IT-180A High-Tg PCB Laminate by ITEQ
Reliable multilayer PCB manufacturing with IT-180A. RoHS-compliant, high Tg, and suitable for harsh operating environments.
IT-180A and Other FR4 Materials We Support
At Highleap Electronics, we fabricate multilayer PCBs using a broad range of standard and high-Tg FR4 laminates from leading suppliers. Our production lines are optimized for materials such as IT-180A, S1000H, KB-6165F, TU-768, and Isola 370HR, enabling us to meet diverse thermal and electrical requirements across industries.
In addition to IT-180A, we regularly process materials from ITEQ, Shengyi, Isola, TUC, Panasonic, Rogers, and more. Whether for cost-sensitive commercial boards or performance-critical automotive and telecom applications, we ensure consistent quality across different stack-ups and specifications.
✔ Supports customer-specified and customer-supplied materials
✔ Certified workflows for lead-free reflow and high-reliability builds
✔ Flexible integration with a wide laminate portfolio
ITEQ Laminate / Prepreg: IT-180ATC / IT-180ABS
| Property | Thickness < 0.50 mm [0.0197 in] | Thickness ≥ 0.50 mm [0.0197 in] | Units | Test Method | ||
|---|---|---|---|---|---|---|
| Typical Value | Spec | Typical Value | Spec | |||
| Peel Strength, minimum A. Low profile copper foil…>17 µm [0.669 mil] |
0.88 (5.0) | 0.70 (4.00) | 0.88 (5.0) | 0.70 (4.00) | N/mm (lb/in) | 2.4.8 |
| B. Standard profile copper foil – 1. After Thermal Stress | 1.23 (7.0) | 0.80 (4.57) | 1.40 (8.0) | 1.05 (6.00) | 2.4.8.2 | |
| 2. At 125 °C [257 °F] | 1.05 (6.0) | 0.70 (4.00) | 1.23 (7.0) | 0.70 (4.57) | 2.4.8.3 | |
| 3. After Process Solutions | 1.05 (6.0) | 0.55 (3.14) | 1.23 (7.0) | 0.80 (4.57) | ||
| Volume Resistivity, minimum A. C-96/35/90 |
3.0×1010 | — | 3.0×1010 | 1.0×106 | Ω·cm | 2.5.17.1 |
| B. After moisture resistance | — | — | 1.0×1010 | 1.0×103 | ||
| C. At elevated temperature E-24/125 | 5.0×1010 | — | — | — | ||
| Surface Resistivity, minimum A. C-96/35/90 |
3.0×1010 | — | 3.0×1010 | 1.0×104 | Ω | 2.5.17.1 |
| B. After moisture resistance | — | — | 4.0×1010 | 1.0×103 | ||
| C. At elevated temperature E-24/125 | 4.0×1010 | — | — | — | ||
| Moisture Absorption, maximum | — | 0.12 | — | 0.80 | % | 2.6.2.1 |
| Dielectric Breakdown, minimum | — | 60 | — | 40 | kV | 2.5.6 |
| Permittivity (Dk, 50% resin content) (Laminate & Prepreg) A. 1 MHz |
4.4 | 5.4 | 4.4 | 5.4 | – | 2.5.5.9 |
| B. 1 GHz | 4.4 | – | 4.4 | – | – | 2.5.5.13 |
| C. 2 GHz | 4.2 | – | 4.3 | – | – | |
| D. 5 GHz | 4.1 | – | 4.1 | – | – | |
| E. 10 GHz | 4.0 | – | 4.1 | – | – | |
| Loss Tangent (Df, 50% resin content) (Laminate & Prepreg) A. 1 MHz |
0.015 | – | 0.014 | – | – | 2.5.5.9 |
| B. 1 GHz | 0.015 | 0.035 | 0.015 | 0.035 | – | 2.5.5.13 |
| C. 2 GHz | 0.015 | – | 0.015 | – | – | |
| D. 5 GHz | 0.016 | – | 0.016 | – | – | |
| E. 10 GHz | 0.017 | – | 0.016 | – | – | |
| Flexural Strength, minimum A. Length direction |
— | — | 580 (84 300) | 415 (60 190) | N/mm² (lb/in²) | 2.4.4 |
| B. Cross direction | — | — | 450 (65 400) | 345 (50 140) | ||
| Arc Resistance, minimum | 125 | 60 | 125 | 60 | s | 2.5.1 |
| Thermal Stress 10 s at 288 °C [550.4 °F], minimum A. Unetched |
Pass | Pass Visual | Pass | Pass Visual | Rating | 2.4.13.1 |
| B. Etched | Pass | Pass Visual | Pass | Pass Visual | ||
| Electric Strength, minimum (Laminate & Prepreg) |
45 | 30 | — | — | kV/mm | 2.5.6.2 |
| Flammability (Laminate & Prepreg) |
V-0 | V-0 | V-0 | V-0 | Rating | UL94 |
| Glass Transition Temperature (DSC) | 175 | 170 minimum | 175 | 170 minimum | °C | 2.4.25 |
| Decomposition Temperature (5% wt loss) | — | — | 345 | 340 minimum | °C | 2.4.24.6 |
| X/Y Axis CTE (40 °C to 125 °C) | — | — | 10–13 | — | ppm/°C | 2.4.24 |
| Z-Axis CTE A. Alpha 1 |
— | — | 45 | 60 maximum | ppm/°C | 2.4.24 |
| B. Alpha 2 | — | — | 210 | 300 maximum | ppm/°C | 2.4.24 |
| C. 50 to 260 °C | — | — | 2.7 | 3.0 maximum | % | 2.4.24 |
| Thermal Resistance A. T260 |
— | — | >60 | 30 minimum | Minutes | 2.4.24.1 |
| B. T288 | — | — | >30 | 15 minimum | Minutes | |
| CAF Resistance | — | — | Pass | AABUS | Pass/Fail | 2.6.25 |
| Comparative Tracking Index (CTI) | — | — | 175–250 V | — | V | UL-746 |
The technical data and fabrication guidelines provided above are intended for reference by designers and PCB manufacturers. While we strive to ensure the accuracy and reliability of this information, variations may occur depending on testing methods, equipment, and specific application conditions. Final product specifications shall be defined by the official agreement between ITEQ and its customers. ITEQ reserves the right to update this information without prior notice, aiming to provide the most accurate and helpful data to users.
If you have any questions or need further assistance regarding material selection or PCB production, please feel free to contact Highleap Electronics. We’re here to support your project every step of the way.
End Markets Served by IT-180A-Based PCBs
IT-180A is not only a technically capable material—it is also proven and trusted in the real-world production of PCBs across multiple industries that require stable, long-term electrical and thermal performance. At Highleap Electronics, we apply IT-180A to build PCB assemblies that meet stringent functional and environmental standards demanded by leading global customers.
Its balanced performance and manufacturability make IT-180A a preferred material in:
• Automotive electronics — from on-board chargers to powertrain controllers, where elevated temperature cycling and CAF resistance are crucial
• Enterprise computing and storage — high-layer PCBs used in server mainboards, memory modules, and backplanes benefit from the material’s low z-axis expansion
• Telecom infrastructure — RF front ends and high-speed interface cards rely on dielectric stability and robust solder joint reliability
• Heavy-duty industrial systems — such as robotics control, motor drives, and PLCs, requiring thermal and mechanical endurance over time
With a growing number of OEMs standardizing on IT-180A for performance consistency across global builds, we help ensure that every PCB meets the expectations of its intended environment—from automotive under-the-hood to 5G edge nodes.
✔ Selected by design teams for predictable in-field behavior
✔ Enables design reuse across product platforms without material requalification
✔ Supported by global laminate availability and documentation
Certified Quality and Global Engineering Support
With manufacturing rooted in IPC Class 2/3 workflows and end-to-end digital traceability, Highleap Electronics ensures that every IT-180A-based PCB meets strict quality benchmarks for consistency, safety, and global compliance. From incoming laminate inspection to electrical test and final AOI, all processes are controlled under ISO 9001 and IATF 16949 quality systems.
We understand that our customers—especially those in automotive, telecom, and industrial sectors—need more than just certified boards. They require real-time feedback on stackup feasibility, controlled impedance modeling, material lead time, and thermal simulation support. That’s why our in-house engineering team provides DFM reviews, stackup optimization, and build verification tailored to your design rules and reliability targets.
Each shipment includes full documentation, such as electrical test reports, MSDS, RoHS/REACH compliance declarations, and material COC. For OEMs, Tier 1s, and global EMS providers, we also offer regional technical support and lifecycle change notices, helping you reduce onboarding time, qualify faster, and scale confidently.
Global technical support and engineering feedback
Certified to ISO 9001 / IATF 16949 / UL 94 V-0 / IPC-4101C
Test reports, compliance docs, and full batch traceability
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