Kapton Polyimide Film for Flexible PCB Manufacturing
Kapton HN, FN, and HPP-ST are third-party polyimide film grades that may be specified for flexible and rigid-flex PCB designs. Highleap Electronics provides PCB fabrication and assembly services based on customer-defined material, stack-up, and production requirements.
Kapton Polyimide Film in Flexible PCB Applications
Kapton is a polyimide film product from DuPont, with grades such as HN, FN, and HPP-ST available for different technical requirements. In flexible circuit designs, polyimide films may be specified where thin dielectric construction, mechanical flexibility, electrical insulation, or temperature resistance is required.
Kapton® film may be considered in a range of flexible and rigid-flex PCB designs, including compact electronic assemblies, multilayer flex circuits, sensor interconnects, industrial electronics, automotive electronics, and other applications with specific mechanical or insulation requirements.
Common PCB design considerations include:
- Flexible and rigid-flex circuit construction
- Dielectric and overall PCB thickness
- Bend-area and mechanical requirements
- Electrical insulation and signal requirements
- Integration with coverlay, stiffeners, and other PCB materials
Highleap Electronics manufactures and assembles PCBs according to customer-specified materials and design requirements. Kapton® is referenced only as a third-party material designation.
Kapton® FCCL Technical Specifications
Table 1. Physical Properties of Kapton® Type 100 HN Film, 25µm (1 mil)
| Physical Property | Typical Value at | Test Method | |
|---|---|---|---|
| 23°C (73°F) | 200°C (392°F) | ||
| Ultimate Tensile Strength, MPa (psi) | 231 (33,500) | 138 (20,000) | ASTM D-882-91, Method A |
| Yield Point at 3%, MPa (psi) | 69 (10,000) | 41 (6,000) | ASTM D-882 |
| Stress to Produce 5% Elongation, MPa (psi) | 90 (13,000) | 62 (9,000) | ASTM D-882 |
| Ultimate Elongation, % | 72 | 83 | ASTM D-882 |
| Tensile Modulus, GPa (psi) | 2.76 (400,000) | 2.0 (290,000) | ASTM D-882 |
| Impact Strength, N•cm (ft•lb) | 78 (0.58) | — | DuPont Pneumatic Impact Test |
| Folding Endurance (MIT), cycles | 285,000 | — | ASTM D-2176 |
| Tear Strength—Propagating (Elmendorf), N (lbf) | 0.07 (0.02) | — | ASTM D-1922 |
| Tear Strength—Initial (Graves), N (lbf) | 7.2 (1.6) | — | ASTM D-1004 |
| Density, g/cc or g/mL | 1.42 | — | ASTM D-1505 |
| Coefficient of Friction—Kinetic | 0.48 | — | ASTM D-1894 |
| Coefficient of Friction—Static | 0.63 | — | ASTM D-1894 |
| Refractive Index (Na D Line) | 1.70 | — | ASTM D-542 |
| Poisson’s Ratio | 0.34 | — | Avg. Three Samples Elongated |
| Low Temperature Flex Life | Pass | — | IPC TM 650, Method 2.6.18 |
Table 2. Thermal Properties of Kapton® Type 100 HN Film, 25 µm (1 mil)
| Thermal Property | Typical Value | Test Condition | Test Method |
|---|---|---|---|
| Melting Point | None | None | ASTM E-794 (1989) |
| Thermal Coefficient of Linear Expansion | 20 ppm/°C (11 ppm/°F) | -14 to 38°C (7 to 100°F) | ASTM D-696 |
| Coefficient of Thermal Conductivity, W/m•K (cal/sec-cm-°C) | 0.20 (4.8 × 10⁻⁴) | 296 K (23°C) | ASTM D5470 |
| Specific Heat, J/g•K (cal/g•°C) | 1.09 (0.261) | — | Differential Calorimetry |
| Flammability | 94V-0 | — | UL-94 (2-8-85) |
| Shrinkage, % | 0.17 1.25 |
30 min at 150°C 120 min at 400°C |
IPC TM 650, Method 2.2.4A ASTM D-5214 |
| Heat Sealability | Not Heat Sealable | — | — |
| Limiting Oxygen Index, % | 37 | — | ASTM D-2863 |
| Solder Float | Pass | — | IPC TM 650, Method 2.4.13A |
| Smoke Generation | DM = <1 | — | NBS Smoke Chamber NFPA-258 |
| Glass Transition Temperature (Tg) | A second order transition occurs in Kapton® between 360°C (680°F) and 410°C (770°F) and is assumed to be the glass transition temperature. Different measurement techniques produce different results within the above temperature range. |
||
Table 3. Physical and Thermal Properties of Kapton® Type HPP-ST Film
| Property | Typical Value for Film Thickness | Test Method | |||
|---|---|---|---|---|---|
| 25 µm | 50 µm | 75 µm | 125 µm | ||
| Ultimate Tensile Strength, MPa (psi) | 231 (33,500) | 234 (34,000) | 231 (33,500) | 231 (33,500) | ASTM D-882 |
| Ultimate Elongation, % | 72 | 82 | 82 | 82 | ASTM D-882 |
| Tear Strength (Elmendorf), N | 0.07 | 0.21 | 0.38 | 0.58 | ASTM D-1922 |
| Tear Strength (Graves), N | 7.2 | 16.3 | 26.3 | 46.9 | ASTM D-1004 |
| Folding Endurance (MIT), ×10³ | 285 | 55 | 6 | 5 | ASTM D-2176 |
| Density, g/cc | 1.42 | 1.42 | 1.42 | 1.42 | ASTM D-1505 |
| Flammability | 94V-0 | 94V-0 | 94V-0 | 94V-0 | UL-94 |
| Shrinkage (150°C, 30 min), % | 0.03 | 0.03 | 0.03 | 0.03 | IPC TM 650 |
| Limiting Oxygen Index, % | 37 | 43 | 46 | 45 | ASTM D-2863 |
Table 4. Physical Properties of Kapton® Type FN Film
| Property | Typical Value for Film Type | ||
|---|---|---|---|
| 120FN616 | 150FN019 | 250FN029 | |
| Ultimate Tensile Strength, MPa (psi) 23°C / 200°C |
207 (30,000) / 121 (17,500) | 162 (23,500) / 89 (13,000) | 200 (29,000) / 115 (17,000) |
| Yield Point at 3%, MPa (psi) 23°C / 200°C |
61 (9000) / 42 (6000) | 49 (7000) / 43 (6000) | 58 (8500) / 36 (5000) |
| Stress at 5% Elongation, MPa (psi) 23°C / 200°C |
79 (11,500) / 53 (8000) | 65 (9,500) / 41 (6000) | 76 (11,000) / 48 (7000) |
| Ultimate Elongation, % 23°C / 200°C |
75 / 80 | 70 / 75 | 85 / 110 |
| Tensile Modulus, GPa (psi) 23°C / 200°C |
2.48 (360,000) / 1.62 (235,000) | 2.28 (330,000) / 1.14 (165,000) | 2.62 (380,000) / 1.38 (200,000) |
| Impact Strength at 23°C, N•cm (ft•lb) | 78 (0.58) | 68.6 (0.51) | 156.8 (1.16) |
| Tear Strength—Propagating (Elmendorf), N (lbf) | 0.08 (0.02) | 0.47 (0.11) | 0.57 (0.13) |
| Tear Strength—Initial (Graves), N (lbf) | 11.8 (2.6) | 11.5 (2.6) | 17.8 (4.0) |
| Polyimide, wt% | 80 | 57 | 73 |
| FEP, wt% | 20 | 43 | 27 |
| Density, g/cc or g/mL | 1.53 | 1.67 | 1.57 |
Note: The technical values shown above are provided for general engineering reference only and are not guaranteed specifications. For confirmed material properties, available constructions, tolerances, and compliance information, please refer to the material manufacturer’s current official technical documentation. Kapton® is a third-party material product of DuPont; Highleap Electronics does not manufacture Kapton® polyimide film or publish its material specifications.
Highleap Electronics provides PCB fabrication and PCB assembly services for customer designs that specify Kapton® polyimide film or other approved flexible-circuit materials. We review the customer-approved stack-up, material callout, fabrication requirements, and assembly documentation before production. Material availability and final PCB construction are confirmed according to each project.
Kapton®-Based PCB Manufacturing Capabilities
At Highleap Electronics, we provide complete fabrication and assembly services tailored to Kapton®-based flexible PCBs. Our engineering team understands the processing requirements of polyimide materials and supports both low- and high-volume projects.
- Material support: Kapton® HN, HPP-ST, and FN films from 25µm to 125µm
- Compatible processes: laser drilling, coverlay lamination, dynamic bending zones
- Precision fabrication: Cleanroom etching, fine-line imaging, and SMT-ready finishing
- Application-specific stack-ups: Rigid-flex combinations, multilayer PI lamination
- Certifications: IPC Class 2/3 compliant production environment
Whether for aerospace-grade insulation or compact FPC designs, our facility ensures dimensional accuracy, low outgassing, and stable electrical performance.
Get a Quote for Flexible PCB Projects Specifying Kapton Film
If your flexible PCB or rigid-flex PCB design specifies Kapton polyimide film, Highleap Electronics can review the PCB fabrication and assembly requirements based on your approved drawings, stack-up, material callout, and production documentation.
As a PCB manufacturer and PCB assembly service provider, our work focuses on the finished circuit board and PCBA rather than the manufacture of the polyimide film itself.
- DFM review for flexible and rigid-flex PCB designs
- PCB stack-up review based on customer-specified materials
- Prototype and volume flexible PCB fabrication
- Coverlay, stiffener, drilling, plating, and routing processes
- SMT/THT assembly, component sourcing, inspection, and testing
Material availability and final PCB construction are confirmed according to the requirements of each project before production.
📩 Contact us to request a PCB quotation or engineering review. Please send your Gerber files, stack-up, BOM, drawings, and assembly requirements for evaluation.
Kapton® is a third-party material product of DuPont. The name is referenced only to identify customer-specified material requirements. Highleap Electronics is an independent PCB manufacturer and PCB assembly provider and does not manufacture Kapton® polyimide film.