TU-768 FR-4 High Tg Material for Reliable PCB Fabrication
TU-768 empowers advanced PCB manufacturing with high Tg, dependable GHz signal stability, and robust lead-free performance across complex multilayer designs.
TU-768 High-Tg FR-4 Laminate and Prepreg for Demanding Thermal Cycles
TU-768 is a high-performance modified epoxy FR-4 laminate and prepreg system reinforced with woven E-glass. Specifically engineered for multilayer PCBs that require high thermal stability, this material is ideal for applications exposed to intensive soldering processes, thermal cycles, and aggressive chemical environments.
Designed with UV-blocking properties and AOI fluorescence, TU-768 supports advanced inspection and processing workflows in high-reliability PCB manufacturing. Its low Z-axis expansion and high decomposition temperature ensure strong mechanical integrity even in lead-free reflow processes.
With certifications including IPC-4101E /126 and UL94 V-0, TU-768 is a proven solution for applications in automotive electronics, servers, workstations, and industrial control systems—where both high Tg and consistent electrical performance are critical.
TU-768 Technical Properties Overview
| Property | Typical Value | Conditioning | IPC-4101 /126 |
|---|---|---|---|
| Thermal Properties | |||
| Tg (DMA) | 190°C | E-2/105 | > 170°C |
| Tg (DSC) | 180°C | ||
| Tg (TMA) | 170°C | ||
| Td (TGA) | 350°C | E-2/105 | > 340°C |
| CTE x-axis | 11–15 ppm/°C | E-2/105 | N/A |
| CTE y-axis | 11–15 ppm/°C | ||
| CTE z-axis | 2.7% | < 3.0% | |
| Thermal Stress (288°C, solder float) | > 60 sec | A | > 10 sec |
| T260 | > 60 min | E-2/105 | > 30 min |
| T288 | > 15 min | > 15 min | |
| T300 | > 2 min | > 2 min | |
| Flammability | 94V-0 | E-24/125 | 94V-0 |
| Electrical Properties | |||
| Permittivity (RC50%) 1GHz | 4.4 / 4.3 | E-2/105 | < 5.2 |
| Permittivity 5GHz | 4.3 | N/A | |
| Permittivity 10GHz | 4.3 | N/A | |
| Loss Tangent 1GHz | 0.019 / 0.018 | E-2/105 | < 0.035 |
| Loss Tangent 5GHz | 0.021 | N/A | |
| Loss Tangent 10GHz | 0.023 | N/A | |
| Volume Resistivity | > 10¹⁰ MΩ·cm | C-96/35/90 | > 10⁶ MΩ·cm |
| Surface Resistivity | > 10⁸ MΩ | C-96/35/90 | > 10⁴ MΩ |
| Electric Strength | > 40 kV/mm | A | > 30 kV/mm |
| Dielectric Breakdown Voltage | > 50 kV | A | > 40 kV |
| Mechanical Properties | |||
| Young’s Modulus – Warp | 25 GPa | A | N/A |
| Young’s Modulus – Fill | 22 GPa | ||
| Flexural Strength – Lengthwise | > 60,000 psi | A | > 60,000 psi |
| Flexural Strength – Crosswise | > 50,000 psi | A | > 50,000 psi |
| Peel Strength (1 oz. RTF Cu) | 7–9 lb/in | A | > 4 lb/in |
| Water Absorption | 0.18% | E-1/105 + D-24/23 | < 0.8% |
NOTE
- The property values listed are for reference only and not intended to serve as guaranteed specifications. Actual performance may vary depending on board design, stackup structure, and processing conditions.
- For official specifications and material datasheets, please feel free to contact us or consult the original manufacturer.
- Highleap Electronics offers engineering support upon request, including stackup optimization, material selection guidance, and manufacturability evaluation to help ensure the best performance in your application.
Applications & Key Advantages
TU-768 is an ideal high-Tg FR-4 substrate for multilayer PCB manufacturing, particularly in industries where dimensional stability, thermal endurance, and long-term reliability are essential. As a high-performance PCB base material, it is widely adopted across demanding electronic applications including:
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Lead-free PCB assembly and high-temperature reflow soldering, with excellent resistance to delamination or thermal shock
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High-layer-count printed circuit boards used in automotive electronics, industrial control systems, and telecom base stations
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Compatibility with Automated Optical Inspection (AOI) processes thanks to its built-in fluorescent recognition layer, improving yield and inspection accuracy
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Proven CAF resistance and low moisture absorption, making it ideal for high-humidity or tropical operating conditions
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Exceptional interlaminar adhesion strength, ensuring mechanical reliability during PCB rework, wave soldering, or BGA reballing
In addition, TU-768 maintains stable dielectric performance at high frequencies, supporting critical signal integrity in high-speed PCB designs, such as server mainboards, network switches, and advanced driver assistance systems (ADAS) in vehicles.
Whether you’re designing for long-term field reliability, thermal cycling, or dense multilayer board configurations, TU-768 delivers consistent electrical, mechanical, and thermal performance across the product lifecycle—making it a top choice among high Tg PCB materials.
Why Choose Highleap Electronics for TU-768 PCBs?
At Highleap Electronics, we combine advanced manufacturing capabilities with deep materials expertise to maximize the performance of TU-768-based PCBs. Here’s what sets us apart:
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✅ One-Stop Service: From TU-768 PCB manufacturing to full turnkey PCBA—including sourcing, assembly, and testing.
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✅ Quality Assurance: ISO 9001, IATF 16949, UL and RoHS certified production processes.
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✅ Material Inventory: We maintain ready stock of TU-768 laminate and prepreg for quick turnaround orders.
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✅ Engineering Support: Free DFM/DFT guidance to reduce cost and increase board yield.
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✅ Global Delivery: Fast, secure shipping to North America, Europe, and Asia.
Need help with your TU-768 multilayer board project? Contact Highleap Electronics today to request a quote or free technical consultation.
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