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S1141

What is S1141?

S1141 is a cost-effective FR-4 material developed by Shengyi Technology, a globally recognized manufacturer of high-performance laminates and prepreg materials for PCBs.
shenyi

Characteristics

  • Tg 140℃ (DSC)
  • UV Blocking / AOI Compatible
  • Excellent Mechanical Processability

Applications

  • Computer, Instrumentation, VCR
  • Communication Equipment
  • Electronic Game Machine
  • Not suitable for Anti-CAF application
  • Not suitable for＞2OZ heavy copper, HDI and ≥ 12L high layer count application.

S1141 General Properties

   
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC degree Celsius 140
Td IPC-TM-650 2.4.24.6 5% wt. loss degree Celsius 310
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/ degree Celsius 65
After Tg ppm/ degree Celsius 300
50-260 degree Celsius % 4.5
T260 IPC-TM-650 2.4.24.1 TMA min 15
T288 IPC-TM-650 2.4.24.1 TMA min 2
Thermal Stress IPC-TM-650 2.4.13.1 288 degree Celsius, solder dip -- 60S No Delamination
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 5.2E + 08
E-24/125 MΩ.cm 5.2E + 06
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ 5.4E + 07
E-24/125 MΩ 5.6E + 06
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 120
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 60
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.6
IEC 61189-2-721 10GHz -- 0.015
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.015
IEC 61189-2-721 10GHz -- 0.015
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm -
After thermal Stress 288 degree Celsius,10s N/mm 1.8
125 degree Celsius N/mm 1.6
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 600
CW IPC-TM-650 2.4.4 A MPa 500
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.15
CTI IEC60112 A Rating PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

Remarks

    1. Specification sheet: lPC-4101/21, is for your reference only.
    2. All typical values are based on 1.6mm specimens, while Tg is for specimens ≥ 0.50mm.
    3. All typical values listed above are for your reference only. For detailed information, please contact Shengyi Technology Co., Ltd. All rights to this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanations: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning.
The figures following the letter symbols indicate the duration of preconditioning in hours (first digit), the preconditioning temperature in °C (second digit), and the relative humidity (third digit).

S0401 Prepreg Parameters

Glass Fabric Type Resin Content (%) Cured Thickness (mm) DK (1GHz) Df (1GHz) Standard Size (Roll Type)
106/1037 71 0.050 3.5 0.028 1.260m×150m
74
 0.060
 3.4
 0.029
76
 0.065
 3.4
 0.029
1080/1078 64 0.075 3.7 0.024 1.260m×300m
68 0.090 3.6 0.027
2313 55 0.103 3.9 0.020
2116 50 0.114 4.0 0.018 1.260m×250m
52 0.120 4.0 0.019
55 0.129 3.9 0.020
58 0.140 3.8 0.022
1506 42 0.150 4.2 0.014 1.260m×150m
45 0.160 4.1 0.015
48 0.175 4.0 0.017
7628 43 0.200 4.2 0.014
45 0.205 4.1 0.015
48 0.220 4.0 0.017
50 0.230 4.0 0.018

Remarks

  1. DK and Dfare tested according to IPC TM-650 2.5.5.9
  2. Prepreg type, resin content and size could be available upon request.

Hot Pressing Cycle

  • Heat-up rate:1.0~2.5℃/min (80~140℃)
  • Curing time:>30min (170~180℃)
  • The hot pressing parameters are for your reference only. If you have any questions, please feel free to contact us.

Storage Conditions

  • 3 months when stored at ＜ 23℃ and ＜ 50% RH.
  • 6 months when stored at ＜ 5℃. Normalize in room temperature for at least 4h before using.
  • Beware of moisture, always keep wrapped in damp-proof material. Keeping in normal condition, prepreg might absorb moisture and its bonding strength would be weakened.
  • Avoid UV-rays and strong light.
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