TLX-8

What is TLX-8?

TLX-8 is a high-performance, fiberglass-reinforced PTFE microwave laminate designed for reliability in a wide range of RF and microwave applications.

Material Overview

  • Current Manufacturer: AGC
  • Product: TLX-8
  • Material Type: Fiberglass-Reinforced PTFE
  • Typical Dk: 2.55 ± 0.04
  • Typical Df: 0.0018
  • Primary Use: RF & Microwave PCBs

Features

  • Low Dielectric Loss
  • Controlled Dielectric Constant
  • Low Moisture Absorption
  • Fiberglass-Reinforced Structure
  • Multiple Thickness Options
  • Different Copper Cladding Options

Benefits

  • Low and Stable Dk
  • Excellent Mechanical & Thermal Properties
  • Dimensionally Stable
  • Low Moisture Absorption
  • Low DF
  • UL 94 V-0 Rating
  • For Low Layer Count Microwave Designs

Applications

  • RF & Microwave Antennas
  • Radar Systems
  • Mobile Communication Equipment
  • Microwave Test Equipment
  • RF Filters
  • Mixers & Frequency Converters
  • Power Dividers, Splitters & Combiners
  • RF & Microwave Passive Components

TLX-8 General Properties

Properties Test Methods Unit Value Unit Value

DK @ 10 GHz

IPC-650 2.5.5.3

 

2.55

 

2.55

Df @ 1.9 GHz

IPC-650 2.5.5.5.1

 

0.0012

 

0.0012

Df @ 10 GHz

IPC-650 2.5.5.5.1

 

0.0017

 

0.0017

Dielectric Breakdown

IPC-650 2.5.6

kV

>45

kV

>45

Moisture Absorption

IPC-650 2.6.2.1

%

0.02

%

0.02

Flexural Strength (MD)

ASTM D 709

psi

28,900

N/mm²

 

Flexural Strength (CD)

ASTM D 709

psi

20,600

N/mm²

 

Tensile Strength (MD)

ASTM D 902

psi

35,600

N/mm²

 

Tensile Strength (CD)

ASTM D 902

psi

27,500

N/mm²

 

Elongation at Break (MD)

ASTM D 902

%

3.94

%

3.94

Elongation at Break (CD)

ASTM D 902

%

3.92

%

3.92

Young's Modulus (MD)

ASTM D 902

kpsi

980

N/mm²

 

Young's Modulus (CD)

ASTM D 902

kpsi

1,200

N/mm²

 

Young's Modulus (MD)

ASTM D 3039

kpsi

1,630

N/mm²

 

Poisson's Ratio

ASTM D 3039

 

0.135

N/mm

 

Peel Stength (1 oz.ed)

IPC-650 2.4.8 Sec.5.2.2 (Thermal Stress.)

Ibs./linear inch

15

N/mm

 

Peel Stength (1 oz.RTF)

IPC-650 2.4.8 Sec.5.2.2 (Thermal Stress.)

Ibs./linear inch

17

N/mm

 

Peel Stength (½ oz.ed)

IPC-650 2.4.8.3 (Elevated Temp.)

Ibs./linear inch

14

N/mm

 

Peel Stength (½ oz.ed)

IPC-650 2.4.8 Sec.5.2.2 (Thermal Stress.)

Ibs./linear inch

11

N/mm

 

Peel Stength (1 oz.rolled)

IPC-650 2.4.8 Sec.5.2.2 (Thermal Stress.)

Ibs./linear inch

13

N/mm

2.1

Dimensional Stability (MD)

IPC-650 2.4.39 Sec.5.5 (After Bake.)

mils/in.

0.06

mm/M

 

Dimensional Stability (CD)

IPC-650 2.4.39 Sec.5.4 (After Bake.)

mils/in.

0.08

mm/M

 

Dimensional Stability (MD)

IPC-650 2.4.39 Sec.5.5 (Thermal Stress.)

mils/in.

0.09

mm/M

 

Dimensional Stability (CD)

IPC-650 2.4.39 Sec.5.5 (Thermal Stress.)

mils/in.

0.1

mm/M

 

Surface Resistivity

IPC-650 2.5.17.1 Sec.5.2.1 (Elevated Temp.)

Mohm

6.605 x 10⁸

Mohm

6.605 x 10⁸

Surface Resistivity

IPC-650 2.5.17.1 Sec.5.2.1 (Humidity Cond.)

Mohm

3.550 x 10⁶

Mohm

3.550 x 10⁶

Volume Resistivity

IPC-650 2.5.17.1 Sec.5.2.1 (Elevated Temp.)

Mohm/cm

1.110 x 10¹⁰

Mohm/cm

1.110 x 10¹⁰

Volume Resistivity

IPC-650 2.5.17.1 Sec.5.2.1 (Humidity Cond.)

Mohm/cm

1.046 x 10¹⁰

Mohm/cm

1.046 x 10¹⁰

Thermal Conductivity

ASTM F433/ASTM 1530-06

W/M*K

0.19

W/M*K

0.19

CTE (X axis) (25-260℃)

IPC-650 2.4.41/ASTM D 3386

ppm/℃

21

ppm/℃

21

CTE (Y axis) (25-260℃)

IPC-650 2.4.41/ASTM D 3386

ppm/℃

23

ppm/℃

23

CTE (Z axis) (25-260℃)

IPC-650 2.4.41/ASTM D 3386

ppm/℃

215

ppm/℃

215

Density (Specific Gravity)

ASTM D 792

g/cm³

2.25

g/cm³

2.25

Td (2% Weight Loss)

IPC-650 2.4.24.6 (TGA)

℃

535

℃

 

Td (5% Weight Loss)

IPC-650 2.4.24.6 (TGA)

℃

553

℃

 

Flammability Rating

UL-94

 

V-0

 

V-0

Remarks

  1. The values listed above are typical material reference data and may vary with laminate thickness, copper construction, processing conditions, and test methods.
  2. TLX-8 is part of AGC’s RF/microwave laminate portfolio. For current specifications, available thicknesses, copper cladding options, and qualification information, refer to the latest technical documentation from AGC.
  3. The material data on this page are provided for general engineering reference and should not be used as guaranteed specifications for a finished PCB or electronic assembly.
Turnkey-PCB-Assembly-Factory

When Does TLX-8 Make Sense for an RF or Microwave PCB?

TLX-8 may be worth evaluating when an RF or microwave PCB requires a PTFE-based laminate with low dielectric loss, controlled dielectric properties, and fiberglass reinforcement. The decision should be based on the complete circuit requirement rather than the material name alone.

For PCB designers, TLX-8 is most relevant when transmission-line behavior, insertion loss, impedance stability, and RF geometry have a meaningful influence on the finished circuit. Typical projects may include antenna networks, radar electronics, RF filters, microwave passive circuits, communication equipment, and test or measurement hardware.

  • RF and microwave signal paths: Suitable for designs where dielectric loss is an important part of the transmission-line calculation.
  • Antenna and radar circuits: May be considered for high-frequency structures where trace geometry, dielectric thickness, copper profile, and grounding need to be tightly defined.
  • Filters and passive RF networks: Useful for circuits that depend on controlled transmission-line dimensions and repeatable dielectric behavior.
  • Low- to moderate-layer-count RF boards: TLX-8 can be evaluated for microwave PCB constructions that do not require the same material architecture as complex high-layer-count digital backplanes.
  • Controlled-impedance designs: The laminate can be incorporated into PCB stack-ups where impedance targets are defined together with copper thickness and dielectric spacing.
  • Hybrid PCB constructions: In some projects, a PTFE RF layer may be combined with other approved PCB materials when electrical, mechanical, and cost requirements support a hybrid stack-up.

TLX-8 is not automatically the right laminate for every high-frequency PCB. Operating frequency, insertion-loss target, board thickness, layer count, RF topology, thermal requirements, fabrication complexity, assembly conditions, and material availability should all be considered before the final PCB stack-up is released.

For TLX-8 PCB manufacturing and PCB assembly projects, Highleap Electronics works from the approved material callout, stack-up, Gerber data, impedance requirements, mechanical drawings, and assembly files to develop the corresponding PCB production build.

Submit your TLX-8 PCB project for manufacturing review and quotation