MEGTRON-6

What is MEGTRON-6?

Panasonic’s MEGTRON-6 is a PCB laminate engineered for ultra-low signal loss and exceptional heat resistance, making it ideal for critical high-speed and high-frequency electronic designs that demand top-tier signal integrity and thermal stability.

Material Overview

  • Manufacturer: Panasonic Industry
  • Product Series: MEGTRON6
  • Laminate Models: R-5775(N), R-5775(K), R-5775(G)
  • Material Type: Multilayer PCB Laminate
  • Designed for Low-Loss Signal Transmission
  • Used in High-Speed & High-Frequency PCB Designs

PCB-Relevant Characteristics

  • Ultra-Low Transmission Loss
  • High Heat Resistance
  • Low Dielectric Loss for High-Speed Signals
  • Suitable for High-Density Multilayer Structures
  • Supports Controlled-Impedance PCB Designs
  • Multiple Material Constructions by Grade

Application Areas

  • Networking & ICT Infrastructure
  • Servers & High-Performance Computing
  • Wireless & RF Communication Systems
  • Base-Station & Antenna Equipment
  • Measuring & Test Instruments
  • Automotive & Advanced Electronic Systems

MEGTRON-6 General Properties

Item Test method Condition Unit MEGTRON 6 R-5775(N) MEGTRON 6 R-5775(K) MEGTRON 6 R-5775(G)
Low Dk Glass Cloth Normal Glass Cloth
Glass Transition Temp (Tg) DSC A °C 185 185
CTE z-axis α1 IPC-TM-650 2.4.24 A ppm/°C 45 45
α2 260 260
T288 (with copper) IPC-TM-650 2.4.24.1 A min ＞120 ＞120
Dielectric Constant (Dk) 13GHz Balanced-type Circular Disk Resonator C-24/23/50 - 3.34 3.62
Dissipation Factor (Df) 0.0037 0.0046
Peel Strength* 1oz (35μm) IPC-TM-650 2.4.8 A kN/m 0.8 0.8

Remark

  1. Peel Strength*: H-VLP Copper
  2. Sample thickness :29.5 mil = 0.750 mm (Core Type 30)
  3. The data in the above table are not guaranteed values.
  4. MEGTRON6 materials are manufactured by Panasonic Industry. For the latest material specifications, available constructions, and technical documentation, please refer to the material manufacturer or its authorized channels.

R-5775(N) Specification

Low Dielectric Constant (Dk) Glass Cloth – LaminateR-5775(N) / PrepregR-5670(N)
Properties Units Test Method Condition Typical Value
Thermal Properties
Glass Transition Temperature (Tg) °C DSC As Received 185
DMA 210
Thermal Decomposition Temperature (Td) °C TGA 410
Time to Delamination (T288) Without Cu min IPC-TM-650 2.4.24.1 >120
With Cu >120
CTE: α1 X-Axis ppm/°C IPC-TM-650 2.4.24 <Tg 14–16
Y-Axis 14–16
Z-Axis 45
CTE: α2 Z-Axis >Tg 260
Electrical Properties
Volume Resistivity MΩ·cm IPC-TM-650 2.5.17.1 C-96/35/90 1 × 109
Surface Resistivity MΩ 1 × 108
Dielectric Constant (Dk) @ 1 GHz — IPC-TM-650 2.5.5.9 C-24/23/50 3.40
@ 13 GHz Balanced-Type Circular Disk Resonator 3.34
Dissipation Factor (Df) @ 1 GHz IPC-TM-650 2.5.5.9 0.002
@ 13 GHz Balanced-Type Circular Disk Resonator 0.0037
Physical Properties
Water Absorption % IPC-TM-650 2.6.2.1 D-24/23 0.14
Peel Strength 1 oz (H-VLP) kN/m IPC-TM-650 2.4.8 As Received 0.8
Flammability Rating UL C-48/23/50 94V-0

Remarks

  1. Reference sample thickness: 29.5 mil (0.750 mm), Core Type 30.
  2. The values listed above are typical reference data and may vary by material grade, construction, and test conditions. Refer to the latest manufacturer documentation for current specifications.

R-5775 Specification

Standard E Glass Cloth – LaminateR-5775 / PrepregR-5670
Properties Units Test Method Condition Typical Value
Thermal Properties
Glass Transition Temperature (Tg) °C DSC As Received 185
DMA 210
Thermal Decomposition Temperature (Td) °C TGA 410
Time to Delamination (T288) Without Cu min IPC-TM-650 2.4.24.1 >120
With Cu >120
CTE: α1 X-Axis ppm/°C IPC-TM-650 2.4.24 <Tg 14–16
Y-Axis 14–16
Z-Axis 45
CTE: α2 Z-Axis >Tg 260
Electrical Properties
Volume Resistivity MΩ·cm IPC-TM-650 2.5.17.1 C-96/35/90 1 × 109
Surface Resistivity MΩ 1 × 108
Dielectric Constant (Dk) @ 1 GHz — IPC-TM-650 2.5.5.9 C-24/23/50 3.71
@ 10 GHz IPC-TM-650 2.5.5.5 3.61
Dissipation Factor (Df) @ 1 GHz IPC-TM-650 2.5.5.9 0.002
@ 10 GHz IPC-TM-650 2.5.5.5 0.004
Physical Properties
Water Absorption % IPC-TM-650 2.6.2.1 D-24/23 0.14
Peel Strength 1 oz (H-VLP) kN/m IPC-TM-650 2.4.8 As Received 0.8
Flammability Rating UL C-48/23/50 94V-0

Remarks

  1. Reference sample thickness: 29.5 mil (0.750 mm), Core Type 30.
  2. MEGTRON6 R-5775 / R-5670 are Panasonic Industry material designations. Current material properties, available constructions, and technical documentation should be confirmed with the material manufacturer.
  3. Highleap Electronics provides PCB fabrication and PCB assembly services. For PCB project evaluation or quotation, please contact us.
Turnkey-PCB-Assembly-Factory

High-Speed PCB Manufacturing for MEGTRON6 Projects

For high-speed multilayer PCB projects involving MEGTRON6, Highleap Electronics focuses on translating the approved electrical design into a controlled PCB fabrication and assembly process. Stack-up, impedance requirements, via structures, copper construction, drilling data, and assembly documentation are reviewed together before production.

Our manufacturing work covers the board-level details that affect high-speed PCB production, including multilayer registration, controlled impedance, HDI structures, surface finish, panelization, inspection, and the transition from bare-board fabrication to final PCBA.

  • High-speed and low-loss multilayer PCB fabrication
  • Controlled-impedance and differential-pair requirements
  • HDI, microvia, blind-via, and buried-via structures
  • Multilayer lamination, drilling, plating, and surface finishing
  • SMT/THT assembly, inspection, and applicable testing

Highleap Electronics provides PCB manufacturing and PCB assembly services for projects involving MEGTRON6 R-5775 / R-5670 series materials, from prototype builds through volume production.

Send us your Gerber files, stack-up, BOM, and assembly requirements for manufacturing review and quotation.