MEGTRON-6

MEGTRON-6 General Properties

Remark

1. Peel Strength*: H-VLP Copper
2. Sample thickness :29.5 mil = 0.750 mm (Core Type 30)
3. The data in the above table are not guaranteed values.
4. To receive more detailed information, please feel free to contact us directly or leave your email address and we will promptly send you the relevant documents.

R-5775(N) Specification

Remark

1. Sample thickness :29.5 mil = 0.750 mm (Core Type 30)
2. The data in the above table are not guaranteed values.
3. To receive more detailed information, please feel free to contact us directly or leave your email address and we will promptly send you the relevant documents.

R-5775 Specification

Remark

1. Sample thickness :29.5 mil = 0.750 mm (Core Type 30)
2. The data in the above table are not guaranteed values.
3. To receive more detailed information, please feel free to contact us directly or leave your email address and we will promptly send you the relevant documents.

Material Storage

• Laminate should be stored flat in a cool dry environment. Avoid bending or scratching the laminate surface.
• When possible store the laminate in the original container.
• Prepreg should be stored flat in a cool dry controlled environment, 73℉ (23℃) or less and 50% RH or less.
• Extended storage of prepreg should be at a reduced temperature of 41 ℉(5 ℃). Open bags of prepreg must be resealed.
  Prepreg should not be exposed to open environments for more than 8 hours total cumulatively under the above conditions or as agreed upon between user and supplier.

Laminate Surface Preparation

• Regular Shiny Copper can be cleaned using industry standard chemical clean or mechanical clean.
• Reverse Treat Copper should be cleaned using industry standard chemical clean.

Inner Layer Bond Treatment

• Alternative Oxide Treatment with organic coating using a Peroxide/Sulfuric etch technology is preferred.
• Black or Brown Oxide can be used. In the case of using Black Oxide, please check whether peel strength is acceptable for the usage.

Drying

• Dry finished inner layers completely to remove any absorbed moisture or surface moisture.
• A racked bake at 225 ℉(105 ℃) for 20-30 minutes is preferred. For conveyorized alternative oxide processing, some equipment may have sufficient drying capability. However, a racked bake is suggested.