High-CTI PCB Manufacturing for Projects Using S1600L

S1600L is a high-CTI PCB laminate from Shengyi Technology, with CTI ≥600 V and a typical Tg of 150°C. Highleap Electronics provides PCB fabrication and assembly services for projects involving S1600L, with support for multilayer PCB production, engineering review, inspection, and testing.

S1600L for High-CTI PCB Manufacturing Applications

S1600L is a PCB laminate manufactured by Shengyi Technology with a CTI rating of ≥600 V, lower Z-axis thermal expansion, and Anti-CAF characteristics. It may be referenced in PCB designs where tracking resistance and defined electrical insulation requirements are important.

Highleap Electronics manufactures and assembles PCBs based on customer-approved drawings, stack-ups, material requirements, and production documentation. We do not manufacture S1600L laminate. For projects involving this material, our engineering work focuses on the complete PCB construction, including copper thickness, layer structure, hole design, creepage and clearance requirements, surface finish, and assembly interfaces.

Our PCB manufacturing capabilities cover multilayer boards, controlled-impedance designs, blind and buried vias, sequential lamination, heavy-copper constructions, and surface finishes such as ENIG, OSP, ImAg, and lead-free HASL. PCB fabrication can also be coordinated with SMT/THT assembly, component sourcing, inspection, and testing when required.

Typical PCB Project Areas

• Power and control circuit boards
• Automotive electronic PCBs
• Display and consumer electronic boards
• Multilayer PCBs with defined insulation requirements
• PCB designs requiring high CTI material characteristics

Material properties and available constructions should be confirmed against the manufacturer’s current technical documentation, while the finished PCB requirements are determined by the complete board design and production specification.

S1600L Electrical, Thermal, and Mechanical Performance

NOTE

1. Unless otherwise noted, the reference values above correspond to 1.6 mm test specimens; Tg data apply to specimens with a thickness of 0.50 mm or greater.
2. The values shown are intended for preliminary PCB engineering reference. Current S1600L material properties, test data, and related technical documentation should be confirmed with Shengyi Technology.
3. Highleap Electronics manufactures and assembles PCBs. Our engineering support covers PCB stack-up review, DFM, impedance requirements, fabrication feasibility, assembly planning, and other board-level production requirements.

Why S1600L Is Becoming the Go-To Choice for Appliance and Power Supply PCBs

Designers and engineers are increasingly turning to S1600L for one clear reason: it works where others fail.

This laminate offers a rare combination of high electrical insulation, thermal resistance, and CAF suppression—all of which are essential in applications like washing machines, LED power supplies, industrial control panels, and other high-stress environments.

What sets S1600L apart?

• CTI ≥ 600V: Greatly reduces leakage risk in damp or dusty conditions

• Tg 150°C / Td 355°C: Handles repeated reflow and wave soldering with ease

• Low CTE (Z-axis 45 ppm/°C before Tg): Prevents delamination and via cracking in multilayer stacks

• Strong CAF resistance: Extends product lifespan under constant bias

• UL94 V-0 flammability rating: Safety-certified for global markets

In fast-paced factories, S1600L delivers consistent drillability, reliable plating, and clean solder masking—helping reduce scrap rates and improve production yield.

If you’re designing for high humidity, high voltage, or long lifecycle performance, S1600L is the material that makes it all possible without the headaches.

PCB Manufacturing Considerations for S1600L-Based Designs

S1600L may be used in PCB designs where high CTI, lower Z-axis thermal expansion, and Anti-CAF characteristics are relevant to the project requirements. These material characteristics form only part of the finished PCB design and should be considered together with the complete board construction.

From a PCB manufacturing perspective, Highleap Electronics focuses on how the approved material requirement is incorporated into the actual board build. Layer count, copper thickness, hole structure, finished board thickness, creepage and clearance, surface finish, and assembly conditions are reviewed according to the PCB documentation before production.

• Multilayer PCB stack-up and board thickness review
• Through-hole, blind-via, and buried-via structure evaluation
• Copper weight, spacing, creepage, and clearance requirements
• Surface finish and soldering requirements for the finished PCB
• PCB fabrication and assembly process coordination

For projects moving from prototype to volume production, fabrication requirements are maintained against the approved PCB files and production documentation. Highleap Electronics manufactures and assembles the finished PCB; S1600L laminate itself is manufactured by Shengyi Technology.