KB-6165 Laminate for PCB Fabrication & Assembly

Build multilayer, lead-free PCBs with KB-6165. Highleap Electronics offers cost-effective PCB fabrication using this high-Tg FR-4 laminate.

KB-6165 High-Tg FR-4 for Scalable, Lead-Free PCB Builds

At Highleap Electronics, we manufacture PCBs using a wide range of customer-specified base materials—from high-Tg FR-4s to low-loss laminates, halogen-free options, and specialty flex cores. KB-6165 is one such proven choice: cost-effective, RoHS-compliant, and process-stable in high-density multilayer designs.

With Tg 153℃, low Z-axis expansion, and excellent CAF resistance, KB-6165 offers a strong balance of thermal reliability, electrical integrity, and manufacturing efficiency—making it ideal for telecom, industrial control, and volume consumer electronics.

Our in-house processes—including lamination, mechanical and laser drilling, copper plating, imaging, surface finishes (ENIG, OSP, immersion tin), and full SMT assembly—are fully qualified to run KB-6165 and many other advanced substrates.

Whether you’re sourcing standard FR-4 for a 4-layer controller or specifying controlled-impedance stackups with hybrid cores for 12+ layer boards, we tailor our fabrication around your spec—not the other way around.

KB-6165 Technical Specification Sheet

Remarks:
– Typical values are for reference only and may vary slightly due to different testing methods or equipment.
– All standard values are based on IPC-4101E/21 international specifications.

This technical information is provided by Kingboard Laminates Holdings Ltd.
For any technical questions regarding this material or if you need support in PCB manufacturing or assembly, please feel free to contact the professional team at Highleap Electronics.
We provide:
– Material selection consultation
– Prototyping and mass production
– One-stop SMT, THT, testing and PCBA services
– Custom technical documentation and compliance support

Built for the Real-World Demands of PCB Production

When you’re building high-reliability PCBs, every layer matters — especially the core laminate.

KB-6165 isn’t just a datasheet-friendly FR-4. It’s a material made for manufacturing success.

From tight trace integrity to stable lead-free reflow, KB-6165 performs consistently across a wide range of PCB production scenarios. If you’re an engineer, buyer, or EMS partner sourcing materials for:

• Multilayer PCBs with complex stackups
• Boards requiring repeated thermal cycling or IR reflow
• High aspect ratio vias or precision drilling
• Industrial environments (heat, humidity, voltage stress)

…then KB-6165 is a material you can spec without hesitation.

What makes it production-ready?

✔️ Stable Z-axis CTE — reduces delamination, ideal for multilayer registration
✔️ Anti-CAF design — mitigates failures in high humidity or voltage bias environments
✔️ Excellent dimensional stability — helps ensure etching precision and layer alignment
✔️ Fast drill-through & clean hole wall quality — reduces tool wear and improves plating
✔️ Lead-free process compatibility — no surprises in reflow

Whether you’re in automotive, telecom, consumer electronics, or industrial control, this laminate helps make production easier—not harder.

Partner with a Manufacturer Who Understands Your Production Challenges

At Highleap Electronics, we understand that specifying a PCB material isn’t just about datasheets—it’s about downstream performance, production consistency, and delivery confidence.

With our direct integration of KB-6165 into full-stack PCB manufacturing and assembly workflows, we offer more than just material supply. We provide manufacturing-grade assurance that bridges material capability with real-world production needs.

Why Leading Engineering Teams Choose Highleap:

• Full vertical integration: from laminate sourcing to PCB fabrication and turnkey assembly

• Process-proven stackups using KB-6165: validated across multilayer, HDI, and high-Tg builds

• Tight quality control: IPC Class 2/3 production, automated AOI/ICT/final inspection

• Responsive engineering support: for impedance modeling, stackup verification, and DFM/DFA

• Global fulfillment capabilities: supporting both prototype and mass-production scale

Whether you’re building a high-layer count backplane, a temperature-stressed control board, or a dense BGA-routed multilayer, KB-6165 offers the thermal, mechanical, and electrical performance your PCB design demands—and Highleap ensures it performs at scale.

📩 Request Material Samples or Manufacturing Support

Our engineers are available to advise you on:

• Material selection and stackup design using KB-6165

• Reflow and drilling compatibility assessments

• Controlled impedance planning and dielectric modeling

• Lead time, panel utilization, and cost optimization