TU-862 HF for Halogen-Free PCB Manufacturing & Assembly

Highleap Electronics provides multilayer PCB fabrication and SMT assembly services for PCB projects involving TU-862 HF. Our manufacturing support covers stack-up review, impedance requirements, PCB fabrication, assembly, inspection, and testing.

TU-862 HF for High-Tg Halogen-Free Multilayer PCB Designs

TU-862 HF is a high-Tg, halogen-free PCB laminate manufactured by Taiwan Union Technology Corporation (TUC), with TU-86P HF as the corresponding prepreg. It may be specified for multilayer PCB designs where halogen-free material requirements, thermal performance, and lead-free assembly conditions need to be considered.

For PCB projects specifying TU-862 HF, the material requirement should be reviewed together with the complete board construction, including layer count, copper thickness, via structure, finished board thickness, controlled impedance, lamination requirements, and assembly process. Highleap Electronics manufactures and assembles PCBs according to customer-approved material and design specifications; we do not manufacture TU-862 HF laminate or prepreg.

PCB-Relevant Material Characteristics

• High-Tg halogen-free laminate and prepreg system
• Tg: 170°C by TMA and 200°C by DMA
• Low Z-axis thermal expansion, with a typical value of 2.1% from 50–260°C
• Designed for lead-free PCB assembly conditions
• CAF resistance and moisture resistance for applicable PCB reliability requirements
• Compatible with standard PCB fabrication processes, including AOI processing

Typical PCB Application Areas

• Backplanes and high-performance computing boards
• Server and storage system PCBs
• Telecom and base-station circuit boards
• Line cards and networking equipment
• Office router and multilayer control boards

TU-862 HF Technical Properties

NOTE

1. The information above is provided for general PCB engineering reference only. Final PCB requirements should be determined from the approved design, stack-up, fabrication documentation, and applicable project specifications.
2. TU-862 HF and TU-86P HF are laminate and prepreg products of Taiwan Union Technology Corporation (TUC). Current material properties, available constructions, approvals, and compliance information should be verified from TUC’s latest technical documentation.
3. Highleap Electronics is a PCB fabrication and PCB assembly manufacturer. Our engineering work covers PCB manufacturability, stack-up, impedance, fabrication, assembly, inspection, and testing requirements; we do not manufacture laminate or prepreg materials.

Difference Between TU-862 HF and TU-862T

While TU-862 HF and TU-862T share a halogen-free base and are designed for high Tg PCB applications, their intended use cases and property profiles differ. Here is a clear comparison:

If you’re unsure which version fits your design better, Highleap Electronics offers material consultation, stackup simulation, and TU-862 HF/T side-by-side evaluations.

Environmental Compliance and Fabrication Compatibility

TU-862 HF is fully certified for global environmental regulations, including RoHS 2.0, REACH SVHC, and UL 94V-0 (UL file: E189572). It meets IEC 61249-2-21 standards for halogen-free materials and is listed under IPC-4101 types /127, /128, and /130. This makes it suitable for export-oriented electronics and OEMs that require documented compliance without exceptions.

From a production perspective, TU-862 HF is drop-in compatible with standard FR-4 workflows. It requires no changes to lamination profiles, drill settings, or surface treatments. The laminate supports UV-blocking for better AOI contrast and is proven to work with ENIG, OSP, and lead-free soldering. Its high-Tg and thermal endurance allow it to perform reliably across multiple reflow cycles.

Material availability includes common glass fabrics like 106, 1080, 2113, 2116, 1506, and 7628, with thickness options from 0.05 mm to 1.58 mm. Copper foil is available from 1/3 oz to 5 oz in both HTE and RTF styles, giving designers flexibility for impedance control, current handling, and signal integrity across multilayer builds.

PCB Manufacturing & Assembly for TU-862 HF Projects

Highleap Electronics is a PCB fabrication and PCB assembly factory based in China. Our work focuses on manufacturing finished PCBs and PCBAs according to approved drawings, stack-ups, material requirements, and production documentation rather than manufacturing laminate or prepreg materials.

For multilayer and HDI PCB projects involving TU-862 HF, our engineering review covers Gerber data, PCB stack-up, impedance requirements, via structures, copper construction, drilling, lamination, surface finish, and assembly interfaces. Material properties and compliance information are verified against the applicable project documentation and the material manufacturer’s current technical information.

From prototype builds to volume production, Highleap Electronics can coordinate PCB fabrication with SMT/THT assembly, component sourcing, inspection, electrical testing, functional testing, and production traceability where required. This allows bare-board and PCBA requirements to be managed within one manufacturing workflow.

Need support for a halogen-free multilayer or HDI PCB project involving TU-862 HF? Contact Highleap Electronics for PCB manufacturing review, assembly requirements, and quotation.