SY S1000H – High Performance, Mid-Tg Lead-free PCB Material
Explore SY S1000H PCB material specs and expert multilayer manufacturing. Ideal for high-reliability, lead-free, and high-speed PCB applications.
S1000H General Properties
| Item | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.24.4 | DMA | ℃ | 160 |
| Tg | IPC-TM-650 2.4.25D | DSC | ℃ | 155 |
| Td | IPC-TM-650 2.4.24.6 | TGA (5% W.L) | ℃ | 348 |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 20 |
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | s | >100 |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 37 |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | After Tg | ppm/℃ | 230 |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | 50-260℃ | % | 2.8 |
| Permittivity (1GHz) | IPC-TM-650 2.5.5.9 | C-24/23/50 | – | 4.6 |
| Loss Tangent (1GHz) | IPC-TM-650 2.5.5.9 | C-24/23/50 | – | 0.011 |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ·cm | 1.5×10⁸ |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ | 3.5×10⁷ |
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-0.5/23 | s | 150 |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-0.5/23 | kV | >45 |
| Peel Strength (1oz) | IPC-TM-650 2.4.8 | 288℃/10s | N/mm [lb/in] | 1.3 [7.43] |
| Flexural Strength (LW) | IPC-TM-650 2.4.4 | A | MPa | 530 |
| Flexural Strength (CW) | IPC-TM-650 2.4.4 | A | MPa | 440 |
| Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.09 |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 |
| CTI | IEC60112 | A | Rating | PLC 3 |
Remarks
- The specification IPC-4101/99 is provided for reference only and does not imply full compliance.
- All typical values are based on a 1.6mm (8 × 7628) test specimen.
- All data is sourced from Shengyi Technology Co., Ltd. and is intended for general reference only. For detailed technical documentation or application-specific support, please contact Highleap Electronics.
All rights to this data sheet are reserved by Shengyi Technology Co., Ltd.
S1000HB PREPREG
(UL ANSI: FR-4.0) Bonding Prepreg For S1000H
| Glass fabric type | Resin content (%) | Cured thickness (mm) | Standard size (Roll type) |
|---|---|---|---|
| 106/1037 | 73 | 0.050 | 1.260m × 150m |
| 78 | 0.063 | ||
| 1080/1078 | 65 | 0.072 | 1.260m × 300m |
| 68 | 0.081 | ||
| 70 | 0.087 | ||
| 2313 | 57 | 0.100 | |
| 2116 | 55 | 0.120 | 1.260m × 250m |
| 58 | 0.130 | ||
| 1506 | 48 | 0.160 | 1.260m × 150m |
| 7628 | 46 | 0.195 | |
| 48 | 0.205 | ||
| 50 | 0.215 | ||
| 52 | 0.225 |
Additional Information
Custom Options
Other resin contents, glass styles, and sizes are available upon request. Please contact us for customization details.
Hot Pressing Cycle
- Heating rate depends on copper thickness and multilayer PCB structure.
- Curing time: >45 minutes at 180–190 °C.
- For further technical support, feel free to contact our team directly.
Storage Conditions
- Shelf life: 3 months at <23 °C and <50% RH; up to 6 months at <5 °C.
- Before use, normalize at room temperature for at least 4 hours.
- Keep wrapped in moisture-proof material at all times to avoid moisture absorption, which may affect bonding strength.
- Avoid direct UV exposure and strong light.
Need Help?
If you have any questions regarding PCB production or Shengyi laminate materials, please feel free to contact us. We’re here to support your project with technical insight and fast response.
Advantages of Using S1000H Material for PCB Manufacturing
- High Thermal Reliability
S1000H offers a high Tg (Glass Transition Temperature) of 150°C, making it ideal for lead-free assembly and high-temperature applications. - Excellent Mechanical Strength
It provides strong flexural and peel strength, ensuring mechanical durability during fabrication and end-use. - Stable Electrical Performance
With low dielectric loss and consistent permittivity, S1000H is well-suited for high-speed signal transmission and multilayer designs. - Great Dimensional Stability
S1000H exhibits minimal expansion during thermal cycling, reducing the risk of delamination and improving PTH reliability. - Lead-Free Assembly Compatible
It can withstand multiple reflow cycles, making it compatible with RoHS-compliant manufacturing processes.
Why Choose Us to Manufacture PCBs with Shengyi S1000H
Shengyi S1000H is a high-performance FR-4 laminate renowned for its exceptional thermal stability, mechanical strength, and electrical properties. With a glass transition temperature (Tg) of 150°C and a decomposition temperature (Td) of 348°C, it ensures reliable performance in high-temperature environments. Its low dielectric constant (Dk) of 4.6 and low dissipation factor (Df) of 0.011 at 1GHz make it ideal for high-frequency applications, ensuring minimal signal loss and optimal performance.
Our engineering team possesses extensive experience in handling S1000H materials, enabling us to optimize drilling, lamination, and etching processes for high yield and minimal warpage. We specialize in multilayer stack-ups using S1000H, offering controlled impedance, fine-line resolution, and excellent layer registration. Our in-house reliability labs conduct T260/T288 and solder dip tests to validate the material’s performance under thermal stress, ensuring the durability and reliability of the final product.
Your Trusted Partner for S1000H PCB Solutions
By choosing us as your PCB manufacturing partner, you benefit from our commitment to quality, precision, and timely delivery. We source genuine S1000H laminates directly from Shengyi or verified suppliers, maintaining strict traceability across all batches. Our automated production lines and global logistics support ensure fast lead times and reliable delivery to clients worldwide. Whether you’re developing high-frequency communication devices, automotive electronics, or industrial control systems, our expertise in S1000H PCB fabrication positions us to meet your specific requirements with excellence.
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