China I-Tera MT40 PCB Manufacturing – High-Speed & Low Loss
Highleap Electronics offers fast-turn I-Tera MT40 PCB fabrication and assembly. We build certified, low loss, high-speed multilayer boards with global delivery from China.
I-Tera MT40 PCB Manufacturing for High-Speed Digital and RF Designs
I-Tera MT40 is a low-loss PCB laminate and prepreg material family from Isola for high-speed digital and RF/microwave circuit designs. Highleap Electronics provides high-frequency PCB manufacturing and PCB assembly services for projects that specify I-Tera MT40 in multilayer, controlled-impedance, and other signal-sensitive board constructions.
In an I-Tera MT40 PCB build, material properties are only one part of the overall electrical design. Stack-up geometry, copper thickness, dielectric spacing, trace dimensions, reference planes, via transitions, and copper-foil characteristics can all influence the finished PCB. Highleap reviews these board-level requirements as part of the fabrication data before production.
- Low-loss material platform for high-speed digital and RF/microwave PCBs
- Laminate and prepreg options for multilayer PCB stack-ups
- Applicable to controlled-impedance and high-frequency PCB designs
- Support for multilayer, HDI, hybrid, and complex PCB constructions
For I-Tera MT40 PCB manufacturing projects, Highleap Electronics can work from your released Gerber files, stack-up, impedance requirements, drill data, and assembly documentation to plan PCB fabrication and PCBA production. Current material properties and available constructions should be confirmed against the applicable Isola technical documentation before the final stack-up is released.
I-Tera® MT40 – Typical Values
| Property | Typical Value | Units | Test Method |
|---|---|---|---|
| Glass Transition Temperature (Tg) by DSC | 200 | °C | 2.4.25C |
| Glass Transition Temperature (Tg) by TMA | 205 | °C | 2.4.24C |
| Decomposition Temperature (Td) by TGA @ 5 % weight loss | 360 | °C | 2.4.24.6 |
| Time to Delaminate by TMA (Copper removed) — A. T260 | >60 | Minutes | 2.4.24.1 |
| Time to Delaminate by TMA (Copper removed) — B. T288 | >60 | Minutes | |
| Z-Axis CTE — A. Pre-Tg | 55 | ppm/°C | 2.4.24C |
| Z-Axis CTE — B. Post-Tg | 290 | ppm/°C | |
| Z-Axis CTE — C. 50–260 °C (Total Expansion) | 2.8 | % | |
| X/Y-Axis CTE — Pre-Tg | 12 | ppm/°C | |
| Thermal Conductivity | 0.61 | W/m·K | ASTM E1952 |
| Thermal Stress 10 s @ 288 °C (550.4 °F) — A. Unetched | Pass | Visual | 2.4.13.1 |
| Thermal Stress 10 s @ 288 °C (550.4 °F) — B. Etched | Pass | Visual | |
| Dk, Permittivity — @ 2 / 5 / 10 GHz | 3.45 | — | 2.5.5.5 |
| Df, Loss Tangent — @ 2 / 5 / 10 GHz | 0.0031 | — | Bereskin Stripline |
| Volume Resistivity C-96/35/90 | 1.33 × 107 | MΩ·cm | 2.5.17.1 |
| Surface Resistivity C-96/35/90 | 1.33 × 105 | MΩ | 2.5.17.1 |
| Dielectric Breakdown | 45.4 | kV | 2.5.6B |
| Arc Resistance | 139 | Seconds | 2.5.1B |
| Electric Strength (Laminate & laminated prepreg) | 45 (1133) | kV/mm (V/mil) | 2.5.6.2A |
| Comparative Tracking Index (CTI) | 3 | Class (Volts) | UL 746A / ASTM D3638 |
| Peel Strength — 1 oz EDC foil | 1.0 (5.7) | N/mm (lb/in) | 2.4.8C |
| Flexural Strength – A. Length direction | 71.0 | ksi | 2.4.4B |
| Flexural Strength – B. Cross direction | 58.0 | ksi | |
| Tensile Strength – A. Length direction | 39.0 | ksi | ASTM D3039 |
| Tensile Strength – B. Cross direction | 35.0 | ksi | |
| Young’s Modulus – A. Length direction | 3060 | ksi | ASTM D790-15e2 |
| Young’s Modulus – B. Cross direction | 2784 | ksi | |
| Poisson’s Ratio – A. Length direction | 0.234 | — | ASTM D3039 |
| Poisson’s Ratio – B. Cross direction | 0.222 | — | |
| Moisture Absorption | 0.1 | % | 2.6.2.1A |
| Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 |
| Relative Thermal Index (RTI) | 130 | °C | UL 796 |
Note:
All technical data above are typical values based on the official I-Tera® MT40 datasheet and standard test methods (e.g. IPC-TM-650, ASTM). Actual results may vary depending on processing variables such as copper type, layer count, and stackup design. For critical designs, please contact Highleap Electronics for engineering support and stackup validation.
China-Based I-Tera® MT40 PCB Manufacturing – Powered by Multi-Material Expertise
At Highleap Electronics, we specialize in high-speed PCB manufacturing and assembly using a wide range of industry-leading materials — including I-Tera® MT40, low-loss RF laminates, and high-speed laminate series. Our extensive in-house inventory allows us to meet diverse design and cost-performance requirements across telecom, aerospace, and datacenter applications.
With years of hands-on experience in I-Tera MT40 PCB fabrication, we offer fully customized stackups, impedance control, and multilayer constructions that meet the demands of 25–56 Gbps interconnects, PCIe Gen 4/5, and 100G/400G signal transmission. All PCBs are manufactured in our IPC Class 2/3 certified facility in China with strict quality controls and fast delivery cycles.
- 100% genuine Isola I-Tera® MT40 laminate sourcing
- Hybrid stackup support (I-Tera MT40 + FR4, or others)
- Advanced fabrication: HDI, microvias, backdrilling
- Full electrical testing, impedance validation, AOI & X-ray
- Rapid prototyping (5–7 days) and global shipping options
Whether you need I-Tera MT40 PCBs or other high-speed PCB substrates, Highleap provides one-stop manufacturing and turnkey assembly to accelerate your time to market. Our team can also help you compare material properties or build around your I-Tera MT40 datasheet specifications for the best performance-cost match.
Reliable I-Tera® MT40 PCB Supplier with Fast Turnaround and Full QA Support
Highleap Electronics delivers fast-turn I-Tera MT40 PCB fabrication and assembly with full in-house quality control. Whether you’re prototyping a high-speed signal layer or building volume RF modules, we combine factory-direct production with signal integrity expertise to ensure performance, consistency, and on-time delivery.
As a certified high-speed PCB factory, we support standard and hybrid MT40 stackups, offer impedance-controlled routing, and include comprehensive QA testing — making us a trusted partner for engineers and OEMs worldwide.
- Free DFM + stack-up review by experienced RF/Signal engineers
- 3–7 day quick-turn production for common I-Tera MT40 builds
- AOI, X-ray, impedance test, electrical test all included
- Factory certifications: RoHS, UL, ISO9001, IATF16949
- Global logistics support + local engineering assistance
Contact us to request a quote, receive material samples, or get technical advice on your MT40 PCB layout, RF design, or multilayer stackup. We also support a wide range of other low loss PCB laminates beyond I-Tera MT40, including low-loss RF and high-speed laminate families.