Quality Assurance

Quality assurance is the top priority

Quality assurance in PCB manufacturing and PCB assembly process plays a pivotal role in delivering reliable and high-performance electronic products. From the initial Design for Manufacturability (DFM) check to final functional testing, every step is meticulously executed to guarantee the utmost quality. Here’s Highleap Electronic quality assurance measures employed in the process:

DFM (Design for Manufacturability)Check

DFM (Design for Manufacturability)Check

This early-stage assessment ensures that the design is optimized for manufacturing. It involves collaboration between design and manufacturing teams to identify potential issues, eliminate design flaws, and enhance manufacturability, thus preventing costly errors later in the production process.

First Article Inspection

First Article Inspection

First Article Inspection involves inspecting the first product off the production line thoroughly. It verifies whether the product meets all specifications, tolerances, and quality standards. Any deviations are addressed promptly to ensure consistent quality throughout production.

IQC (Incoming Material Control )

IQC (Incoming Material Control )

IQC focuses on the quality of raw materials, components, and parts received from suppliers. Rigorous inspections and tests are conducted to ensure that the incoming materials meet required specifications and are free from defects.

AOI(Automated Optical Inspection)

AOI(Automated Optical Inspection)

AOI employs advanced optical technology to inspect PCBs for defects such as missing components, misaligned components, solder joint issues, and more. It detects defects that may not be visible to the human eye, ensuring high precision and accuracy.

X-ray inspection

X-ray inspection

X-ray inspection is used to examine hidden features, such as solder joints and internal connections in components. It ensures that solder joints are defect-free, and there are no hidden issues that could impact performance and reliability.

FPT(Flying Probe Test)

FPT(Flying Probe Test)

The flying probe test is a non-invasive method to verify the connectivity of PCB traces and pads. It uses specially designed probes to stimulate and measure electrical signals, ensuring correct circuitry and identifying potential defects.

FCT(Functional Testing )

FCT(Functional Testing)

FCT involves testing the assembled PCB or PCBA for its intended functionality. Various tests are conducted to ensure that the product performs as expected, meeting design specifications and customer requirements.

ICT(In-Circuit Testing)

ICT(In-Circuit Testing)

ICT checks the electrical performance of individual components and circuitry on the PCB. It identifies defects, shorts, open circuits, and other electrical issues, ensuring the proper functioning of the electronic assembly.

Visual inspection

Visual inspection

Visual inspection is a commonly used non-destructive testing method during quality control. Ensure the highest level of product quality and reliability.

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