Flex PCB Assembly Services – High-Quality Flexible Circuit Board Assembly by Highleap
Looking for reliable Flex PCB assembly services? Highleap offers fast-turn, high-quality flexible PCB manufacturing and assembly, from prototype to mass production. Request your free quote today!
Flexible Circuit Board Assembly Services
Are you facing challenges with flexible PCB assembly — unstable quality, delayed deliveries, or difficulties scaling from prototypes to mass production?
At Highleap Electronics, we specialize in one-stop Flex PCB manufacturing and assembly services, addressing every critical pain point:
fast turnaround, stable quality, scalable production, and strong after-sales support.
Whether you need small-batch flexible PCB assemblies for pilot testing or mass production volumes, we ensure your project stays on time, on spec, and on budget — every time. Our services cover the full range of flex circuit assemblies, including high-precision PCB assembly flexible solutions for IoT wearables, consumer devices, and mission-critical medical products. With optimized workflows and advanced carrier systems, we streamline flexible circuit board assembly with consistency and speed.
Why Choose Highleap for Your Flex PCB Assembly?
At Highleap Electronics, we specialize in comprehensive flex PCB solutions—including multi-layer flex circuits, HDI flex PCB assembly, and advanced flexible substrates for wearables, automotive, medical, and consumer electronics. From fabrication and assembly to component sourcing, functional testing, and packaging, we deliver end-to-end services with fast turnaround, strict quality control, and full-volume flexibility. In addition to standard flex PCBs, we are also an experienced provider of rigid flex PCB manufacturing, helping customers reduce interconnects and improve durability in space-constrained designs.
Here’s why leading companies trust Highleap for their flex PCB projects:
1. One-Stop Flex PCB Manufacturing and Assembly
We handle everything in-house—fabrication, SMT assembly, sourcing, testing, and packaging—eliminating delays, miscommunication, and quality inconsistencies between suppliers.
2. Seamless Transition from Prototypes to Mass Production
Start with as few as 5 units and scale up to 100,000+ pieces per month—without switching suppliers or requalification hassles.
3. Superior Quality Assurance
- 100% AOI inspection for every board
- X-ray inspection for BGA, QFN, and fine-pitch components
- Functional testing and custom test fixtures available
- IPC Class 2 and Class 3 compliant manufacturing
4. Fast Lead Times You Can Rely On
- Prototype Flex PCB Assembly: 5–7 working days
- Low-Volume Production: 7–10 working days
- Mass Production: Flexible scheduling to match your project timeline
5. Expert Material Handling
We work with a wide range of flexible materials, including:
- Polyimide (PI) and PET substrates
- Coverlay films and stiffeners (FR4, polyimide, stainless steel, aluminum)
- Adhesive-less laminates for enhanced flexibility and reliability
6. Dedicated After-Sales Support
- 24-hour engineering assistance
- Rapid response to quality concerns
- Free failure analysis reports when needed
Our Process — Fast, Smooth, and Transparent
To kick off your project, simply send us the required files. Typically, this includes Gerber files, Bill of Materials (BOM), Pick-and-Place files, and Assembly Drawings. However, we’re flexible and can also accept other formats like IPC-2581, ODB++, or DXF files for specific design requirements. If you’re new to working with us or transitioning from another supplier, feel free to reach out. Our team will assist you in selecting the appropriate files, ensuring a seamless process from start to finish.
Send Your Files
(Gerber files, BOM list, Pick-and-Place files, Assembly Drawings)
Quotation Within 24 Hours
Detailed pricing and lead time for both PCB and assembly.
Prototype Assembly
Get your assembled flex PCB prototypes in as little as 5–7 days.
Sample Confirmation and Feedback
Review the assembled sample, provide feedback, and we’ll fine-tune the process before full production.
Mass Production
Scaled production with consistent quality, no surprises. Whether you’re starting with a prototype or ramping up to full-scale flexible printed circuit assembly, we offer scalable production backed by efficient logistics and real-time BOM optimization. Highleap supports both agile flex PCB SMT assembly and stable high-volume deliveries.
After-Sales Support
Responsive support team available anytime after delivery.
Ready to Start Your Flex PCB Assembly Project?
Whether you’re launching a new flexible electronics product or scaling up an existing design,
Highleap Electronics is your trusted Flex PCB Assembly partner.
From prototype to full production, we ensure you get
high-quality flexible assemblies, on time, every time.
Contact us today for a fast, detailed quote — and experience seamless flexible circuit assembly and rigid flex PCB manufacturing from one of the industry’s most trusted flex PCB manufacturers.
High-Precision Flex PCB Assembly — Built for Speed, Reliability, and Scale
Struggling with delayed deliveries, inconsistent quality, or limited flexible PCB assembly capabilities? Our team tackles even the most complex flex circuit assemblies with IPC Class 3 precision and scalable, high-yield processes. At Highleap Electronics, we specialize in multi-layer flex PCB, HDI flex, and rigid-flex PCB assembly, combining rapid prototyping (as fast as 5–7 days) with IPC Class 3 quality and full BOM sourcing — all under one roof.
From 1–16 layer flexible circuits to low-volume pilot runs and mass production, our factory supports every step with:
- 100% AOI & X-ray testing for critical joints
- English-speaking support and global logistics
- Real-time BOM matching and cost optimization
- Vacuum carrier systems for zero warpage during reflow
- Seamless scale-up from prototype to 100,000+ pcs/month
Whether you’re building medical wearables, automotive modules, or aerospace-grade flex boards — send us your files today and get a quote within 24 hours.
Flex PCB Assembly Process
FPC Pretreatment
Prior to SMT assembly, the flex circuit requires baking at 80-100°C for 4-8 hours to remove absorbed moisture and prevent vaporization defects during reflow.
Carrier Fixture Preparation
The flex circuit is fixed to a carrier fixture for stability during assembly. Fixtures use precision pins or holes to align the flex circuit. Materials like silicone, magnetic steel, and synthetic stone provide optimal thermal and mechanical properties while minimizing warpage.
FPC Positioning
The flex circuit is carefully positioned on the carrier fixture and fixed with high-temperature tape on all sides. This prevents shifting or warpage during processing. Spring-loaded pins allow pressing during printing. Minimal time between positioning and soldering is ideal. Operators wear finger cots to avoid contaminating the flex circuit. The fixture is cleaned before reuse.
Solder Paste Printing
Solder paste is precisely printed on SMT pads through a matching stencil. Automatic inspection verifies alignment and paste release. Adhesive carriers may be used to aid thin flex circuit stability.
SMT Component Placement
Components are accurately placed on solder paste using automated pick-and-place machinery. Special carriers maintain stability. Optical and mechanical checks verify placement accuracy.
Reflow Soldering
The assembly enters a reflow oven to attach components. The fixture prevents flex circuit warpage under heat. Precise thermal profiles ensure quality solder joints without overheating.
Inspection and Testing
Automated optical, X-ray, and electrical testing validate solder connections, placement, board integrity and functionality. Failed boards are reworked or scrapped.
Fixture Removal and Final Inspection
Fixtures are carefully detached prior to final visual inspection and quality control. Approved assemblies are packaged for delivery.
Flex PCB Assembly Characteristics
Flex PCB Assemblies (PCBAs) provide unique benefits but also pose distinct manufacturing challenges compared to rigid PCBAs due to the flexible, dynamic nature of the base material. Key Flex PCB Assembly characteristics include
- Materials – The thin, flexible substrates consist of polyimide, polyester, or other polymer films with very low rigidity. They are combined with flexible conductive traces of copper or aluminum.
- Layer Stackup – Flex circuits typically have 1-2 conductive layers, although some complex designs may have up to 6 layers. The simpler construction aids flexibility.
- Geometries – Tight bend radii, dynamic flexing regions, and three-dimensional shapes are enabled by the flexible materials.
- Interconnections – Layer-to-layer connections rely on conductive adhesives or flexible solders rather than plated through holes. Flat flex cables can terminate in connectors.
- Assembly Processes – Carrier boards provide rigidity for SMT assembly steps like screen printing, pick-and-place, and reflow soldering. Dedicated flex component packages are used.
- Inspection – Optical and X-ray methods are adapted for the low-contrast flexible materials. Electrical testing requires fixturing strategies.
- Reliability – Dynamic flexing leads to fatigue over lifetimes. Adhesives and solders must withstand flexing stresses. Hermetic seals are challenging.
The combination of delicate materials and dynamic flexing introduces difficulties in Flex PCB Assembly, such as maintaining registration accuracy, achieving robust bonds, preventing warpage, mitigating fatigue, and inspecting low-contrast features. However, proper design strategies and advanced assembly processes can overcome these challenges to fully realize the advantages of flex circuits. Revolutionize your product with flex PCBs built to last by Highleap’s advanced Flex PCB Assembly processes.
Key Equipments in Flex PCB Assembly
Contact us now to discuss how Highleap’s engineering methods and expertise in flexible PCBs can bring your complex flexible circuit designs to production with unparalleled quality, reliability, and yield. Below are specific details on key equipment in flex PCB assembly：
1. Solder Paste Printer
Solder paste printers accurately deposit solder paste on SMT pads through a stencil. For flex circuits, printers must handle thin, delicate materials and often utilize carrier boards for stability. Optical alignment and inspection ensures proper registration.
2. Pick-and-Place Machine
Also known as placers or surface mount devices (SMD) machines, these rapidly and precisely place components onto solder paste deposits. Flexible feeders and optimized placement heads are required for thin flex circuits.
3. Reflow Oven
Reflow ovens use precisely controlled heat profiles to form solder joints between components and pads. Forced convection and/or infrared heating is optimized for flex circuit materials to prevent warpage.
4. Automated Optical Inspection (AOI)
AOI systems use cameras and software to automatically detect assembly defects like missing solder, misplaced components, etc. Flexible board inspection requires high-resolution cameras and advanced algorithms.
5. Component Trim and Form
These machines cut, bend, and form odd-shaped component pins to enable hand soldering or insertion into PCBs.
6. Wave Soldering
A wave solder machine forms a molten solder wave to simultaneously attach leaded components and connectors to a PCB. Flex boards may require carrier boards and edge masking.
7. Hand Soldering Station
Operators use soldering irons, hot air tools, and microscope inspection for manual soldering, repairs, and rework. Fume extraction is critical.
8. Cleaning System
Aqueous, semi-aqueous, or solvent cleaning removes flux residues from PCBA boards after soldering. Flex boards require optimized contact methods.
9. In-Circuit Test (ICT)
ICT fixtures contact test points on an assembled PCB to validate solder joints, component placement, and electrical connections using a bed-of-nails.
10. Functional Test (FCT)
FCT applies simulated electrical inputs to a functioning board and validates the outputs match specifications and design functionality.
11. Environmental Stress Screening
Burn-in rigs subject boards to thermal cycling and vibration over time to precipitate early product failures before shipment.
Soldering Requirements for Flex PCB Assembly
Joint Geometry
Ensure proper pin height for through-hole components and flat positioning for SMDs with smooth fillets. Avoid insufficient solder coverage, balling, or solder on pads.
Fillet Shape
The solder fillet shape should be conical, smoothly covering the entire pad area to ensure proper soldering integrity.
Wetting and Adhesion
The solder joints must exhibit complete wetting of pads and pins, with no occurrence of dry or cracked joints, ensuring robust adhesion and reliable electrical connections.
Joint Height
Solder joint height should be at least 1mm for single-sided boards and 0.5mm for double-sided boards, with good wetting underneath terminations.
Joint Finish
The solder joint surface should be smooth, shiny and free of defects like flux residue, exposed copper, spikes and pits.
Component Placement
Through-hole components and pin headers should be mounted flush, aligned within specifications and straight/level. Components should float no more than 0.5mm off the board.
Explore Highleap Electronic components sourcing Services.