TU-933+ High-Speed PCB Material for 100G/400G Backplanes & Networking
High-speed PCB fabrication with TU-933+ laminates. Superior Dk stability and low insertion loss for demanding data center and telecom applications.
High-Speed PCB Manufacturing for Projects Using TU-933+
Highleap Electronics provides PCB fabrication and PCB assembly services for high-speed, RF, HDI, and multilayer circuit board projects. Our manufacturing work is based on the approved PCB design, stack-up, material requirements, impedance targets, and assembly documentation.
TU-933+, also identified within the ThunderClad 3+ material family from Taiwan Union Technology Corporation (TUC), is a super-low-loss laminate used in high-speed and RF PCB designs. TU-933+ is the laminate core designation, with TU-933P+ as the corresponding prepreg.
PCB projects involving this material may include:
- High-speed backplanes and computing boards
- Server, storage, and line-card PCBs
- Telecom and base-station circuit boards
- RF and signal-transmission applications
- High-layer-count multilayer PCB designs
For these projects, Highleap Electronics focuses on PCB-level requirements such as multilayer stack-up construction, controlled impedance, via architecture, layer registration, drilling, copper features, surface finish, and PCB assembly. Material properties and available constructions should be confirmed against the current documentation provided by the material manufacturer.
Our PCB manufacturing services also cover projects using other approved low-loss and high-speed laminate systems, including TU-883, TU-872 SLK, specialty low-loss materials, and Taconic materials.
Technical Specifications of TU-933+ Laminate
| Property | Value | Condition / Method |
|---|---|---|
| Tg (DMA) | 220°C | E-2/105 |
| Tg (TMA) | 170°C | E-2/105 |
| Td (TGA) | 390°C | E-2/105 |
| CTE (x/y) | 12 / 13 ppm/°C | Ambient to Tg |
| CTE z-axis (α1) | 35 ppm/°C | Pre-Tg |
| CTE z-axis (α2) | 240 ppm/°C | Post-Tg |
| CTE z-axis (%) | 2.5% | 50 to 260°C |
| Thermal Stress (288°C) | > 120 sec | Solder Float |
| T260 / T288 / T300 | > 60 min (each) | E-2/105 |
| Flammability | 94V-0 | E-24/125 |
| Permittivity (Dk) | 3.08 @ 10 GHz | SPC method (RC70%) |
| Simulated Dk | 2.54 | Impedance Simulation |
| Loss Tangent (Df) | 0.0020 @ 10 GHz | SPC method |
| Volume Resistivity | > 10¹⁰ MΩ·cm | C-96/35/90 |
| Surface Resistivity | > 10⁸ MΩ | C-96/35/90 |
| Electric Strength | > 40 kV/mm | A |
| Dielectric Breakdown | > 50 kV | A |
| Young’s Modulus | 23 GPa (Warp), 21 GPa (Fill) | A |
| Flexural Strength | > 60,000 psi (L) / >50,000 psi (W) | A |
| Peel Strength (1 oz Cu) | 4–7 lb/in | A |
| Moisture Absorption | 0.06% | E-1/105 + D-24/23 |
NOTE
- The technical values above are provided for general PCB engineering reference. Final PCB construction and production requirements should be confirmed according to the approved design, stack-up, and applicable project documentation.
- TU-933+ (ThunderClad 3+) is a laminate product from Taiwan Union Technology Corporation (TUC). Highleap Electronics manufactures and assembles PCBs and does not manufacture TU-933+ laminate.
- Highleap Electronics provides PCB-level engineering and manufacturing support, including DFM review, multilayer stack-up evaluation, controlled-impedance review, fabrication planning, PCB assembly, inspection, and testing.
For TU-933+ PCB projects, our support includes:
- High-speed and low-loss PCB stack-up review
- Controlled-impedance and signal-routing requirements
- Multilayer, HDI, and complex via-structure fabrication
- SMT/THT assembly, inspection, and testing
- Prototype and volume PCB manufacturing quotation
Contact Highleap Electronics for PCB manufacturing review and quotation.
Why Engineers Choose TU-933+ for High-Speed, Low-Loss PCB Projects
While we support all types of PCB substrates, we often recommend TU-933+ laminates for customers working with high-speed signals, especially those designing for 10G, 25G, or 56G bandwidths.
TU-933+ key features include:
- Dk 3.08 ±2%, Df 0.0020 @ 10 GHz – ideal for maintaining signal integrity
- Low z-axis expansion – ensures reliable vias in multilayer stackups
- High CAF resistance – supports long-term reliability in harsh environments
- Compatible with conventional lamination processes – helping reduce costs
These properties make TU-933+ a cost-effective alternative to ultra-premium materials like MEGTRON6 or a low-loss hydrocarbon laminate for many telecom, datacom, server, and industrial RF applications.
At Highleap, we offer free stackup consulting and help customers decide whether TU-933+ or another material is the best fit for their performance, cost, and manufacturing needs.
High-Speed PCB Fabrication & Assembly from Prototype to Production
Highleap Electronics provides PCB fabrication and PCB assembly services for high-speed, low-loss, HDI, and complex multilayer projects, including PCB designs involving TU-933+ and other approved laminate systems. Our focus is on translating the approved stack-up, impedance requirements, fabrication data, and assembly documentation into a controlled production process.
For demanding multilayer and high-speed PCB designs, fabrication and assembly requirements can be reviewed together to improve coordination between the bare board and final PCBA.
- Controlled-impedance and differential-pair PCB manufacturing
- HDI processing with microvias, via-in-pad, and plugged-via structures
- Complex multilayer stack-ups and high-layer-count PCB fabrication
- ENIG, ENEPIG, hard gold, OSP, and other specified surface finishes
- SMT/THT assembly for BGA, QFN, fine-pitch, and other component packages
- AOI, X-ray, flying-probe, electrical, and applicable functional testing
From engineering review and prototype builds through volume PCB manufacturing and assembly, Highleap Electronics supports projects where signal integrity, multilayer construction, process control, and production consistency are important.
If your project involves TU-933+, another low-loss laminate, or a conventional FR-4 construction, send us your Gerber files, stack-up, BOM, and assembly requirements for manufacturing review and quotation.
Contact Highleap Electronics for your high-speed PCB manufacturing and assembly project.