Select Page

IT-988G PCB Laminate for High-Speed, RF & 5G Designs

 

Explore IT-988G high-speed PCB laminate for RF, 5G, and AI hardware. Highleap offers fabrication, stackup review, and turnkey assembly for IT-988G boards.

 

 

 

IT-988G High-Speed PCB

IT-988G High-Speed, Low-Loss PCB Laminate for Advanced Signal Integrity

IT-988G is a high-performance, ultra-low-loss PCB laminate developed by ITEQ for demanding high-speed and high-frequency applications. With a stable dielectric constant (Dk) of 3.63 and a consistently low dissipation factor (Df) of 0.0029 across frequencies up to 20 GHz, IT-988G is ideally suited for applications that require exceptional signal integrity, thermal stability, and mechanical reliability.

At Highleap Electronics, we specialize in the fabrication and assembly of multilayer PCBs using advanced materials like IT-988G. Our engineering team is experienced in managing the unique characteristics of this material, ensuring clean signal routing, controlled impedance, and layer integrity even in dense HDI builds.

  • IT-988G high-speed PCB laminate
  • Low-loss PCB substrate for signal integrity
  • ITEQ IT-988G PCB stackup fabrication

Technical Performance of IT-988G Laminates

The following IPC-standard test data highlights IT-988G’s suitability for high-frequency PCB builds and thermal-critical applications.

Item Typical Value Unit IPC TM‑650 Method
Peel Strength – 0.5 oz very‑low‑roughness Cu 2.9 – 3.1 PLI 2.4.8
Volume Resistivity TBD MΩ·cm 2.5.17.1
Surface Resistivity TBD 2.5.17.1
Moisture Absorption (max.) 0.31 % 2.6.2.1
Permittivity (Dk, 53 % resin)
A. 1 GHz / 2 GHz
B. 5 GHz / 10 GHz
C. 15 GHz / 20 GHz
3.63 / 3.63
3.63 / 3.63
3.63 / 3.63
2.5.5.13
Loss Tangent (Df, 53 % resin)
A. 1 GHz / 2 GHz
B. 5 GHz / 10 GHz
C. 15 GHz / 20 GHz
0.0029 / 0.0029
0.0029 / 0.0029
0.0029 / 0.0029
2.5.5.13
Flexural Strength – Length TBD N/mm² 2.4.4
Flexural Strength – Cross TBD N/mm² 2.4.4
Thermal Stress 288 °C 10 s – Unetched Pass Rating 2.4.13.1
Thermal Stress 288 °C 10 s – Etched Pass Rating 2.4.13.1
Flammability TBD UL 94
Glass Transition Temperature (Tg)
A. TMA
B. DSC
C. DMA
190
190
205
°C 2.4.25
Decomposition Temperature (5 % wt loss) 405 °C 2.4.24.6
X/Y Axis CTE (40–125 °C) 15 / 16 ppm/°C 2.4.24
Z‑Axis CTE
A. Alpha 1
B. Alpha 2
C. 50–260 °C Expansion
58
325
2.95 %
ppm/°C
ppm/°C
%
2.4.24
Thermal Resistance
A. T260
B. T288
C. T300
> 120
> 120
> 120
min 2.4.24.1

NOTE

  • The data and fabrication guidelines above are provided as a reference for PCB designers and manufacturers. While all information is based on industry-standard testing, actual performance may vary depending on materials, processes, and production conditions. Final product specifications should always be verified in accordance with the agreement between ITEQ and the end user. ITEQ reserves the right to revise specifications without prior notice.
  • Highleap Electronics is a full-service PCB manufacturer and assembler, supporting both prototyping and high-volume production. We work with a broad range of high-frequency materials — including but not limited to IT-968 SE and IT-988G — and have extensive experience building reliable, high-speed and RF multilayer stackups.
  • If your project requires stackup consulting, material selection advice, or impedance/tolerance guidance for IT-968 SE, IT-988G, or similar substrates, our engineering team is here to assist. Contact us to discuss how we can support your next high-performance PCB build.

Applications of IT-988G Laminate

Thanks to its excellent electrical properties and thermal reliability, IT-988G is widely adopted in the following sectors:

  • 800G / 400G Ethernet routers and network backplanes
  • AI accelerator cards and high-speed computing modules
  • Automotive radar, LiDAR and ADAS control units
  • 5G mmWave antennas, baseband units and RF front ends
  • High-density defense/aerospace digital systems

IT-988G’s low Z-axis expansion and glass transition temperature of 190°C (TMA/DSC) make it particularly suitable for dense via structures and complex multilayer stackups. It enables low-loss transmission lines, reduced skew, and stable performance across temperature cycles.

  • High-speed network PCB with IT-988G
  • IT-988G laminate for automotive radar
  • RF PCB manufacturing using ITEQ IT-988G
Turnkey-PCB-Assembly-Factory

Request a Quote or Engineering Support

Whether you’re working on a prototype or preparing for volume production, Highleap Electronics can support your full PCB lifecycle using IT-988G and other high-frequency materials. We offer:

  • Free DFM reviews and stackup planning for IT-988G multilayer PCBs
  • Impedance modeling and Dk simulation across 1–20 GHz
  • Turnkey PCB assembly including SMT stencil, BOM sourcing, and programming
  • Proven experience with IT-988G for high-layer-count, HDI, and RF builds

Looking for better lead time or material optimization? We provide tailored consultation to help you balance signal integrity, manufacturability, and cost when working with IT-988G-based PCB designs.

Request a quote or schedule a technical consultation to start your project today.

  • IT-988G multilayer PCB fabrication
  • IT-988G PCB stackup consulting
  • Turnkey PCB assembly with IT-988G

Related Post

Explore more related materials information.

Get a Quick Quote

Partner with Highleap Electronic for your project!

Get Detailed Files

Leave your email address and get a datasheet.