Rigid PCB Capability
Capability of manufacturing up to 60-layer rigid PCB .
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Highleap Rigid PCB Capability
In the table below is a comprehensive list of Highleap’s rigid PCB manufacturing capabilities. This list is designed to help you understand if Highleap’s capabilities are a match for your design. It will also allow you to plan ahead and create your design within these capabilities so that you can be sure Highleap can produce your PCB.
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Capabilities
Highleap’s rigid PCB manufacturing capabilities provide industry-leading solutions for a wide range of applications, from standard FR4 PCBs to complex HDI (High-Density Interconnect) multilayer boards. With the capability to produce up to 60-layer rigid PCBs, we support sophisticated, high-performance designs that require precision, reliability, and rapid turnaround.
Comprehensive Rigid PCB Capabilities
At Highleap, we provide advanced FR4 PCB manufacturing, known for stability and cost-effectiveness across diverse applications, ensuring high performance and durability. Our HDI PCB capabilities support high-density, complex designs with fine traces and microvias, ideal for telecommunications and miniaturized devices. We also specialize in multilayer PCB manufacturing with up to 60 layers, delivering robust interlayer connectivity for compact, high-performance designs. For high-frequency and RF applications, our PTFE-based PCBs ensure low dielectric loss and superior thermal stability, while our high-speed PCB solutions maintain low signal distortion, ideal for fast data rate environments.
Our capabilities extend to RF PCB manufacturing, providing stable performance for wireless, aerospace, and military applications, as well as thermal management solutions with thermal vias and copper heatsinks for high-power electronics. With precise impedance control, we meet stringent signal integrity needs in HDI, RF, and high-speed PCBs, and heavy copper PCBs up to 10 oz support power-intensive applications, enabling efficient heat dissipation.
Highleap offers a range of customizable surface finishes—ENIG, HASL, Immersion Silver, and Hard Gold Plating—enhancing solderability and corrosion resistance for various assembly processes. For custom, non-standard designs, our engineering team conducts a comprehensive process review to meet unique project requirements. Contact us to discuss your PCB specifications and let us provide a tailored solution to bring your vision to life.
Key Features of Highleap’s Rigid PCB Manufacturing
- Layer Count: Up to 60 layers, suitable for advanced applications requiring multiple connections.
- Min Trace/Space: Inner and outer layers can achieve a minimum trace/space of 2/2 mil, allowing for compact, high-density routing.
- Copper Thickness: Maximum copper for inner and outer layers is 10 oz, supporting high-current and power-intensive applications.
- Aspect Ratio: Mechanical drilling up to 20:1 and laser drilling at 1:1 for precision drilling, essential for HDI designs.
- Surface Finishes: A variety of finishes, including ENIG, HASL, OSP, Immersion Silver, and ENEPIG, ensure compatibility with your specific application and enhance solderability.
- Impedance Control: Single-ended and differential impedance tolerance within ±5Ω (≤50Ω) or ±7% (>50Ω), ideal for high-speed signal applications.
Our extensive quality assurance program aligns with IPC standards, ensuring our rigid PCBs meet stringent quality and performance requirements. With worldwide reach, Highleap delivers reliable, high-quality PCBs tailored to the precise needs of your design. For projects with special requirements or unique design challenges, please contact us for a personalized evaluation and a solution that meets your specifications.
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