Panasonic Felios® FCCL – Flexible Copper Clad Laminate for High-Density FPC
Panasonic Felios® FCCL (R-F775/R-F775S) for high-density FPCs. Ideal for mobile, automotive, HDI & flexible circuits. Highleap Electronics.
What Is Felios® FCCL and Why Choose It for Flexible PCB Manufacturing?
Felios® Series is a high-performance Flexible Copper Clad Laminate (FCCL) developed by Panasonic. These materials combine polyimide base films with high-quality adhesive and rolled copper foil to form reliable three-layer laminates used in flexible printed circuit boards (FPC). Known for their exceptional mechanical flexibility, thermal stability, and electrical performance, Felios® FCCLs are ideal for a wide range of advanced PCB applications, such as smartphones, digital cameras, automotive electronics, HDI modules, and wearable devices.
Felios® materials, including models like R-F775, R-F775S, R-F800, and R-F731, are specifically engineered to support modern device requirements, offering excellent peel strength, thermal reliability, and superior electrical performance. They are designed for high-density interconnects (HDI), laser drilling, and multilayer stack-ups, making them perfect for applications that demand precision and durability. The resilience of these materials, especially in areas of repeated bending and flexing, makes them ideal for foldable mobile devices and wearable electronics.
At Highleap Electronics, we utilize Panasonic Felios® FCCLs in our flex and rigid-flex PCB production lines, ensuring each board delivers unmatched mechanical flexibility and electrical performance. By choosing Felios® FCCLs, you can expect enhanced product reliability, improved signal integrity, and longer product lifespan. Whether you’re designing for high-frequency applications, mobile devices, or automotive electronics, Felios® materials provide the highest quality and performance in flexible and rigid-flex PCBs.
Felios® FCCL Technical Specifications
Panasonic Felios® FCCLs are available in several formulations to meet diverse application requirements. Below is a comparison of key models commonly used in flexible PCB manufacturing:
| Model | Base Film | Copper Foil | Adhesive Type | Total Thickness | Key Features |
|---|---|---|---|---|---|
| R-F775 | Polyimide (12µm) | Rolled Cu (18µm) | Standard adhesive | 43µm | General-purpose, high peel strength |
| R-F775S | Polyimide (12µm) | Rolled Cu (9–18µm) | Low-CTE adhesive | 38–43µm | Laser via compatible, stable bonding |
| R-F800 | Polyimide (12µm) | Rolled Cu (9µm) | High-heat adhesive | ~40µm | Automotive/high-temp performance |
| R-F731 | Polyimide (12µm) | Rolled Cu (12µm) | Halogen-free adhesive | ~45µm | RoHS/REACH-compliant, low toxicity |
| R-F600 | Polyimide (7–12µm) | Rolled Cu (9µm) | Ultra-flexible adhesive | ~30µm | Dynamic bending, wearables |
Detailed Material Properties: Panasonic R-5375
Panasonic R-5375 is a Felios®-compatible high-performance FCCL designed for 5G, high-frequency communications, and complex multilayer PCB applications. Below are its typical electrical, thermal, and mechanical characteristics:
| Item | Performance Characteristics |
|---|---|
| Tg (TMA) | 210°C |
| Tg (DMA) | 250°C |
| Thermal Decomposition (Td) | 435°C |
| T288 (Without Cu) | > 120 min |
| T288 (With Cu) | > 120 min |
| CTE-Y < Tg | 14–16 ppm/°C |
| CTE-Z < Tg | 39 ppm/°C |
| CTE α2 Z-axis (IPC-TM-650) | 200 ppm/°C |
| Thermal Conductivity | 0.37 W/m·K |
| Volume Resistivity | 1 × 10⁹ MΩ·cm |
| Surface Resistivity | 1 × 10⁸ MΩ |
| Dielectric Constant (Dk) @ 1GHz | 3.4 |
| Dielectric Constant (Dk) @ 12GHz | 3.4 |
| Dissipation Factor (Df) @ 1GHz | 0.001 |
| Dissipation Factor (Df) @ 12GHz | 0.003 |
| Water Absorption | 0.23% |
| Peel Strength (1oz Cu) | 0.6 kN/m (Cu: H-VLP2) |
| Flammability | 94V-0 Equivalent |
| Sample Thickness | 0.75 mm |
Note: Technical values above are based on Panasonic R-5375 datasheet and may vary slightly depending on processing and final layer structure. Contact Highleap Electronics for engineering support or stack-up customization.
Highleap’s Manufacturing Capabilities for Felios®-Based Flexible PCBs
With extensive experience in flexible circuit fabrication, Highleap Electronics is equipped to handle the full range of Panasonic Felios® FCCLs—including standard, halogen-free, and high-temperature series. Our production lines are designed to support fine-line imaging, copper foil lamination, laser drilling, and precise adhesive bonding with high consistency.
We maintain a robust supply of Felios® materials such as R-F775, R-F775S, R-F800, and R-F731, and apply strict material handling protocols to preserve surface cleanliness and adhesion strength throughout the process.
- Advanced lamination control for three-layer FCCL processing (PI + adhesive + rolled Cu)
- High-accuracy UV/CO2 laser drilling for via creation and pad openings
- Professional stack-up engineering with flexible dielectric control
- Automatic optical inspection (AOI) and electrical test coverage for every lot
- IPC Class 2/3 certified production environment for demanding applications
Whether you’re building multilayer FPCs, rigid-flex boards, or ultra-thin flex modules, our factory ensures tight control over every manufacturing step—resulting in stable yield, clean etching, and reliable performance in end-use devices.
Get a Quote for Felios®-Based Flexible PCB Manufacturing
Looking for a reliable partner to manufacture flexible circuits using Panasonic Felios® FCCL? Highleap Electronics provides engineering support, rapid prototyping, and high-volume PCB assembly tailored to your specific design and performance requirements.
We support a wide range of applications—from compact mobile modules to wearable electronics and automotive-grade flex PCBs. Whether you need single-layer FPC, multilayer stacked structures, or rigid-flex boards using Felios® laminates, our certified factory is ready to deliver.
- Custom stack-up design based on Felios® series (e.g., R-F775, R-F800, R-F731)
- Laser via, stiffener bonding, SMT assembly, and final PCBA testing
- Fast prototyping from 3–5 days, no minimum order quantity (MOQ = 0)
- Free engineering review – upload your Gerber or drawing for DFM check
- Serving global customers from our China-based production facility
📩 Contact us today to request a quote, ask for a material suggestion, or get technical guidance on Felios®-based PCB manufacturing. Let Highleap help you turn your flexible circuit ideas into high-reliability finished boards—fast and worry-free.
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