IT-968 High-Speed PCB Laminate Solutions – Fabrication & Assembly by Highleap Electronics
Explore IT-968 SE PCB laminates for high-speed, high-frequency use. Highleap offers fabrication, assembly, and design support for multilayer IT-968 builds.
IT-968 High-Speed PCB Laminate for Advanced Electronic Designs
IT-968 is a high-performance PCB substrate engineered by ITEQ. It features a high glass transition temperature (Tg), excellent thermal stability, and ultra-low loss characteristics. This material is optimized for high-frequency and high-speed digital applications, including 5G infrastructure, data center servers, automotive radar, and more.
At Highleap Electronics, we provide full-stack PCB fabrication and assembly services using IT-968 laminates, supporting both prototyping and mass production with strict quality assurance.
Typical Applications:
- 5G wireless base stations and millimeter-wave modules
- High-speed backplanes, routers, and switches
- Automotive radar and ADAS systems
- AI computing, network acceleration, and RF front-end modules
Refer to the technical specifications below to evaluate IT-968’s suitability for your next project.
ITEQ Laminate/ Prepreg : IT-968TC SE/IT-968BS SE
| Property | Thickness < 0.50 mm [0.0197 in] | Thickness ≥ 0.50 mm [0.0197 in] | Units (Metric / English) |
Test Method (IPC‑TM‑650 or noted) |
||
|---|---|---|---|---|---|---|
| Typical | Spec | Typical | Spec | |||
| Peel Strength – Low/Very‑Low‑Profile Cu (>17 µm) | 0.44–0.61 (2.5–3.5) | 0.44 (2.50) | 0.44–0.61 (2.5–3.5) | 0.44 (2.50) | N/mm (lb/in) | 2.4.8 / 2.4.8.2 |
| Peel Strength – Standard Profile (1 oz) | 0.88–1.23 (5.0–7.0) | 0.70 (4.00) | 0.88–1.23 (5.0–7.0) | 0.70 (4.00) | N/mm (lb/in) | 2.4.8.3 |
| Volume Resistivity – C‑96/35/90 | >1010 | 106 | — | — | MΩ·cm | 2.5.17.1 |
| Volume Resistivity – After moisture resistance | — | — | >1010 | 104 | MΩ·cm | 2.5.17.1 |
| Volume Resistivity – At elevated temp E‑24/125 | >1010 | 103 | >1010 | 103 | MΩ·cm | 2.5.17.1 |
| Surface Resistivity – C‑96/35/90 | >109 | 104 | — | — | MΩ | 2.5.17.1 |
| Surface Resistivity – After moisture resistance | — | — | >109 | 104 | MΩ | 2.5.17.1 |
| Surface Resistivity – At elevated temp E‑24/125 | >109 | 103 | >109 | 103 | MΩ | 2.5.17.1 |
| Moisture Absorption, maximum | — | — | 0.12 | 0.5 | % | 2.6.2.1 |
| Dielectric Breakdown, minimum | — | — | >50 | 40 | kV | 2.5.6 |
| Permittivity (Dk) 1 GHz | 3.44 | AABUS | 3.44 | AABUS | — | 2.5.5.9 |
| Permittivity (Dk) 2 GHz | 3.44 | — | 3.44 | — | — | 2.5.5.13 |
| Permittivity (Dk) 5 GHz | 3.35 | — | 3.35 | — | — | 2.5.5.13 |
| Permittivity (Dk) 10 GHz | 3.34 | — | 3.34 | — | — | 2.5.5.13 |
| Loss Tangent (Df) 1 GHz | 0.0027 | AABUS | 0.0031 | AABUS | — | 2.5.5.9 |
| Loss Tangent (Df) 2 GHz | 0.0030 | — | 0.0030 | — | — | 2.5.5.13 |
| Loss Tangent (Df) 5 GHz | 0.0035 | — | 0.0035 | — | — | 2.5.5.13 |
| Loss Tangent (Df) 10 GHz | 0.0038 | — | 0.0038 | — | — | 2.5.5.13 |
| Flexural Strength – Length direction | — | — | 444 (64 380) | 415 (60 190) | N/mm² (psi) | 2.4.4 |
| Flexural Strength – Cross direction | — | — | 415 (60 175) | 345 (50 040) | N/mm² (psi) | 2.4.4 |
| Arc Resistance, minimum | >60 | 60 | >60 | 60 | s | 2.5.1 |
| Thermal Stress 288 °C 10 s – Unetched | Pass | Pass Visual | Pass | Pass Visual | Rating | 2.4.13.1 |
| Thermal Stress 288 °C 10 s – Etched | Pass | Pass Visual | Pass | Pass Visual | Rating | 2.4.13.1 |
| Electric Strength, minimum | >30 | 30 | — | — | kV/mm | 2.5.6.2 |
| Flammability | V‑0 | V‑0 | V‑0 | V‑0 | Rating | UL 94 |
| Glass Transition Temperature (TMA) | — | — | 175 | 170 min | °C | 2.4.24 |
| Decomposition Temperature (5 % wt loss) | — | — | 400 | 340 min | °C | 2.4.24.6 |
| X/Y Axis CTE (40–125 °C) | — | — | 12‑14 | — | ppm/°C | 2.4.24 |
| Z‑Axis CTE – Alpha 1 | — | — | 45 | 60 max | ppm/°C | 2.4.24 |
| Z‑Axis CTE – Alpha 2 | — | — | 260 | 300 max | ppm/°C | 2.4.24 |
| Z‑Axis Expansion 50–260 °C | — | — | 2.3 | 3.5 max | % | 2.4.24 |
| Thermal Resistance T260 | — | — | >60 | 30 min | min | 2.4.24.1 |
| Thermal Resistance T288 | — | — | >60 | 15 min | min | 2.4.24.1 |
| CAF Resistance | — | — | Pass | AABUS | Pass/Fail | 2.6.25 |
NOTE
- The above data and fabrication guidelines are provided for designers and PCB manufacturers as a reference. While the information is believed to be accurate, actual values may vary depending on test methods and manufacturing conditions. Final product specifications should be confirmed according to the agreement with ITEQ. ITEQ reserves the right to update data without prior notice to ensure the latest information is available to users.
- Highleap Electronics is a professional PCB manufacturer and assembler offering full-process services from prototyping to volume production. We work with a wide range of high-performance materials — including but not limited to IT-968 SE — and support complex stack-ups for high-speed and RF applications.
- If you require design consultation, material selection assistance, or customized stack-up suggestions using IT-968 SE or other substrates, our engineering team is ready to help. Contact us to get started on your project today.
Manufacturing Compatibility & Engineering Capabilities
Highleap Electronics has extensive experience manufacturing high-layer-count, high-speed, and RF PCBs using IT-968 SE laminates. We fully understand the lamination behavior, drill management, and signal integrity demands associated with this advanced low-Dk, ultra-low Df material.
Our facilities are equipped to handle complex builds while ensuring the thermal reliability and electrical performance required for IT-968-based designs. Whether you’re working on high-speed networking hardware, backplanes, line cards, or wireless/RF modules, our production lines are optimized for consistency, accuracy, and throughput.
- Supports multilayer PCB stackups from 2 to 60 layers
- Advanced HDI capabilities with blind/buried via structures
- Impedance-controlled routing with Dk simulation and field solver verification
- Surface finishes: ENIG, ENEPIG, immersion silver, and more
- Full inspection: 100% E-test, X-ray for inner layers, microsection analysis
- Certified to IPC Class 2 or 3 workmanship standards
In addition to manufacturing, our engineering team provides comprehensive design support — including stackup planning, thermal modeling, material substitution analysis, and CAM optimization — to help you reduce cost and risk without compromising quality.
For projects requiring IT-968 SE or comparable high-performance laminates, contact us to discuss fabrication constraints, turnaround time, and reliability targets. Our solutions are trusted by OEMs in telecom, defense, and high-performance computing.
Request a Quote or Engineering Support
Designing a high-speed digital or RF application that requires IT-968 laminate performance? Highleap Electronics is ready to help you turn your designs into reliable, production-ready PCBs — fast and affordably.
Our team specializes in IT-968-based PCB manufacturing, and we offer:
- Free DFM (Design for Manufacturability) checks and customized stack-up reviews for IT-968 high-speed PCBs
- Engineering support for material selection and dielectric simulation
- Rapid prototyping and full-scale production using IT-968 laminate for RF applications
- One-stop solutions: SMT stencil, programming, and turnkey PCB assembly
Need faster lead times, better cost control, or guidance on using IT-968 for multilayer PCB builds? Our engineers are here to provide insight and suggestions tailored to your project.
Request an instant quote or schedule a technical review today.
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