TU-872 SLK PCB Laminate – High-Speed Low Loss Material | Highleap

Highleap Electronics supplies TU-872 SLK laminates for low-loss, high-speed PCB applications in telecom, server, microwave, and RF systems. IPC-4101/126 certified.

TUC PCB

TU-872 SLK Laminate – Low Loss Material for High-Speed and High-Frequency PCBs

TU-872 SLK is a high-performance modified epoxy FR-4 laminate, specially engineered for low loss and high reliability in multilayer high-speed circuit board applications. Reinforced with E-glass and compatible with standard FR-4 processing, it enables stable electrical performance across GHz-level frequencies.

With a dielectric constant below 4.0 and dissipation factor under 0.009 at 10GHz, TU-872 SLK is ideal for:

  • High-speed backplanes

  • RF and microwave transceivers

  • Base stations and telecom routers

  • Storage, server and HPC applications

Thanks to its enhanced thermal stability (Tg > 200°C, Td > 340°C), CAF resistance, and flat Z-axis expansion, TU-872 SLK meets the needs of today’s advanced HDI and lead-free reflow designs.

Technical Specifications of TU-872 SLK Laminate

Property Typical Value Test Condition IPC-4101 /126 Requirement
Thermal Properties
Tg (DMA) 220 °C E-2/105 > 170 °C
Tg (DSC) 200 °C E-2/105 –
Tg (TMA) 190 °C E-2/105 –
Td (TGA) 340 °C E-2/105 > 340 °C
CTE x-axis 12–15 ppm/°C E-2/105 –
CTE y-axis 12–15 ppm/°C E-2/105 –
CTE z-axis 2.3 % E-2/105 < 3.0%
Thermal Stress – 288°C Solder Float > 60 sec A > 10 sec
T260 60 min E-2/105 > 30 min
T288 20 min E-2/105 > 15 min
T300 5 min E-2/105 > 2 min
Flammability 94V-0 E-24/125 94V-0
Electrical Properties
Permittivity @ 1GHz 4.0 / 3.8 SPC / 4291B < 5.2
Permittivity @ 5GHz 3.9 SPC –
Permittivity @ 10GHz 3.8 SPC –
Dissipation Factor @ 1GHz 0.008 / 0.006 SPC / 4291B < 0.035
Dissipation Factor @ 5GHz 0.008 SPC –
Dissipation Factor @ 10GHz 0.009 SPC –
Volume Resistivity > 1010 MΩ·cm C-96/35/90 > 106 MΩ·cm
Surface Resistivity > 108 MΩ C-96/35/90 > 104 MΩ
Electric Strength > 40 kV/mm A > 30 kV/mm
Dielectric Breakdown > 50 kV A –
Mechanical Properties
Young’s Modulus – Warp 26 GPa A –
Young’s Modulus – Fill 24 GPa A –
Flexural Strength – Lengthwise > 60,000 psi A > 60,000 psi
Flexural Strength – Crosswise > 50,000 psi A > 50,000 psi
Peel Strength – 1 oz RTF Cu 4–7 lb/in A > 4 lb/in
Water Absorption 0.13% E-1/105 + D-24/23 < 0.5%

NOTE

  • All technical data presented above are based on publicly available documents from Taiwan Union Technology Corporation (TUC). These values are intended for reference only and may vary depending on specific applications or processing conditions. They are not guaranteed specifications.
  • TU-872 SLK is developed by TUC using patent-pending technology to meet the high reliability demands of advanced RF and high-speed circuit designs. For detailed material performance, processing guidelines, or conformance questions, please contact Taiwan Union Technology Corporation directly.
  • At Highleap Electronics, we are a professional PCB manufacturing and assembly factory experienced in working with TU-872 SLK and other high-frequency laminates. If you need material selection guidance, PCB stack-up consultation, or turnkey fabrication and assembly services, our engineering team is here to assist you.

Please feel free to contact us for technical consultation, full datasheets, or a custom quote tailored to your specific design needs.

Material Benefits & Processing Compatibility

TU-872 SLK offers a balance of performance and manufacturability. It is fully compatible with standard FR-4 lamination and etching processes, while delivering superior performance for higher-frequency and thermally demanding designs.

Key features include:

  • Certified to IPC-4101E /29, /99, /101, and /126 standards

  • UL recognized (File: E189572) with 94V-0 flammability rating

  • Improved CTE, CAF resistance, and moisture stability

  • Excellent peel strength and through-hole reliability

  • Available in a range of copper cladding (1/3 oz – 5 oz) and prepreg styles

Use TU-872 SLK when you need:

  • A drop-in FR-4 alternative with higher electrical performance

  • IPC-validated reliability for backdrill or HDI stackups

  • Consistent dielectric performance up to 10GHz

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PCB Manufacturing & Assembly for TU-872 SLK Projects

Highleap Electronics provides PCB fabrication and PCB assembly services for projects involving TU-872 SLK, from prototype builds to volume production. Manufacturing is carried out according to the approved PCB design, stack-up, material requirements, and assembly documentation.

Our engineering and production teams coordinate bare-board fabrication with assembly requirements to keep the complete PCB build consistent from design review through final inspection and testing.

  • Multilayer PCB fabrication and controlled-impedance processing
  • DFM, PCB stack-up, and production feasibility review
  • SMT/THT assembly and component sourcing
  • AOI, X-ray, electrical testing, and applicable PCBA testing
  • Prototype, small-batch, and volume production support

Have a TU-872 SLK PCB project ready for production? Send us your Gerber files, stack-up, BOM, and assembly requirements for engineering review and quotation.

Contact Highleap Electronics to discuss your PCB manufacturing and assembly requirements.

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