TU-747T PCB for HDI and Multilayer PCBs
Highleap Electronics provides HDI and multilayer PCB manufacturing and assembly services for customer designs specifying TU-747T halogen-free laminate. Material requirements, stack-up, fabrication details, and assembly needs are reviewed according to each project before production.
TU-747T for Halogen-Free Multilayer and HDI PCB Designs
TU-747T is a halogen-free PCB laminate from Taiwan Union Technology Corporation (TUC), with TU-747P T used as the corresponding prepreg. The material may be specified for conventional multilayer PCBs and HDI designs involving sequential lamination.
For PCB manufacturing projects, the material designation should be considered together with the complete board construction, including layer count, copper thickness, via structure, lamination sequence, finished board thickness, and assembly requirements. Highleap Electronics manufactures and assembles PCBs according to customer-approved material and design specifications; we do not manufacture TU-747T laminate or prepreg.
Material Characteristics Relevant to PCB Design
- Halogen-, antimony-, and red-phosphorus-free material system
- Low Z-axis thermal expansion for multilayer PCB construction
- CAF resistance for applicable PCB reliability requirements
- Applicable to multilayer and HDI sequential-lamination designs
- Compatible with UV/AOI and black or brown oxide PCB processes
Typical PCB Application Areas
- Multilayer and HDI PCB designs
- Notebook, PC, and consumer electronics
- Server and workstation electronics
- Mobile communication equipment
TU-747T Technical Properties Overview
| Property | Typical Value | Test Condition | SPEC |
|---|---|---|---|
| Tg (TMA) | 150 °C | E-2/105+des | N/A |
| Td (TGA) | 380 °C | E-2/105+des | > 325 °C |
| CTE x-axis | 11–15 ppm/°C | Ambient to Tg | N/A |
| CTE y-axis | 11–15 ppm/°C | Ambient to Tg | N/A |
| CTE z-axis | 2.9% | 50 to 260°C | < 3.5% |
| Thermal Stress, Solder Float, 288 °C | > 60 sec | A | > 10 sec |
| T-260 | > 60 min | E-2/105+des | > 30 min |
| T-288 | > 60 min | E-2/105+des | > 5 min |
| Flammability | 94V-0 | E-24/125+des | 94V-0 |
| Permittivity (1GHz) | 3.8 / 3.6 | C-24/23/50 | < 5.4 |
| Loss Tangent (1GHz) | 0.014 / 0.012 | C-24/23/50 | < 0.035 |
| Volume Resistivity | > 10¹ⰠMΩ·cm | C-96/35/90 | > 10ⶠMΩ·cm |
| Surface Resistivity | > 10⸠MΩ | C-96/35/90 | > 10ⴠMΩ |
| Flexural Strength (Lengthwise) | > 60,000 psi | A | > 60,000 psi |
| Flexural Strength (Crosswise) | > 50,000 psi | A | > 50,000 psi |
| Peel Strength (1.0 oz. Cu) | 8–11 lb/in | A | > 4 lb/in |
| Bow and Twist (0.020–0.031 in) | < 0.8% | A | Max 1.5 |
| Bow and Twist (0.032–0.065 in) | < 0.8% | A | Max 1.0 |
| Bow and Twist (> 0.066 in) | < 0.8% | A | Max 1.0 |
| Water Absorption | 0.12% | E-1/105+des+D-24/23 | < 0.8% |
NOTE
- The values above are provided as general reference information for PCB project evaluation. Final requirements should be confirmed according to the selected material specification and PCB design.
- TU-747T laminate and prepreg are manufactured by Taiwan Union Technology Corporation (TUC). Material grades, available constructions, and technical documentation are subject to the manufacturer’s current information.
- Highleap Electronics provides PCB fabrication and PCB assembly services based on customer-specified materials, drawings, stack-ups, and production requirements. We do not manufacture TU-747T laminate or prepreg.
Regulatory Compliance and Process Compatibility
Developed by Taiwan Union Technology Corporation (TUC), TU-747T is engineered to meet modern environmental standards without requiring changes to standard FR-4 fabrication processes. As a certified distributor and engineering partner, Highleap Electronics helps customers integrate TU-747T into mass production with minimal risk and maximum compatibility.
Meets Global Environmental Standards
- Free of halogen elements (Br, Cl), antimony, and red phosphorus
- Passes IEC 61249-2-21, RoHS 2.0, and REACH SVHC requirements
- Certified to UL 94V-0, with a UL file number E189572
- Safe for global exports and compliant with EU and Japan green product directives
Drop-in Compatible with FR-4 Fabrication Lines
- No need to adjust lamination, drilling, or surface treatment processes
- Works with standard UV/AOI, OSP, ENIG, and lead-free soldering
- Available in multiple glass styles (e.g., 106, 1080, 2116, 7628) and thicknesses (0.05 mm–1.58 mm)
- Supports both roll and panel formats for flexible fabrication setups
PCB Engineering Considerations for Designs Specifying TU-747T
When TU-747T is specified for a multilayer or HDI PCB project, the material requirement should be reviewed together with the complete board construction. Layer count, dielectric thickness, copper weight, via structure, sequential lamination, controlled impedance, and assembly requirements all influence how the PCB is prepared for production.
TU-747T may be specified in PCB designs for consumer electronics, communication equipment, controller boards, and other multilayer or HDI applications. The final PCB construction should be based on the approved stack-up, fabrication drawing, material callout, and applicable project requirements rather than on the laminate designation alone.
Highleap Electronics supports these projects from a PCB manufacturing perspective. Our engineering team can review stack-up feasibility, core and prepreg arrangement, copper construction, drilling and via requirements, impedance structures, and assembly interfaces before production. Material specifications and available constructions are confirmed according to the customer-approved requirements and current manufacturer documentation.