IT-988G PCB Laminate for High-Speed, RF & 5G Designs
Explore IT-988G high-speed PCB laminate for RF, 5G, and AI hardware. Highleap offers fabrication, stackup review, and turnkey assembly for IT-988G boards.
IT-988G High-Speed, Low-Loss PCB Laminate for Advanced Signal Integrity
IT-988G is a high-performance, ultra-low-loss PCB laminate developed by ITEQ for demanding high-speed and high-frequency applications. With a stable dielectric constant (Dk) of 3.63 and a consistently low dissipation factor (Df) of 0.0029 across frequencies up to 20 GHz, IT-988G is ideally suited for applications that require exceptional signal integrity, thermal stability, and mechanical reliability.
At Highleap Electronics, we specialize in the fabrication and assembly of multilayer PCBs using advanced materials like IT-988G. Our engineering team is experienced in managing the unique characteristics of this material, ensuring clean signal routing, controlled impedance, and layer integrity even in dense HDI builds.
- IT-988G high-speed PCB laminate
- Low-loss PCB substrate for signal integrity
- ITEQ IT-988G PCB stackup fabrication
Technical Performance of IT-988G Laminates
The following IPC-standard test data highlights IT-988G’s suitability for high-frequency PCB builds and thermal-critical applications.
| Item | Typical Value | Unit | IPC TM‑650 Method |
|---|---|---|---|
| Peel Strength – 0.5 oz very‑low‑roughness Cu | 2.9 – 3.1 | PLI | 2.4.8 |
| Volume Resistivity | TBD | MΩ·cm | 2.5.17.1 |
| Surface Resistivity | TBD | MΩ | 2.5.17.1 |
| Moisture Absorption (max.) | 0.31 | % | 2.6.2.1 |
| Permittivity (Dk, 53 % resin) A. 1 GHz / 2 GHz B. 5 GHz / 10 GHz C. 15 GHz / 20 GHz |
3.63 / 3.63 3.63 / 3.63 3.63 / 3.63 |
— | 2.5.5.13 |
| Loss Tangent (Df, 53 % resin) A. 1 GHz / 2 GHz B. 5 GHz / 10 GHz C. 15 GHz / 20 GHz |
0.0029 / 0.0029 0.0029 / 0.0029 0.0029 / 0.0029 |
— | 2.5.5.13 |
| Flexural Strength – Length | TBD | N/mm² | 2.4.4 |
| Flexural Strength – Cross | TBD | N/mm² | 2.4.4 |
| Thermal Stress 288 °C 10 s – Unetched | Pass | Rating | 2.4.13.1 |
| Thermal Stress 288 °C 10 s – Etched | Pass | Rating | 2.4.13.1 |
| Flammability | TBD | UL 94 | — |
| Glass Transition Temperature (Tg) A. TMA B. DSC C. DMA |
190 190 205 |
°C | 2.4.25 |
| Decomposition Temperature (5 % wt loss) | 405 | °C | 2.4.24.6 |
| X/Y Axis CTE (40–125 °C) | 15 / 16 | ppm/°C | 2.4.24 |
| Z‑Axis CTE A. Alpha 1 B. Alpha 2 C. 50–260 °C Expansion |
58 325 2.95 % |
ppm/°C ppm/°C % |
2.4.24 |
| Thermal Resistance A. T260 B. T288 C. T300 |
> 120 > 120 > 120 |
min | 2.4.24.1 |
NOTE
- The data and fabrication guidelines above are provided as a reference for PCB designers and manufacturers. While all information is based on industry-standard testing, actual performance may vary depending on materials, processes, and production conditions. Final product specifications should always be verified in accordance with the agreement between ITEQ and the end user. ITEQ reserves the right to revise specifications without prior notice.
- Highleap Electronics is a full-service PCB manufacturer and assembler, supporting both prototyping and high-volume production. We work with a broad range of high-frequency materials — including but not limited to IT-968 SE and IT-988G — and have extensive experience building reliable, high-speed and RF multilayer stackups.
- If your project requires stackup consulting, material selection advice, or impedance/tolerance guidance for IT-968 SE, IT-988G, or similar substrates, our engineering team is here to assist. Contact us to discuss how we can support your next high-performance PCB build.
Applications of IT-988G Laminate
Thanks to its excellent electrical properties and thermal reliability, IT-988G is widely adopted in the following sectors:
- 800G / 400G Ethernet routers and network backplanes
- AI accelerator cards and high-speed computing modules
- Automotive radar, LiDAR and ADAS control units
- 5G mmWave antennas, baseband units and RF front ends
- High-density defense/aerospace digital systems
IT-988G’s low Z-axis expansion and glass transition temperature of 190°C (TMA/DSC) make it particularly suitable for dense via structures and complex multilayer stackups. It enables low-loss transmission lines, reduced skew, and stable performance across temperature cycles.
- High-speed network PCB with IT-988G
- IT-988G laminate for automotive radar
- RF PCB manufacturing using ITEQ IT-988G
Request a Quote or Engineering Support
Whether you’re working on a prototype or preparing for volume production, Highleap Electronics can support your full PCB lifecycle using IT-988G and other high-frequency materials. We offer:
- Free DFM reviews and stackup planning for IT-988G multilayer PCBs
- Impedance modeling and Dk simulation across 1–20 GHz
- Turnkey PCB assembly including SMT stencil, BOM sourcing, and programming
- Proven experience with IT-988G for high-layer-count, HDI, and RF builds
Looking for better lead time or material optimization? We provide tailored consultation to help you balance signal integrity, manufacturability, and cost when working with IT-988G-based PCB designs.
Request a quote or schedule a technical consultation to start your project today.
- IT-988G multilayer PCB fabrication
- IT-988G PCB stackup consulting
- Turnkey PCB assembly with IT-988G
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