High-Speed IS620i PCB Assembly & Fabrication Services
Highleap Electronics provides IS620i PCB assembly and manufacturing using Isola materials, tailored for high-speed digital and RF applications.
Expert PCB Manufacturing for High-Speed Applications — Including IS620i Materials
At Highleap Electronics, we are a full-service PCB manufacturer and assembly house, capable of handling all mainstream and advanced laminate materials—from standard FR4 to IS620i, RO4003C, MEGTRON6, and beyond.
Our factory is equipped for rigid, HDI, RF, and multilayer PCB production, and we work with designers across industries to bring their high-speed, low-loss PCB designs to life with unmatched precision.
IS620i, developed by Isola Group, is one of the many materials we support. This revolutionary material represents the first in the digital products class built upon existing technologies, yet offering significant advantages for today’s digital world. IS620i is uniquely formulated for high-speed applications ranging from 2 to 15 GHz, providing designers and fabricators with the flexibility of digital design, assurance of supply, and ease of conventional FR-4 processing.
Key Specifications at a Glance
- Glass Transition Temperature (Tg): 225°C
- Decomposition Temperature (Td): 364°C
- Dielectric Constant (Dk): 3.58
- Dissipation Factor (Df): 0.006
Technical Specifications of IS620i Laminate
The following table presents the comprehensive technical specifications for IS620i high-performance laminate and prepreg materials. All values are typical properties and are provided for engineering reference purposes.
Thermal Properties
| Property | Typical Value | Units | Test Method |
|---|---|---|---|
| Glass Transition Temperature (Tg) by DSC | 225 | °C | IPC-TM-650 2.4.25C |
| Decomposition Temperature (Td) by TGA @ 5% weight loss | 364 | °C | IPC-TM-650 2.4.24.6 |
| Time to Delaminate by TMA (Copper removed) – T260 | 60 | Minutes | IPC-TM-650 2.4.24.1 |
| Time to Delaminate by TMA (Copper removed) – T288 | >20 | Minutes | IPC-TM-650 2.4.24.1 |
| Z-Axis CTE – Pre-Tg | 55 | ppm/°C | IPC-TM-650 2.4.24C |
| Z-Axis CTE – Post-Tg | 230 | ppm/°C | IPC-TM-650 2.4.24C |
| Z-Axis CTE – 50 to 260°C (Total Expansion) | 2.8 | % | IPC-TM-650 2.4.24C |
| X/Y-Axis CTE Pre-Tg | 13 | ppm/°C | IPC-TM-650 2.4.24C |
| Thermal Conductivity | 0.35 | W/mK | ASTM E1952 |
| Thermal Stress 10 sec @ 288°C – Unetched | Pass | Pass Visual | IPC-TM-650 2.4.13.1 |
| Thermal Stress 10 sec @ 288°C – Etched | Pass | Pass Visual | IPC-TM-650 2.4.13.1 |
Electrical Properties
| Property | Typical Value | Units | Test Method |
|---|---|---|---|
| Dk, Permittivity @ 100 MHz | 3.59 | — | IPC-TM-650 2.5.5.3 |
| Dk, Permittivity @ 1 GHz | 3.58 | — | IPC-TM-650 2.5.5.9 Bereskin Stripline |
| Dk, Permittivity @ 2 GHz | 3.58 | — | Bereskin Stripline |
| Dk, Permittivity @ 5 GHz | 3.54 | — | Bereskin Stripline |
| Dk, Permittivity @ 10 GHz | 3.54 | — | Bereskin Stripline |
| Df, Loss Tangent @ 100 MHz | 0.0051 | — | IPC-TM-650 2.5.5.3 |
| Df, Loss Tangent @ 1 GHz | 0.0059 | — | IPC-TM-650 2.5.5.9 Bereskin Stripline |
| Df, Loss Tangent @ 2 GHz | 0.0060 | — | Bereskin Stripline |
| Df, Loss Tangent @ 5 GHz | 0.0066 | — | Bereskin Stripline |
| Df, Loss Tangent @ 10 GHz | 0.0071 | — | Bereskin Stripline |
| Volume Resistivity – After moisture resistance | 8.9 × 10⁸ | MΩ-cm | IPC-TM-650 2.5.17.1 |
| Volume Resistivity – At elevated temperature | 6.5 × 10⁸ | MΩ-cm | IPC-TM-650 2.5.17.1 |
| Surface Resistivity – After moisture resistance | 2.21 × 10⁶ | MΩ | IPC-TM-650 2.5.17.1 |
| Surface Resistivity – At elevated temperature | 4.4 × 10⁸ | MΩ | IPC-TM-650 2.5.17.1 |
| Dielectric Breakdown | >50 | kV | IPC-TM-650 2.5.6B |
| Arc Resistance | 110 | Seconds | IPC-TM-650 2.5.1B |
| Electric Strength (Laminate & laminated prepreg) | 55 (1400) | kV/mm (V/mil) | IPC-TM-650 2.5.6.2A |
| Comparative Tracking Index (CTI) | 2 (250-399) | Class (Volts) | UL 746A ASTM D3638 |
Mechanical Properties
| Property | Typical Value | Units | Test Method |
|---|---|---|---|
| Peel Strength – Low profile copper foil (>17 μm) | 1.14 (6.5) | N/mm (lb/inch) | IPC-TM-650 2.4.8C |
| Peel Strength – Standard profile copper after thermal stress | 0.96 (5.5) | N/mm (lb/inch) | IPC-TM-650 2.4.8.2A |
| Peel Strength – Standard profile copper after process solutions | 0.90 (5.1) | N/mm (lb/inch) | IPC-TM-650 2.4.8.3 |
| Flexural Strength – Length direction | 69.2 | ksi | IPC-TM-650 2.4.4B |
| Flexural Strength – Cross direction | 62.4 | ksi | IPC-TM-650 2.4.4B |
| Tensile Strength – Length direction | 42.1 | ksi | ASTM D3039 |
| Tensile Strength – Cross direction | 39.7 | ksi | ASTM D3039 |
| Young’s Modulus – Length direction | 3217 | ksi | ASTM D790-15e2 |
| Young’s Modulus – Cross direction | 3207 | ksi | ASTM D790-15e2 |
| Poisson’s Ratio – Length direction | 0.166 | — | ASTM D3039 |
| Poisson’s Ratio – Cross direction | 0.164 | — | ASTM D3039 |
Additional Properties
| Property | Typical Value | Units | Test Method |
|---|---|---|---|
| Moisture Absorption | 0.24 | % | IPC-TM-650 2.6.2.1A |
| Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 |
| Max Operating Temperature | 130 | °C | UL 796 |
Important Technical Notes
All technical values shown above for IS620i laminates are typical properties published by Isola Group and are provided strictly for engineering reference. Actual performance may vary depending on your specific PCB layout, layer configuration, via design, and manufacturing process.
At Highleap Electronics, we use only authentic IS620i laminates sourced directly from Isola-approved channels, ensuring quality and traceability in every production run.
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
Why Engineers Choose IS620i for High-Speed, Low-Loss PCB Projects
At Highleap Electronics, we recommend IS620i laminates for high-speed digital circuits, particularly for designs operating in the 2 to 15 GHz frequency range. This material stands out for its superior electrical performance, thermal stability, and processing flexibility. IS620i ensures exceptional signal integrity and minimal signal loss, making it the ideal choice for applications requiring high-speed, low-loss PCB solutions, such as telecommunications, advanced computing, and digital systems.
Key Benefits of IS620i
- Superior Electrical Performance: IS620i offers a dielectric constant of 3.58 and a dissipation factor of 0.006 at 10 GHz, ensuring excellent signal integrity and minimal signal loss over a wide frequency range, ideal for high-speed applications.
- Exceptional Thermal Stability: With a glass transition temperature (Tg) of 225°C and a decomposition temperature of 364°C, IS620i performs reliably even in demanding thermal environments, making it well-suited for high-power electronics.
- Processing Flexibility: IS620i is compatible with conventional FR-4 processing techniques, which helps reduce manufacturing costs while maintaining high performance. It’s suitable for both small-batch prototypes and large-scale production, providing versatility throughout the production process.
- Industry Recognition and Compliance: IS620i is UL certified (File Number E41625) and RoHS compliant, ensuring it meets industry standards for safety and environmental compliance. Available in both laminate and prepreg forms, IS620i offers flexibility for complex multilayer designs.
Ideal Applications for IS620i
IS620i is ideal for a variety of high-performance applications, including high-speed digital circuits, telecommunications infrastructure, data center equipment, and advanced computing systems. Its UV blocking properties and AOI fluorescence provide additional benefits in automated optical inspection (AOI), improving quality control during production. At Highleap Electronics, we offer free stackup consulting to help customers select the best material for their performance, cost, and manufacturing needs, ensuring the right solution for your specific requirements.
IS620i PCB Fabrication & Assembly Solutions
At Highleap Electronics, we offer more than just IS620i PCB manufacturing. We are your full-service partner for all PCB needs, from 2-layer FR4 prototypes to advanced 60-layer HDI and multilayer PCBs. Our comprehensive services cover everything from design and material selection to turnkey fabrication and assembly, ensuring high-performance solutions tailored to your specific project requirements.
Our IS620i PCB Capabilities
- Precision Impedance Control: Achieving ±5% accuracy for differential pairs and RF transmission lines, ensuring optimal signal integrity.
- Advanced HDI Processing: With microvias, via-in-pad, and via plugging for high-density designs.
- Complex Multilayer Stackups: Expertise in hybrid materials (e.g., IS620i + FR4) for cost-effective performance.
- Premium Surface Finishes: Including ENIG, ENEPIG, hard gold, and OSP, meeting specific application needs.
Full Turnkey SMT Assembly and Rigorous Quality Assurance
We provide complete SMT assembly for BGA, QFN, 01005 components, and RF shield placement. Our rigorous QA testing includes AOI, X-ray inspection, functional testing, and flying probe testing for maximum reliability. All projects use genuine IS620i laminates from Isola Group, backed by IPC Class 2/3 standards. Whether you need IS620i, RO4350B, or FR4 substrates, we have the expertise and infrastructure to deliver exceptional results for any project.
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