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High-Speed IS620i PCB Assembly & Fabrication Services

Highleap Electronics provides IS620i PCB assembly and manufacturing using Isola materials, tailored for high-speed digital and RF applications.

IS620i Materials PCB

Expert PCB Manufacturing for High-Speed Applications — Including IS620i Materials

At Highleap Electronics, we are a full-service PCB manufacturer and assembly house, capable of handling all mainstream and advanced laminate materials—from standard FR4 to IS620i, RO4003C, MEGTRON6, and beyond.

Our factory is equipped for rigid, HDI, RF, and multilayer PCB production, and we work with designers across industries to bring their high-speed, low-loss PCB designs to life with unmatched precision.

IS620i, developed by Isola Group, is one of the many materials we support. This revolutionary material represents the first in the digital products class built upon existing technologies, yet offering significant advantages for today’s digital world. IS620i is uniquely formulated for high-speed applications ranging from 2 to 15 GHz, providing designers and fabricators with the flexibility of digital design, assurance of supply, and ease of conventional FR-4 processing.

Key Specifications at a Glance

  • Glass Transition Temperature (Tg): 225°C
  • Decomposition Temperature (Td): 364°C
  • Dielectric Constant (Dk): 3.58
  • Dissipation Factor (Df): 0.006

Technical Specifications of IS620i Laminate

The following table presents the comprehensive technical specifications for IS620i high-performance laminate and prepreg materials. All values are typical properties and are provided for engineering reference purposes.

Thermal Properties

Property Typical Value Units Test Method
Glass Transition Temperature (Tg) by DSC 225 °C IPC-TM-650 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 364 °C IPC-TM-650 2.4.24.6
Time to Delaminate by TMA (Copper removed) – T260 60 Minutes IPC-TM-650 2.4.24.1
Time to Delaminate by TMA (Copper removed) – T288 >20 Minutes IPC-TM-650 2.4.24.1
Z-Axis CTE – Pre-Tg 55 ppm/°C IPC-TM-650 2.4.24C
Z-Axis CTE – Post-Tg 230 ppm/°C IPC-TM-650 2.4.24C
Z-Axis CTE – 50 to 260°C (Total Expansion) 2.8 % IPC-TM-650 2.4.24C
X/Y-Axis CTE Pre-Tg 13 ppm/°C IPC-TM-650 2.4.24C
Thermal Conductivity 0.35 W/mK ASTM E1952
Thermal Stress 10 sec @ 288°C – Unetched Pass Pass Visual IPC-TM-650 2.4.13.1
Thermal Stress 10 sec @ 288°C – Etched Pass Pass Visual IPC-TM-650 2.4.13.1

Electrical Properties

Property Typical Value Units Test Method
Dk, Permittivity @ 100 MHz 3.59 IPC-TM-650 2.5.5.3
Dk, Permittivity @ 1 GHz 3.58 IPC-TM-650 2.5.5.9 Bereskin Stripline
Dk, Permittivity @ 2 GHz 3.58 Bereskin Stripline
Dk, Permittivity @ 5 GHz 3.54 Bereskin Stripline
Dk, Permittivity @ 10 GHz 3.54 Bereskin Stripline
Df, Loss Tangent @ 100 MHz 0.0051 IPC-TM-650 2.5.5.3
Df, Loss Tangent @ 1 GHz 0.0059 IPC-TM-650 2.5.5.9 Bereskin Stripline
Df, Loss Tangent @ 2 GHz 0.0060 Bereskin Stripline
Df, Loss Tangent @ 5 GHz 0.0066 Bereskin Stripline
Df, Loss Tangent @ 10 GHz 0.0071 Bereskin Stripline
Volume Resistivity – After moisture resistance 8.9 × 10⁸ MΩ-cm IPC-TM-650 2.5.17.1
Volume Resistivity – At elevated temperature 6.5 × 10⁸ MΩ-cm IPC-TM-650 2.5.17.1
Surface Resistivity – After moisture resistance 2.21 × 10⁶ IPC-TM-650 2.5.17.1
Surface Resistivity – At elevated temperature 4.4 × 10⁸ IPC-TM-650 2.5.17.1
Dielectric Breakdown >50 kV IPC-TM-650 2.5.6B
Arc Resistance 110 Seconds IPC-TM-650 2.5.1B
Electric Strength (Laminate & laminated prepreg) 55 (1400) kV/mm (V/mil) IPC-TM-650 2.5.6.2A
Comparative Tracking Index (CTI) 2 (250-399) Class (Volts) UL 746A ASTM D3638

Mechanical Properties

Property Typical Value Units Test Method
Peel Strength – Low profile copper foil (>17 μm) 1.14 (6.5) N/mm (lb/inch) IPC-TM-650 2.4.8C
Peel Strength – Standard profile copper after thermal stress 0.96 (5.5) N/mm (lb/inch) IPC-TM-650 2.4.8.2A
Peel Strength – Standard profile copper after process solutions 0.90 (5.1) N/mm (lb/inch) IPC-TM-650 2.4.8.3
Flexural Strength – Length direction 69.2 ksi IPC-TM-650 2.4.4B
Flexural Strength – Cross direction 62.4 ksi IPC-TM-650 2.4.4B
Tensile Strength – Length direction 42.1 ksi ASTM D3039
Tensile Strength – Cross direction 39.7 ksi ASTM D3039
Young’s Modulus – Length direction 3217 ksi ASTM D790-15e2
Young’s Modulus – Cross direction 3207 ksi ASTM D790-15e2
Poisson’s Ratio – Length direction 0.166 ASTM D3039
Poisson’s Ratio – Cross direction 0.164 ASTM D3039

Additional Properties

Property Typical Value Units Test Method
Moisture Absorption 0.24 % IPC-TM-650 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Max Operating Temperature 130 °C UL 796

Important Technical Notes

All technical values shown above for IS620i laminates are typical properties published by Isola Group and are provided strictly for engineering reference. Actual performance may vary depending on your specific PCB layout, layer configuration, via design, and manufacturing process.

At Highleap Electronics, we use only authentic IS620i laminates sourced directly from Isola-approved channels, ensuring quality and traceability in every production run.

The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

Why Engineers Choose IS620i for High-Speed, Low-Loss PCB Projects

At Highleap Electronics, we recommend IS620i laminates for high-speed digital circuits, particularly for designs operating in the 2 to 15 GHz frequency range. This material stands out for its superior electrical performance, thermal stability, and processing flexibility. IS620i ensures exceptional signal integrity and minimal signal loss, making it the ideal choice for applications requiring high-speed, low-loss PCB solutions, such as telecommunications, advanced computing, and digital systems.

Key Benefits of IS620i

  1. Superior Electrical Performance: IS620i offers a dielectric constant of 3.58 and a dissipation factor of 0.006 at 10 GHz, ensuring excellent signal integrity and minimal signal loss over a wide frequency range, ideal for high-speed applications.
  2. Exceptional Thermal Stability: With a glass transition temperature (Tg) of 225°C and a decomposition temperature of 364°C, IS620i performs reliably even in demanding thermal environments, making it well-suited for high-power electronics.
  3. Processing Flexibility: IS620i is compatible with conventional FR-4 processing techniques, which helps reduce manufacturing costs while maintaining high performance. It’s suitable for both small-batch prototypes and large-scale production, providing versatility throughout the production process.
  4. Industry Recognition and Compliance: IS620i is UL certified (File Number E41625) and RoHS compliant, ensuring it meets industry standards for safety and environmental compliance. Available in both laminate and prepreg forms, IS620i offers flexibility for complex multilayer designs.

Ideal Applications for IS620i

IS620i is ideal for a variety of high-performance applications, including high-speed digital circuits, telecommunications infrastructure, data center equipment, and advanced computing systems. Its UV blocking properties and AOI fluorescence provide additional benefits in automated optical inspection (AOI), improving quality control during production. At Highleap Electronics, we offer free stackup consulting to help customers select the best material for their performance, cost, and manufacturing needs, ensuring the right solution for your specific requirements.

Turnkey-PCB-Assembly-Factory

IS620i PCB Fabrication & Assembly Solutions

At Highleap Electronics, we offer more than just IS620i PCB manufacturing. We are your full-service partner for all PCB needs, from 2-layer FR4 prototypes to advanced 60-layer HDI and multilayer PCBs. Our comprehensive services cover everything from design and material selection to turnkey fabrication and assembly, ensuring high-performance solutions tailored to your specific project requirements.

Our IS620i PCB Capabilities

  • Precision Impedance Control: Achieving ±5% accuracy for differential pairs and RF transmission lines, ensuring optimal signal integrity.
  • Advanced HDI Processing: With microvias, via-in-pad, and via plugging for high-density designs.
  • Complex Multilayer Stackups: Expertise in hybrid materials (e.g., IS620i + FR4) for cost-effective performance.
  • Premium Surface Finishes: Including ENIG, ENEPIG, hard gold, and OSP, meeting specific application needs.

Full Turnkey SMT Assembly and Rigorous Quality Assurance

We provide complete SMT assembly for BGA, QFN, 01005 components, and RF shield placement. Our rigorous QA testing includes AOI, X-ray inspection, functional testing, and flying probe testing for maximum reliability. All projects use genuine IS620i laminates from Isola Group, backed by IPC Class 2/3 standards. Whether you need IS620i, RO4350B, or FR4 substrates, we have the expertise and infrastructure to deliver exceptional results for any project.

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