SMT Capability
Believe Highleap SMT assembly capabiity to achive your high qulity PCB.
INSTANT SERVICE
2 hours quotation
12 hours delivery
7X24 hours technical services
EXPERIENCED
Over 10 years experienced engineering team
QUALITY CONTROL
Strict controlled with IPC standardsproduct qualification over 99.5%
SALES NET
Sales network covers over morethan200 countries and regions
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Highleap’s SMT Capability
In the table below is a comprehensive list of Highleap’s SMT assembly capabilities.
Items
Single and double sided SMT/PTH
Large parts on both sides, BGA on both sides
Smallest Chips size
Min BGA and Micro BGA pitch and ball counts
Min Leaded parts pitch
Max Parts size assembly by machine
Assembly surface mount connectors
Odd form parts:LED Resistor and capacit or networks Electrolytic capacitors Variable resistors and capacitors (pots) Sockets
Wave soldering
Max PCB size
Min PCB Thickness
Fiducial Marks
PCB Finish:
PCB Shape
Panelized PCB
Inspection
Rework
Min IC Pitch
Solder paster printer
POP Manufacturing capability
Capabilities
Yes
Yes
01005
0.008 in. (0.2mm) pitch, ball count greater than 1000
0.008 in. (0.2 mm)
2.2 in. x 2.2 in. x 0.6 in.
Yes
Yes
Yes
14.5 in. x 19.5 in.
0.02
Preferred but not required
SMOBC/HASL /Electrolytic gold /Electroless gold /Electroless silver /Immersion gold /Immersion tin /OSP
Any
Tab routed/Breakaway tabs/V-Scored/Routed+ V scored
X-ray analysis/Microscope to 20X
BGA removal and replacement station/SMT IR rework station/Thru-hole rework station
0.2mm
0.2mm
POP *3F
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