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Types of HDI PCB

HDI PCBs are available in various types, here are some common types of HDI PCBs:

Highleap Electronics HDI PCB Manufacturing Process

HDI Process Flow for Double-Sided and Multilayer Daughter Boards when Blind Via stack on Buried Via

The HDI (High-Density Interconnect) manufacturing process for both Double-Sided and Multilayer Sub Boards follows a detailed set of steps, ensuring high precision and performance in the final product. As we move through the steps of the process, key parameters such as trace width, copper thickness, and various plating stages play a critical role in determining the final quality of the PCB. Below is a breakdown of the process steps for both types of sub-boards and key considerations for PCB design.

Double-Sided Daughter Board Process (POFV)

Start with substrate → Pre-bake the substrate after cutting → Copper thinning (8±1μm) → Drill holes → Deburring → Copper plating → Negative plating → Resin plugging → Polishing → Copper thinning (15±3μm) → Polishing (Stage 2) → Copper plating 1 → Board plating → Board plating 1 (Two stages of board plating to increase the copper thickness on buried holes by 15μm) → Negative plating polishing → Inner dry film 1 → Dry film inspection → Inner etching 1 → Inner AOI inspection → Brown oxidation.

Multilayer Daughter Board Process (POFV)

Start with substrate → Pre-bake the substrate after cutting → Inner dry film → Inner etching → Inner AOI inspection → Brown oxidation → Lamination → Pre-bake 1 → Edge milling → Copper thinning (8±1μm) → Drill holes → Deburring → Copper plating → Negative plating → Resin plugging → Polishing → Copper thinning (15±3μm) → Polishing (Stage 2) → Copper plating 1 → Board plating → Board plating 1 (Two stages of board plating to increase the copper thickness on buried holes by 15μm) → Negative plating polishing → Inner dry film 1 → Dry film inspection → Inner etching 1 → Inner AOI inspection → Brown oxidation 1.

The described HDI processes for both Double-Sided and Multilayer Daughter Boards ensure that the boards meet high standards for density, performance, and reliability. The parameters for trace width, spacing, and copper thickness are critical for ensuring that the boards meet the demanding requirements of high-speed and high-frequency applications. The process steps, including plating, etching, and inspection, ensure that each layer is properly formed and interconnected, contributing to the overall functionality and quality of the final product.

No Stacked Laser Blind Vias Multilayer Daughter Board Process with Negative Plating + Resin Plugging (Not Meeting PP Filling Conditions)

Start with substrate → Pre-bake the substrate after cutting → Inner dry film lamination → Inner etching → Inner AOI inspection → Brown oxidation → Lamination → Pre-bake 1 → Edge milling → Copper thinning (8±1μm) → Drill holes → Deburring → Copper plating → Negative plating → Resin plugging → Polishing → Copper thinning (as required) → Polishing (Stage 2) → Inner dry film 1 → Dry film inspection → Inner etching 1 → Inner AOI inspection → Brown oxidation 1

Based on the above process flow, it is evident that the HDI PCB stack-up design significantly influences the subsequent CAM engineering process. Different design choices and manufacturing methods can greatly affect the creation of Gerber files, which are essential for PCB production. As a result, complex HDI PCB stack-up designs often require more time for CAM preparation and necessitate additional engineering QA. To save both time and costs, designers should consult with us early when working on intricate HDI PCB stack-ups. By adopting this proactive approach, potential issues can be identified and addressed sooner, leading to streamlined processes, reduced errors, and significant resource savings.

Laser Hole Layer Process and Circuit Production Capability (Inner Layer)

Multilayer Daughter Board Without Buried Vias: Electroplating Hole Filling

Lamination → Pre-bake the substrate → Edge milling → Drill holes (board edge holes) → Brown oxidation 1 → Laser drilling → Plasma treatment → Chemical cleaning → Blind hole inspection → Copper plating 2 → Board plating 1 → Electroplating hole filling → Copper thinning (as needed) → Inner dry film 2 → Inner etching 2 → Inner AOI inspection 1 → Brown oxidation 2

Multilayer Daughter Board with No Stacked Laser Blind Vias Using Negative Plating + Resin Plugging (Not Meeting PP Filling Conditions)

Lamination → Pre-bake the substrate → Edge milling → Drill holes (board edge holes) → Brown oxidation 1 → Laser drilling → Plasma treatment → Chemical cleaning → Blind hole inspection → Drilling → Copper plating 2 → Negative plating → Resin plugging → Polishing → Copper thinning (as needed) → Polishing (Stage 2) → Inner dry film 2 → Dry film inspection → Inner etching 2 → Inner AOI inspection 1 → Brown oxidation 2

This process ensures accurate creation of high-density interconnections for multilayer daughter boards. For boards without buried vias, steps like laser drilling, plasma treatment, and chemical cleaning are performed to ensure precise via formation. After the blind hole inspection, copper plating, and electroplating hole filling, the copper is thinned to meet the required specifications.

For boards with no stacked laser blind vias, the process includes negative plating and resin plugging, ensuring that vias are properly filled. The use of laser drilling and subsequent steps ensures clean and accurate via formation. The process concludes with polishing, copper thinning, and further inspection to guarantee the board meets performance standards for high-speed and high-frequency applications.

HDI PCB Motherboard (Outer Layer) Process

Electroplating Hole Filling + Pattern Plating

Lamination → Pre-bake 1 → Edge milling → Drill board edge holes → Brown oxidation → Laser drilling → Plasma treatment → Chemical cleaning → Blind hole inspection → Copper plating 1 → Board plating 1 → Electroplating hole filling → Copper thinning (12±3μm) → Drilling → Positive photoresist process

Pattern Plating

Lamination → Pre-bake 1 → Edge milling → Drill board edge holes → Brown oxidation → Laser drilling → Plasma treatment → Chemical cleaning → Blind hole inspection → Drilling → Positive photoresist process

Negative Plating + Resin Plugging + Pattern Plating

Lamination → Pre-bake 1 → Edge milling → Drill board edge holes → Brown oxidation → Laser drilling → Plasma treatment → Chemical cleaning → Blind hole inspection → Resin drilling → Deburring 1 → Copper plating 1 → Negative plating → Resin plugging → Polishing → Copper thinning (15±3μm) → Drilling → Positive photoresist process

Plating Hole + Resin Plugging + Pattern Plating

Lamination → Pre-bake 1 → Edge milling → Drill board edge holes → Brown oxidation → Laser drilling → Plasma treatment → Chemical cleaning → Blind hole inspection → Resin drilling → Deburring 1 → Copper plating 1 → Board plating → Plating hole → Resin plugging → Polishing → Drilling → Positive photoresist process

Process Explanation and Key Parameters

The processes described are designed to create high-quality multilayer circuits for motherboards, focusing on methods such as electroplating hole filling, pattern plating, and resin plugging to achieve reliable electrical connections. For electroplating hole filling, precision in copper thinning and hole filling ensures optimal signal integrity and performance in high-density designs.

For negative plating and resin plugging, the process involves more advanced techniques to ensure that the vias are properly filled and the surface remains smooth for pattern plating. The minimum trace width and trace spacing values are critical for high-performance applications, ensuring that the motherboard can handle high-speed signals while maintaining reliability.

Highleap Electronics HDI PCB One-Stop Assembly Service

Highleap Electronics provides a comprehensive HDI PCB (High-Density Interconnect) assembly service, offering a seamless, one-stop solution for your PCB needs. Our HDI PCB assembly service covers everything from design and prototyping to manufacturing and final assembly, ensuring that your products are delivered on time, with high performance and precision.

Our HDI PCB manufacturing process leverages the latest in technology, enabling us to produce highly dense circuit boards that are critical for applications requiring small form factors, high-speed performance, and high-frequency capabilities. With our one-stop service, we handle all aspects of the assembly process, including:

• Design Support: Our team works closely with you to ensure your HDI PCB design meets both functional and manufacturability standards.
• Prototyping: We provide quick-turn prototyping services, allowing you to test your design before full-scale production.
• Manufacturing: From laser drilling and microvia formation to lamination and copper plating, we use the best practices in HDI PCB manufacturing to produce high-quality boards.
• Assembly: We assemble your HDI PCBs using the latest equipment, ensuring that components are placed accurately, with efficient soldering and testing to ensure reliable performance.
• Testing and Inspection: Our thorough testing processes, including AOI (Automated Optical Inspection) and X-ray inspection, ensure that each board meets strict quality standards.

By offering a one-stop solution, Highleap Electronics minimizes the need for multiple suppliers, reducing lead times and simplifying logistics. Whether you need low-volume prototypes or large-scale production runs, we are committed to delivering high-quality HDI PCBs tailored to your specific needs. Our dedicated team ensures that every project is handled with the utmost attention to detail and quality, making us the ideal partner for your HDI PCB assembly requirements.

HDI PCB Manufacturing Capabilities

We offer a comprehensive range of HDI PCB manufacturing capabilities, ensuring high precision and reliability for various applications. Our advanced technology enables us to produce a variety of HDI PCBs, including Blind Vias HDI PCBs, where vias connect one layer to another without passing through the entire board; Buried Vias HDI PCBs, where vias connect inner layers but do not reach the surface; Microvia HDI PCBs, featuring fine vias for compact, high-density applications; and Laser Drilled Holes, where state-of-the-art laser drilling technology is used to create precise microvias and holes, ideal for high-density circuit designs with tight tolerances. This technology is particularly well-suited for applications that require minimal board space and high performance.

HDI PCB Process and Line Capabilities

Our manufacturing process supports a variety of copper thicknesses, offering flexibility for different design requirements. We handle copper thicknesses ranging from 0.33 oz to 1 oz, with a maximum finished copper thickness of 25μm for 0.5 oz copper and 35μm for 1 oz copper. This range allows us to meet a variety of performance specifications while ensuring consistent quality across different board types.

Our production capabilities also include fine line widths, with the ability to achieve line widths as narrow as 2.0 mil for 0.5 oz copper and 2.5 mil for 1 oz copper. These fine widths are essential for creating highly compact designs that demand precision and efficiency, particularly in high-speed and high-frequency applications.

Advanced HDI PCB Technologies

We employ advanced technologies to ensure the highest quality and performance of our HDI PCBs:

• Back Drilling: A technique used to disconnect part of the plated-through hole from other layers inside, reducing signal integrity issues and ensuring better performance in high-speed applications.
• Controlled Depth Drilling/Milling: Precision-controlled drilling ensures accurate hole depth and alignment, which is crucial for multi-layer designs.
• Buried Capacitance: By incorporating a thin dielectric layer, we enhance signal integrity with distributive decoupling capacitance, optimizing the performance of high-speed signals.
• Hole Tolerances: Our high-precision drilling equipment allows us to maintain tight hole tolerances and accurate hole locations, essential for reliable interlayer connections and through-hole insulation.

With these advanced manufacturing technologies, we can produce HDI PCBs that meet the highest industry standards, ensuring reliability, performance, and efficiency for all applications.