts'ebetso e ikhethileng
DPC (Koporo e Tloaelehileng e Tloaelehileng) Bokhoni bo botle ba paterone holim'a letsopa Liphutheloana tsa LED, lipotoloho tse nyane tsa letsopa Koporo hangata e tšesaane; bokhoni ba hona joale bo ka ba tlase
LTCC/HTCC Lipotoloho tsa letsopa tse nang le mekhahlelo e mengata, likarolo tse kentsoeng RF/microwave, dimmojule tse rarahaneng tsa ceramic Hase sebaka se tobileng sa liforomo tsa motlakase tsa koporo e boima

Mokhoa oa ho Khetha Substrate e Nepahetseng ea DBC

Khetho ea DBC ke qeto e feto-fetohang ka mefuta-futa. Mokhoa o hlophisitsoeng o thusa ho fokotsa kotsi ea moralo bocha le ho tšoaneleha ha lebelo. Haeba u ntse u hlahloba barekisi, ho sebetsa le moetsi ea ikhethileng oa substrate ea DBC ho ka thusa ho hokahanya likhetho tsa thepa, lithibelo tsa paterone le litlhoko tsa tlhahlobo qalong ea projeke.

Mohato oa 1: Hlalosa lipheo tsa mocheso

  • Tahlehelo ea motlakase ka sesebelisoa le keketseho e lumelletsoeng ea mocheso
  • Mokhoa oa ho pholisa (heatsink, poleiti e batang, convection e qobelloang)
  • Leano la sebopeho (TIM, tlhophiso ea baseplate)

Mohato oa 2: Hlalosa litlhoko tsa ho itšehla thajana ka motlakase

  • Motlakase o sebetsang, ho phahama/ho mamella litlhoko, moeli oa polokeho
  • Litlhoko tsa ho hlakola/ho kheloha ho latela tikoloho le maemo

Mohato oa 3: Hlalosa boemo ba hona joale

  • Hona joale e tsoelang pele le hona joale ea tlhōrō
  • Litebello tsa ho potoloha ha mocheso le ho potoloha ha motlakase

Mohato oa 4: Khetha letsopa ho latela lithibelo

  • E amang litšenyehelo haholo: Hangata Al₂O₃ e lekana
  • Mocheso o lekanyelitsoe: Hangata AlN e khethoa
  • Tšepo/ho tiea ho lekanyelitsoe: Hangata Si₃N₄ e nkoa e le

Mohato oa 5: Lokisa qetello le mokhoa oa ho kopanya

Netefatsa hore na moaho oa hau o ka tlase o sebelisa terata ea ho kopanya, ho solder, sinter, kapa mekhoa e meng ea ho hokela, ebe u bapisa litlhoko tsa ho qeta le tsa bohloeki ka ho loketseng.


Mohlala ho Bolumo: Tšepahala, Teko le Taolo ea Boleng

Ho tloha tlhahisong ea mohlala ho ea tlhahisong ea bophahamo ho hloka ho koala lintho tse fetohang tse amang chai le ts'epo haholo. Haeba u hloka meaho e menyenyane bakeng sa netefatso pele ho ramp, tsela e inehetseng ea DBC substrate prototyping e thusa ho netefatsa tlhahiso le litebello tsa tlhahlobo pele ho boitlamo ba tekanyo ea tlhahiso.

Mabaka a ho tšepahala a ho laola

  • Botšepehi ba tlamo: sebopeho se tsitsitseng sa koporo-serame le taolo e tsitsitseng ea ts'ebetso
  • Bophara/bohlasoa: boleng ba ho kopanya le ho kopanya mojule
  • Moralo oa ho potoloha ha mocheso: jiometri ea koporo, ho lekana, le libaka tse chesang tsa khatello ea maikutlo
  • Boemo ba bokaholimo: taolo ea oxidation le bohloeki bakeng sa lits'ebetso tsa ho kopanya/ho hokela

Likhetho tse tloaelehileng tsa tlhahlobo le liteko (joalokaha ho boletsoe)

  • Tlhahlobo ea pono: Liphoso tsa bokaholimo, boleng ba bohale, botšepehi ba paterone
  • Tlhahlobo ea mahlakore: moralo, botenya, likarolo tsa bohlokoa
  • Teko ea motlakase: ho tswela pele/ho ikarola moo ho sebetsang ho dipotoloho tse nang le dipaterone
  • Karolo e tšekaletseng (haeba ho hlokahala): netefatso ea sebopeho le likarolo tsa sebopeho bakeng sa libaka tsa mangolo a thuto
  • Litokomane: ho sala morao ha sebaka le direkoto tsa tlhahlobo di tsamaellana le ditlhoko tsa moreki

Lethathamo la RFQ: Seo o ka se Fanang ka Khoutu e Potlakileng le e Nepahetseng

Litheko tsa DBC lia fapana haholo hobane khetho ea moralo le thepa e tsamaisa tlhahiso le litšenyehelo. Ho fana ka sephutheloana se felletseng sa RFQ ho thibela ho khutla le ho ea pele 'me ho fokotsa liphoso tsa ho qotsa. Haeba projeke ea hau e akaretsa li-substrate tsa ceramic le liboto tse tloaelehileng, kakaretso ea rona ea tlhahiso ea PCB ea ceramic e ka u thusa ho hokahanya litebello tsa ts'ebetso ho pholletsa le mefuta ea kaho.

Lifaele tse hlokahalang

  • Lifaele tsa mohlala (Gerber kapa tse lekanang) bakeng sa mekhahlelo ea koporo
  • Kemiso ea mechine (e khethiloeng ke DXF) le lintlha tsa ho taka
  • Libaka life kapa life tse khethehileng (libaka tse bolokiloeng, masoba a ho kenya, libaka tse bulehileng tse bohlokoa)

Litlhaloso tse hlokahalang

  • Thepa ea letsopa (Al₂O₃ / AlN / Si₃N₄) le botenya
  • Botenya ba koporo (holimo/tlase; hlalosa haeba bo fapane)
  • Lipheo tse fokolang tsa moeli/sebaka le bonyane ba sebaka sa ho tlosa (kapa tlhoko ea motlakase ho fumana libaka tsa ho tlosa)
  • Tlhokahalo ea ho qeta bokaholimo (le mokhoa o reriloeng oa ho kopanya)

Litlhoko tsa khoebo le tsa moralo

  • Palo ea mohlala le bophahamo ba selemo le selemo bo lebelletsoeng
  • Mokhahlelo oa kaho o reretsoeng (mohlala oa boenjiniere / teko / tlhahiso ea bongata)
  • Litlhoko tsa tlhahlobo/tlhahlobo le litlhoko tsa litokomane
  • Nako ea ho fana ka sepheo le lintlha tsa bohlokoa

Kopa Khoteshene ea DBC Substrate

LBH

1) Karoloana ea DBC e sebelisetsoa eng?

Li-substrate tsa DBC li sebelisoa e le liforomo tsa ho itšehla thajana tsa mocheso le motlakase ka har'a lisebelisoa tsa motlakase tsa motlakase. Hangata li lula tlas'a li-semiconductor tsa motlakase ka har'a li-module, li fetisetsa mocheso ho heatsink ha li ntse li boloka ho itšehla thajana ha motlakase le ho tšehetsa litsela tsa motlakase o phahameng.

2) Na DBC e tšoana le PCB ea letsopa?

DBC ke mofuta oa substrate ea motlakase e thehiloeng ho ceramic. E ka etsoa ka mokhoa o tšoanang le potoloho, empa e sebelisoa haholo-holo bakeng sa ts'ebetso ea matla/mocheso ho fapana le ho tsamaisa lintho ka mokhoa o rarahaneng oa mekhahlelo e mengata ho PCB tse tloaelehileng.

3) Nka khetha pakeng tsa Al₂O₃ le AlN joang bakeng sa DBC?

Kgetha Al₂O₃ ha theko le ho fumaneha e le tsa mantlha mme ditlhoko tsa mocheso di le mahareng. Kgetha AlN ha ho qhalana ha mocheso e le ntlha e thibelang mme ho hlokahala phetiso e phahameng ya mocheso ho fokotsa mocheso wa kgokelo.

4) Si₃N₄ e khethoa neng?

Hangata Si₃N₄ e nahanoa ha ho tiea ha mechini le bophelo bo bolelele ba potoloho ea mocheso li le bohlokoa—joalo ka ho hokahana le libaka tse boima tsa ho thothomela—moo ho tšoarella le ho tšepahala li susumetsang moralo.

5) Ke tlhahisoleseding efe e amang haholo nako le ditjeo tsa DBC?

Bakhanni ba bohlokoa ba kenyelletsa mofuta le botenya ba letsopa, botenya ba koporo, jeomethri ea likarolo (mola/sebaka), qetello ea bokaholimo, litlhoko tsa liteko/litokomane, le bongata. Lipheo tse hlakileng tsa motlakase/karohano le tsona li susumetsa lithibelo tsa sebopeho le chai.

6) Na DBC e ka tšehetsa ho tlamahana ha terata le ho hokela ka die?

E, empa ho tsamaellana ho itshetlehile ka kgetho ya ho qeta, boemo ba bokahodimo, le taolo ya bohloeki. Ho bohlokwa ho totobatsa mekgwa ya hao ya ho hokela le ho hokela esale pele e le hore taolo ya ho qeta le tshebetso e tsamaellane le ditlhoko tsa hao tsa kopano.

7) DBC e bapisoa joang le AMB?

DBC e sebelisoa haholo ebile e theko e tlase bakeng sa lits'ebetso tse ngata tsa motlakase. AMB e ka khethoa bakeng sa matla a holimo a tlamo le litlhoko tse itseng tsa ts'epo e phahameng, hangata ka litšenyehelo tse phahameng le ka litšobotsi tse fapaneng tsa ts'ebetso.

8) Ke lokela ho romela RFQ efe ho qoba tieho?

Romella lifaele tsa paterone ea koporo, moralo oa DXF, mofuta/botenya ba ceramic, botenya ba koporo, tlhoko ea ho qeta, lipheo tsa motlakase/karohano (kapa libaka tse fokolang tsa ho thijoa), bongata ba mohlala le bophahamo bo lebelletsoeng, le litlhoko life kapa life tsa liteko/litokomane.

    Setšoantšo sa Helen Chong, Moeletsi oa Litharollo tsa PCB le Motsamaisi oa Nts'etsopele ea Khoebo ea Linaha Tse Ling ho Highleap Electronics

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    Helen Chong – Moeletsi oa Litharollo tsa PCB le Motsamaisi oa Nts'etsopele ea Khoebo ea Linaha Tse Ling ho Highleap Electronics


    Helen o tšehetsa lihlopha tsa boenjiniere tsa machaba ka litharollo tsa tlhahiso le kopano ea PCB tse tlohang qetellong ho isa qetellong, ho thusa merero ho tloha ho li-prototype tse fetohang kapele ho ea tlhahisong e tsitsitseng ea bongata. Phihlelo ea hae e akaretsa liboto tsa maqhubu a holimo le tsa RF, li-stackups tse rarahaneng tsa mekhahlelo e mengata, theknoloji ea PCB e thata le e feto-fetohang ho pholletsa le liindasteri tse ngata.


    Ka ho fetolela litlhoko tsa tekheniki mererong e sebetsang ea tlhahiso, o thusa bareki ho ntlafatsa tlhahiso, ho fokotsa kotsi, le ho ntlafatsa litšenyehelo le nako ea ho etella pele—ha a ntse a boloka boleng bo tsitsitseng ka tekanyo.

    qotsa hanghang

    Posts kgothaletswa

    Mokhoa oa ho fumana quote bakeng sa li-PCB

    E re re u tsamaise tlhahlobo ea DFM/DFA 'me re khutlele ho uena ka tlaleho.

    U ka kenya lifaele tsa hau ka mokhoa o sireletsehileng ka webosaete ea rona.

    Re hloka lintlha tse latelang ho u fa quote:

      • Gerber, ODB++, kapa .pcb, spec.
      • Lethathamo la BOM haeba o hloka kopano
      • bongata
      • Nako ea ho fetoha
    Ntle le tlhahiso ea PCB, re fana ka mefuta e fapaneng ea lits'ebeletso tsa elektroniki, ho kenyeletsoa moralo oa PCB, PCBA (Printed Circuit Board Assembly), le tharollo ea turnkey. Hore na o hloka thuso ka prototyping, netefatso ea moralo, ho fumana likarolo, kapa tlhahiso e ngata, re fana ka ts'ehetso ea ho qetela ho netefatsa katleho ea morero oa hau. Bakeng sa litšebeletso tsa PCBA, ka kopo fana ka BOM ea hau (Bill of Materials) le litaelo tse itseng tsa kopano. Re boetse re fana ka tlhahlobo ea DFM/DFA ho ntlafatsa meralo ea hau bakeng sa tlhahiso le kopano, ho netefatsa ts'ebetso ea tlhahiso e boreleli.






      Keletso e potlakileng: Sehlopha sa rona se tla u romella lengolo-tsoibila hang ka mor'a tlhahiso. Ho netefatsa hore o fumana karabo ea rona, re khothaletsa ka mosa ho sheba SPAM / JUNK FOLDER ea hau haeba u sa bone molaetsa oa rona ho inbox ea hau.