High-Performance Flexible PCB Material – DuPont™ Pyralux® AP
Explore DuPont™ Pyralux® AP, a top-tier adhesiveless polyimide laminate ideal for flexible and rigid-flex PCB manufacturing. Supported by Highleap Electronics.
DuPont™ Pyralux® AP Flexible Laminate
Pyralux® AP is a high-performance, all-polyimide flexible copper clad laminate designed for
multilayer flexible circuits and rigid-flex PCB applications. With no adhesive layer and excellent thermal and dimensional stability, Pyralux® AP meets the strict demands of high-reliability electronic environments.
- Excellent dimensional and thermal stability under extreme conditions
- Ideal for multilayer flex and rigid-flex PCB applications
- UL 94V-0 certified and IPC 4204/11 compliant
- Wide range of copper and dielectric thickness combinations available
This material is widely used in automotive electronics, medical devices, aerospace systems, and 5G communication equipment.
Pyralux®
AP Product Offerings
| Product Code | Dielectric Thickness (mil) | Copper Thickness (oz/ft²) |
|---|---|---|
| AP 7163E | 1.0 | 0.25 |
| AP 7164E | 1.0 | 0.33 |
| AP 8515R | 1.0 | 0.5 |
| AP 9111R | 1.0 | 1.0 |
| AP 7156E | 2.0 | 0.25 |
| AP 7125E | 2.0 | 0.33 |
| AP 8515E | 1.0 | 0.5 |
| AP 8525R | 2.0 | 0.5 |
| AP 9121R | 2.0 | 1.0 |
| AP 9222R | 2.0 | 2.0 |
| AP 8535R | 3.0 | 0.5 |
| AP 9131R | 3.0 | 1.0 |
| AP 9232R | 3.0 | 2.0 |
| AP 8545R | 4.0 | 0.5 |
| AP 9141R | 4.0 | 1.0 |
| AP 9242R | 4.0 | 2.0 |
| Laminate Property | IPC TM-650 (* or other) | AP-9111 1 mil dielectric |
AP-9121 2 mil dielectric |
AP-9131–9161 3–6 mil dielectric |
|---|---|---|---|---|
| Adhesion to Cu (Peel Strength) As fabricated, N/mm (lb/in) After solder, N/mm (lb/in) |
Method 2.4.9 | 1.6 (9) | >1.8 (10) | >1.8 (10) |
| 1.6 (9) | >1.8 (10) | >1.8 (10) | ||
| Solder Float at 288°C (550°F) | Method 2.4.13 | Pass | Pass | Pass |
| Dimensional Stability Method B, % Method C, % |
Method 2.2.4 | –.04 to –.08 –.05 to –.08 |
–.04 to –.08 –.04 to –.07 |
–.03 to –.06 –.03 to –.06 |
| Dielectric Thickness Tolerance, % | Method 4.6.2 | ±10 | ±10 | ±10 |
| UL Flammability Rating | *UL-94 | V-0 | V-0 | V-0 |
| Dielectric Constant*, 1 MHz | Method 2.5.5.3 | 3.4 | 3.4 | 3.4 |
| Dissipation Factor*, 1 MHz | Method 2.5.5.3 | 0.003 | 0.002 | 0.002 |
| Dielectric Strength, kV/mil | Method 2.5.6.1 | 6–7 | 6–7 | 6–7 |
| Volume Resistivity, ohm-cm | Method 2.5.17.1 | E16 | E17 | E17 |
| Surface Resistance, ohms | Method 2.5.17.1 | >E16 | >E16 | >E16 |
| Moisture and Insulation Res., ohms | Method 2.6.3.2 | E11 | E11 | E11 |
| Moisture Absorption, % | Method 2.6.2 | 0.8 | 0.8 | 0.8 |
| Tensile Strength, MPa (kpsi) | Method 2.4.19 | >345 (>50) | >345 (>50) | >345 (>50) |
| Elongation, % | Method 2.4.19 | >50 | >50 | >50 |
| Inititation Tear Strength, g | Method 2.4.16 | 700–1000 | 900–1200 | 900–1200 |
| Propagation Tear Strength, g | Method 2.4.17.1 | >10 | >20 | >20 |
| Chemical Resistance, min. % | Method 2.3.2 | Pass, >95% | Pass, >95% | Pass, >95% |
| Solderability | *IPC-S-804, M. 1 | Pass | Pass | Pass |
| Flexural Endurance, min. cycles | Method 2.4.3 | 6000 | 6000 | 6000 |
| Glass Transition (Tg), °C | — | 220 | 220 | 220 |
| Modulus, kpsi | — | 700 | 700 | 700 |
| In-Plane CTE (ppm/°C) T<Tg | — | 25 | 25 | 25 |
| In-Plane CTE (ppm/°C) T>Tg | — | 40 (est.) | 40 (est.) | 40 (est.) |
NOTE:
- All data above are based on DuPont™ Pyralux® AP technical specifications.
- If you need the official PDF datasheet or further assistance, please feel free to.
Key Benefits & Applications of Pyralux® AP
Pyralux® AP delivers industry-leading performance for designers and manufacturers of flexible PCBs. It offers consistent electrical properties and superior thermal reliability for critical applications.
Main Advantages:
- Low Coefficient of Thermal Expansion (CTE) – perfect for rigid-flex multilayers
- High adhesion between copper and polyimide for robust circuit integrity
- Excellent dielectric thickness control for controlled impedance designs
- Stable performance in harsh environments: high humidity, thermal cycling, and chemical exposure
Application Fields:
- Medical diagnostic equipment (e.g., imaging systems, wearables)
- Defense and aerospace electronics (satellite systems, avionics)
- High-speed telecommunication systems and 5G antennas
- Automotive ECUs, sensors, and in-cabin electronic controls
Flexible PCB Manufacturing & Assembly Using Pyralux® AP – Powered by Highleap Electronics
Highleap Electronics offers end-to-end manufacturing solutions for flexible and rigid-flex PCBs, fully supporting DuPont™ Pyralux® AP and other high-performance polyimide laminates, trusted across aerospace, medical, and telecom sectors.This adhesiveless, high-performance material ensures exceptional reliability and stability across demanding electronic applications.
Our production facilities are fully equipped for multilayer flex circuits and high-density interconnects (HDI), with Pyralux® AP performing exceptionally well in:
- Laser and mechanical drilling (including PTH-ready copper bonding)
- Coverlay lamination and chemical desmear compatibility
- Stable dielectric properties across temperature and humidity changes
- Precision multilayer stackup for impedance-controlled flexible circuits
With over 15 years of experience, Highleap delivers one-stop flex PCB prototyping to volume production, combining material expertise and advanced equipment to meet the highest IPC standards.
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