RF and Microwave PCB
Highleap produces RF and Microwave PCB with multiple layers range from double-sided to the 32 layers, and the thickness range from 1oz to 6oz.
RF and Microwave PCB Manufacturing Services
At Highleap Electronics, we specialize in the manufacturing of RF (Radio Frequency) and Microwave PCBs designed to support signal frequencies from 100MHz up to 30GHz and beyond. These advanced circuit boards are engineered to meet the stringent electrical and thermal requirements of high-frequency communication systems.
RF PCBs typically operate above 100MHz, while Microwave PCBs handle signals above 2GHz. Both are critical in today’s wireless and high-speed systems, including cellular infrastructure, satellite communications, radar systems, GPS modules, automotive radar, and medical imaging.
With years of experience and access to top-tier RF materials like Rogers, Taconic, and Isola, we provide reliable, high-performance PCB solutions with tight impedance control and minimal signal loss—whether you’re developing a prototype or scaling to volume production.
Each RF and microwave PCB project requires a tailored approach to meet the demands of high-frequency signal transmission. At Highleap Electronics, we leverage cutting-edge fabrication technologies and strict process control to ensure signal integrity, low insertion loss, and consistent impedance across all frequency ranges.
Whether you’re working with multi-layer hybrid stackups, complex cavity structures, or mixed-material designs, our engineering team delivers customized PCB solutions that meet both functional and performance goals. The boards shown below are just a few examples of our capabilities in delivering high-frequency circuit boards for applications ranging from radar and satellite to 5G base stations and RF amplifiers.
Professional RF and
Microwave PCB Supplier
Highleap provides free one-on-one engineering support and DFX to RF and microwave PCBs projects.
Basic of RF and Microwave PCB
In essence, an electronic signal is a quantity that varies over time and communicates some kind of information. The quantity that varies is usually voltage or current. These signals are passed between devices as a way to send and receive information, like audio, video or encoded data. While these signals are often transmitted through wires, they can also be passed through the air by radio frequency, or RF, waves.
These radio frequency waves vary between 3 kHz and 300 GHz, but they are subdivided into smaller categories for the sake of practicality. These categories include the following:
Low-Frequency Signals
These are the signals handled by most traditional analog components, and they include signals with frequencies up to 50 MHz.
RF Signals
RF signals cover a wide frequency range, but in circuit design, they usually refer to frequencies from 50 MHz to 1 GHz, which are also used in AM/FM transmission.
Microwave Signals
Microwave signals have frequencies above 1 GHz, up to around 30 GHz. They are used for cooking in microwave ovens and high-bandwidth signal communication.
Material for RF and Microwave PCB
RF and microwave PCBs are typically built using advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and co-efficient of thermal expansion (CTE).
RF and microwave PCBs‘ materials used in PCBs typically consist of a combination of PTFE , ceramics, hydrocarbon, and various forms of glass. The choice of material depends on factors such as quality, cost, ease of manufacturing, electrical performance, thermal robustness, and resistance to moisture.
Quality first
PTFE with microglass fiber or woven glass is often preferred. This material offers excellent electrical properties but may come at a higher cost. If budget constraints exist while maintaining high quality, ceramic-filled PTFE is a suitable alternative that provides good performance while being easier to manufacture, thereby reducing costs.
Cost concern
Ceramic filled with hydrocarbon is even more cost-effective to produce, but it may result in a slight decrease in signal reliability compared to other options.
Thermal robustness
Thermal robustness is crucial for applications exposed to soldering stresses, demanding drill scenarios in multilayer boards, or thermally challenging environments like aerospace. PTFE with microglass fiber or woven glass has excellent electrical properties but a high coefficient of thermal expansion (CTE). On the other hand, ceramic-filled PTFE offers great electrical characteristics and a low CTE, making it a thermally tougher choice. Ceramic-filled hydrocarbon sacrifices some electrical performance but maintains a very low CTE.
Moisture absorption
Moisture absorption is important to consider. PTFE ceramic has a lower rate of absorption, but adding woven glass can increase it. However, incorporating hydrocarbon in PTFE ceramic leads to a smaller increase in absorption, providing a balanced choice between cost and resistance to wet environments.
Consumer Electronics
Military/Space
High Power Applications
Medical
Automotive
Industrial
RF Materials
Bonding Materials
Attributes
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Contact us directly to explore these options further and determine the best solutions for your RF PCB needs. Our team at Highleap is ready to assist you in achieving optimal results for your project.
The Guidelines for RF PCB Design
To ensure optimal performance of RF and microwave PCBs, it is important to follow certain design considerations:
1. RF Component Placement:
When designing an RF and microwave PCBs, digital designers should Carefully place RF components on the PCB to minimize signal loss and interference. Group related components together to reduce trace lengths and improve signal integrity.
2.Grounding and Power Distribution
3.Transmission Line Design
Use controlled impedance transmission lines to maintain signal integrity. Match the characteristic impedance of the transmission lines with the source and load impedance to minimize signal reflections.
4.Routing and Trace Length
Keep RF and microwave PCBs traces as short and direct as possible to minimize signal loss and interference. Use wide traces to reduce resistance and inductance.
5.Noise Mitigation
6.PCB Stack-up
Choose an appropriate RF and microwave PCBs stack-up that provides sufficient isolation and controlled impedance for RF and microwave signals. Consider using dedicated RF layers and separate power and ground planes.
7.EMI Shielding
8.Thermal Management
RF and Microwave PCB Manufacturing Capabilities
Highleap Electronics specializes in the precision manufacturing of RF and Microwave PCBs, supporting frequencies from 100MHz to 30GHz and beyond, meeting the stringent requirements for high signal integrity and low loss in communication, radar, aerospace, and medical imaging applications.
We employ the following key processes and controls in our manufacturing:
- High-Frequency Material Handling Expertise: Supporting PTFE and low-Dk materials such as Rogers RO4000/RO3000, Taconic, Isola Astra, F4B, TP-2, etc., ensuring stable dielectric constants and low loss.
- Laser Direct Imaging (LDI): Used for fine line width/spacing pattern transfer, enhancing edge clarity, and adapting to high-density RF routing designs.
- Thick Copper and Multi-Layer Lamination Capability: Supporting multiple vacuum lamination cycles, ensuring uniform dielectric layers without voids or delamination.
- Strict Dielectric Thickness Control: Ensuring consistent layer spacing through AOI, profilometers, and test coupons to maintain impedance continuity.
- Microwave Hole Copper Plating Control: Precision control of copper plating thickness for blind/buried vias to prevent reflection and signal loss.
- High-Frequency Circuit Surface Finishing: Supports ENIG, immersion silver, OSP, immersion gold + soft gold edges, balancing solderability and high-frequency performance.
Whether for high-power transmission paths, RF amplifier circuits, or multi-layer hybrid structures, we have extensive experience in volume manufacturing, ensuring each board meets the performance standards of high-frequency systems.
RF and Microwave PCB Assembly Services
Assembly of high-frequency PCBs requires high-precision placement capabilities while maintaining signal integrity and thermal management performance throughout the process. Highleap Electronics offers complete SMT and through-hole assembly services optimized for RF and Microwave products.
Our assembly services offer the following features:
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Precise Placement and Low Tolerance Control: Supporting assembly of components like 01005, micro QFN, LGA, uBGA, SMA connectors, ensuring that critical RF path component positions and deviations are within ±50μm.
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Thermal Protection for Sensitive Components: Temperature-controlled reflow soldering for power-sensitive components like PA and LNA, ensuring reliability.
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High-Frequency Connector Soldering: Supports precise soldering of coaxial interfaces such as SMA, MMCX, N-type, and includes high-frequency return loss testing.
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Automated Optical and X-Ray Inspection: Combines AOI and X-ray testing to enhance placement accuracy and solder joint consistency, preventing issues like cold solder joints and bridges.
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RF Testing Support: S-parameter, VSWR, and network analyzer tests are available upon customer request to ensure the product is ready for real-world applications.
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Lead-Free/Lead Soldering Process Compatibility: Provides both RoHS-compliant and high-reliability leaded assemblies, adaptable to various industry applications.
We do not just assemble circuit boards but offer a complete RF performance assurance platform to help customers quickly transition from engineering samples to full-scale production validation.
Why Leading Brands Choose Highleap for RF PCB Manufacturing & Assembly
In RF and Microwave product development, clients face not only PCB manufacturing but also challenges in material selection, impedance control, EMC suppression, thermal management, and system-level signal integrity. Highleap Electronics offers a complete one-stop service, from design review to final product delivery.
Our one-stop solution offers the following advantages:
- Integrated Manufacturing + Assembly: From RF material sourcing, lamination manufacturing, impedance modeling, assembly testing, to final product delivery, all processes are controlled by Highleap, reducing collaboration errors between multiple suppliers.
- Engineering Support and Co-Development: We provide stack-up design advice, impedance calculations, signal path optimization recommendations, and work closely with customers’ hardware teams.
- RF-Specific DFM and DFA Review Mechanisms: Helping customers identify potential production risks, improving yield from the design phase.
- Flexible Delivery Model: Supporting small-batch validation runs and large-scale stable mass production, with delivery cycles as fast as 7 business days.
- International Quality Certification System: Compliant with ISO 9001, ISO 13485, IATF 16949, and other industry-specific quality management standards, serving global customers.
Our customers include RF front-end device manufacturers, military communication equipment suppliers, automotive millimeter-wave radar module developers, and leading global medical imaging solution providers. Choosing Highleap means choosing a deeply involved partner, not just a manufacturer.
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